SU-8 is a high aspect ratio epoxy-based negative photoresist commonly used as structural material in lithographic fabrication.
SU-8 was developed by IBM as a thick negative photoresist targeted to the fabrication of molds for electroplating. The epoxy-based negative photoresist has some remarkable properties. First of all, it has a wide range of coating thicknesses: layers from several hundreds of nanometers up to several hundreds of microns can be deposited by a single standard spin coating step, using the appropriate dilution of the SU-8 resin. Even thicker layers can be deposited and photopatterned successfully as will be discussed later. Second, structures featuring...
KeywordsSacrificial Layer Exposure Energy Carrier Wafer Propylene Glycol Methyl Ether Acetate Propylene Glycol Methyl Ether Acetate
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