Eutectic bonding is a bonding method based on the melting of a metallic intermediate layer of eutectic alloy composition which is used for chip bonding and wafer bonding.
Theory and Application
Eutectic bonding (also called eutectic solder) is a low-temperature bonding method which is used in microelectronics manufacturing for chip bonding and to connect wafer with other wafers, glass substrates, or metal housings. In microsystem technology, the method also finds application in the generation of cavities and the production of MEMS. Here it is, however, compared to direct (fusion) bonding and anodic bonding rarely used (Dziuban 2006).
The method is based on the melting of a metallic intermediate layer of eutectic alloy composition which is applied between the substrates to be joined. This layer provides an electrically and heat conductive connection after the solidification. In the specific eutectic mixing ratio, the metal layer melts at a...
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