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Seal Encapsulation: OLED Sealing Processes

Handbook of Organic Light-Emitting Diodes

Abstract

After several years of development, OLED has become an important display technology, evolving from passive matrix (PMOLED) to active matrix (AMOLED) and even branching out into OLED lighting. The organic layers in OLED devices are extremely thin, and most of them are based on chemically active materials, which are easily damaged by exposure to moisture or oxygen in the air. Moreover, thin metal layers used as electrodes are also very sensitive to corrosion, and the OLED performances are strongly affected also by the status and the nature of the interfaces between the different layers, making the OLED device a very complex and delicate ecosystem.

For these reasons we need to protect the OLED to prevent the organic materials from being damaged through the adoption of a dedicated process named encapsulation.

Several approaches are possible to achieve the goal; in this chapter, we briefly introduce the OLED process of seal encapsulation.

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Acknowledgments

The authors wish to thank Dr. Mauro Riva and Dr. Paolo Vacca (SAES Group) for their comments and contributions. Thanks to NEG (Nippon Electric Glass Co., Ltd.) and MORESCO Corporation for the very useful information and discussions.

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Correspondence to Stefano Tominetti .

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Tominetti, S., Gigli, J., Shih, SH., Su, YT., Jou, J.H. (2018). Seal Encapsulation: OLED Sealing Processes. In: Adachi, C., Hattori, R., Kaji, H., Tsujimura, T. (eds) Handbook of Organic Light-Emitting Diodes. Springer, Tokyo. https://doi.org/10.1007/978-4-431-55761-6_23-1

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  • DOI: https://doi.org/10.1007/978-4-431-55761-6_23-1

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  • Publisher Name: Springer, Tokyo

  • Print ISBN: 978-4-431-55761-6

  • Online ISBN: 978-4-431-55761-6

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Chapter history

  1. Latest

    Seal Encapsulation: OLED Sealing Processes
    Published:
    12 May 2018

    DOI: https://doi.org/10.1007/978-4-431-55761-6_23-2

  2. Original

    Seal Encapsulation: OLED Sealing Processes
    Published:
    30 March 2018

    DOI: https://doi.org/10.1007/978-4-431-55761-6_23-1