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SU-8 Photoresist

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  • First Online:
Encyclopedia of Nanotechnology

Synonyms

Gamma-butyrolactone (GBL); Hardbake (HB); Lithographie, galvanoformung, abformung (LIGA); N-methyl-2-pyrrolidone (NMP); Polyethylene carbonate (PEC); Polymethyl methacrylate (PMMA); Polypropylene carbonate (PPC); Postexposure bake (PEB); Propylene glycol methyl ether acetate (PGMEA)

Definition

SU-8 is a high aspect ratio epoxy-based negative photoresist commonly used as structural material in lithographic fabrication.

Introduction

SU-8 was developed by IBM as a thick negative photoresist targeted to the fabrication of molds for electroplating. The epoxy-based negative photoresist has some remarkable properties. First of all, it has a wide range of coating thicknesses: layers from several hundreds of nanometers up to several hundreds of microns can be deposited by a single standard spin coating step, using the appropriate dilution of the SU-8 resin. Even thicker layers can be deposited and photopatterned successfully as will be discussed later. Second, structures featuring...

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References

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Author information

Authors and Affiliations

  1. Department ESAT-MICAS, KULeuven, Kasteelpark Arenberg 10, 02443, 3001, Leuven, Belgium

    Frederik Ceyssens & Robert Puers

Authors
  1. Frederik Ceyssens
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  2. Robert Puers
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Corresponding author

Correspondence to Frederik Ceyssens .

Editor information

Editors and Affiliations

  1. Biomimetics (NLB²), Ohio State University Nanoprobe Lab. for Bio- & Nanotechnology, Columbus, Ohio, USA

    Bharat Bhushan

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Ceyssens, F., Puers, R. (2015). SU-8 Photoresist. In: Bhushan, B. (eds) Encyclopedia of Nanotechnology. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-6178-0_360-2

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  • DOI: https://doi.org/10.1007/978-94-007-6178-0_360-2

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  • Publisher Name: Springer, Dordrecht

  • Online ISBN: 978-94-007-6178-0

  • eBook Packages: Springer Reference Chemistry and Mat. ScienceReference Module Physical and Materials ScienceReference Module Chemistry, Materials and Physics

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