Definition
Bonding (referred to as adhesive bonding) is a joining method that joins two or more materials by applying and solidifying adhesives.
Theory and Application
Theory
The adhesive bonding is a complex physical and chemical process that creates attractive forces between the substrates (base materials) and adhesive. As shown in Fig. 1, the adhesive bonded joint consists of three areas: cohesion, transition, and adhesion zone. In the cohesion zone, cohesive forces are a result of a number of molecular forces such as intermolecular interactions, mechanical bonds, or chemical bonds within the adhesive. The transition zone is an interphase boundary layer or inter-diffusion segment with nonuniform composition formed by interacting adhesive and the substrate surface. The thickness of the transition zone differs from nanometer to millimeter ranges. In the adhesion zone, adhesive forces are determined by various chemical, mechanical, and electrical interactions at the interfaces.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Brockmann W, GeiB PL, Klingen J, Schröder B (2009) Adhesive bonding: materials, applications and technology. Wiley-VCH, Weinheim, pp 108–114
Cognard P (2006) Handbook of adhesives and sealants volume 2 – general knowledge, application of adhesives, new curing techniques. Elsevier, Amsterdam
Habenicht G (2008) Applied adhesive bonding: a practical guide for flawless results. Wiley-VCH, Weinheim
Jennings CW (1972) Surface roughness and bond strength of adhesives. J Adhes 4(1)
Lees WA (1984) Adhesives in engineering design. Springer, Berlin, pp 48–55
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2014 CIRP
About this entry
Cite this entry
Kim, T.H. (2014). Bonding. In: Laperrière, L., Reinhart, G. (eds) CIRP Encyclopedia of Production Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-20617-7_6618
Download citation
DOI: https://doi.org/10.1007/978-3-642-20617-7_6618
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-20616-0
Online ISBN: 978-3-642-20617-7
eBook Packages: EngineeringReference Module Computer Science and Engineering