Abstract
Cold spraying has been developed as a high-quality coating technique. In this article, copper is deposited on an AlN substrate coated by the sputtering of titanium and copper at a low pressure of less than 1.0 MPa, making this approach suitable for a wide range of engineering applications. In order to understand the adhesion mechanism at the atomic scale, the interfacial regions are carefully observed in thin foil samples from the cross sections of the specimens with a HREM. We find a unique wavy boundary between the sputtered titanium and the sputtered copper. It is assumed that the shear-instability phenomenon occurs due to the cold-spraying process and influences the adhesive strength. Furthermore, the cold-sprayed copper particles are connected directly without any oxidation layer due to the appearance of new metallic surfaces during the impact process. The TEM data clearly reveal the phenomena and mechanisms related to the impact of powder sprayed on the substrate.
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Nakano, H., Yamada, M., Fukumoto, M. et al. Microstructure of Interfacial Region Between Cold-Sprayed Copper Coating and AlN Substrate Coated with Sputtered Titanium and Copper. J Therm Spray Tech 20, 407–411 (2011). https://doi.org/10.1007/s11666-010-9522-z
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DOI: https://doi.org/10.1007/s11666-010-9522-z