Encyclopedia of Continuum Mechanics

Living Edition
| Editors: Holm Altenbach, Andreas Öchsner

Application of Analytical Modeling in the Design for Reliability of Electronic Packages and Systems

  • Ephraim SuhirEmail author
Living reference work entry
DOI: https://doi.org/10.1007/978-3-662-53605-6_370-1

Definitions

Electronic packaging is a discipline within the field of materials, electrical and mechanical engineering concerned with enclosures and protective features built into the electronic devices. It comprises a wide variety of technologies. It applies both to end products and to components.

Electronic systems design deals with the multidisciplinary design issues of complex electronic devices and systems, such as mobile phones and computers. The subject covers a broad spectrum, from the design and development of an electronic system (new product development) to assuring its proper function, service life, and disposal.

Analytical Classical Mechanics and Applied Physics-Based Modeling, Its Role, and Significance

Mechanical (“physical”) performance of electronic and photonic materials, assemblies, packages, and systems is the bottleneck of the today’s electronic and photonic reliability engineering. Nothing happens to an electron or a photon. But, as we used to say at Bell Labs, “if...

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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Portland State UniversityPortlandUSA

Section editors and affiliations

  • Ephraim Suhir
    • 1
  1. 1.Departments of Mech. and Mat., and Elect. and Comp. EngineeringPortland State UniversityPortlandUSA