References
Wallis G, Pomerantz DI (1969) Field assisted glass-metal sealing. J Appl Phys 40(10):3946–3949
Obermeier E (1995) Anodic wafer bonding. Electrochem Soc Proc 95–7:212–220
Roger T, Kowal J (1995) Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors. Sens Actuator A46–47:113–120
Cao E, Gavriilidis A, Cui Z (2002) Application of microengineered reactors in chemical engineering. MST News 3(02):14–16
Acero MC, Plaza JA, Esteve J, Carmona M, Marco S, Samitier J (1997) Design of a modular micropump based on anodic bonding. J Micromech Microeng 7:179–182
Lee TMH, Lee DHY, Liaw CYN, Lao AIK, Hsing IM (2000) Detailed characterisation of anodic bonding process between glass and thin-film coated silicon substrates. Sens Actuator 86:103–107
Cozma A, Puers B (1995) Characterization of the electrostatic bonding of silicon and Pyrex glass. J Micromech Microeng 5:98–102
Shih WP, Hui CY, Tien NC (2004) Collapse of microchannels during anodic bonding: theory and experiments. J Appl Phys 95(5):2800–2808
Berthold A, Nicola L, Sarro PM, Vellekoop MJ (2000) Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers. Sens Actuator A82(1–3):224–228
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2014 Springer Science+Business Media New York
About this entry
Cite this entry
Cui, Z. (2014). Anodic Bonding. In: Li, D. (eds) Encyclopedia of Microfluidics and Nanofluidics. Springer, Boston, MA. https://doi.org/10.1007/978-3-642-27758-0_41-2
Download citation
DOI: https://doi.org/10.1007/978-3-642-27758-0_41-2
Received:
Accepted:
Published:
Publisher Name: Springer, Boston, MA
Online ISBN: 978-3-642-27758-0
eBook Packages: Springer Reference EngineeringReference Module Computer Science and Engineering