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Material Aspects of Micro- and Nanoelectromechanical Systems

  • Reference work entry
Springer Handbook of Nanotechnology

Part of the book series: Springer Handbooks ((SHB))

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Abstract

One of the more significant technological achievements during the last 20 years has been the development of MEMS and its new offshoot, NEMS. These developments were made possible by significant advancements in the materials and processing technologies used in the fabrication of MEMS and NEMS devices. While initial developments capitalized on a mature Si infrastructure built for the integrated circuit (IC) industry, recent advances have come about using materials and processes not associated with IC fabrication, a trend that is likely to continue as new application areas emerge.

A well-rounded understanding of MEMS and NEMS technology requires a basic knowledge of the materials used to construct the devices, since material properties often govern device performance and dictate fabrication approaches. An understanding of the materials used in MEMS and NEMS involves an understanding of material systems, since such devices are rarely constructed of a single material but rather a collection of materials working in conjunction with each other to provide critical functions. It is from this perspective that the following chapter is constructed. A preview of the materials selected for inclusion in this chapter is presented in Table 10.1. It should be clear from this table that this chapter is not a summary of all materials used in MEMS and NEMS, as such a work would itself constitute a text of significant size. It does, however, present a selection of some of the more important material systems, and especially those that illustrate the importance of viewing MEMS and NEMS in terms of material systems.

Table 10.1 Distinguishing characteristics and application examples of selected materials for MEMS and NEMS
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Abbreviations

AFM:

atomic force microscopy

CMOS:

complementary metal oxide semiconductor

CVD:

chemical vapor deposition

DC:

direct current

DRIE:

deep reactive ion etching

FET:

field effect transistor

HF:

hydrofluoric acid

IC:

integrated circuit

LPCVD:

low-pressure chemical vapor deposition

MEMS:

microelectromechanical system

NEMS:

nanoelectromechanical system

PECVD:

plasma enhanced chemical vapor deposition

PMMA:

polymethylmethacrylate

PZT:

lead zirconium titanate

RF:

radio-frequency

RIE:

reactive ion etching

SEM:

scanning electron microscopy

SOG:

spin-on glass

SOI:

silicon-on-insulator

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Authors and Affiliations

  1. Department of Electrical Engineering and Computer Science, Case Western Reserve University, 10900 Euclid Avenue, 44106, Cleveland, OH, USA

    Christian Zorman Prof.

  2. Department of Electrical Engineering and Computer Science, Case Western Reserve University, 10900 Euclid Avenue, 44106, Cleveland, OH, USA

    Mehran Mehregany Prof.

Authors
  1. Christian Zorman Prof.
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  2. Mehran Mehregany Prof.
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Correspondence to Christian Zorman Prof. or Mehran Mehregany Prof. .

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Editors and Affiliations

  1. Nanotribology Laboratory for Information Storage and MEMS/NEMS (NLIM), Ohio State University, 201 W. 19th Avenue, W 390 Scott Laboratory, Ohio 43210-1142, Columbus, OH, USA

    Bharat Bhushan Prof.

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Zorman, C., Mehregany, M. (2007). Material Aspects of Micro- and Nanoelectromechanical Systems. In: Bhushan, B. (eds) Springer Handbook of Nanotechnology. Springer Handbooks. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-29857-1_10

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