Microwave Materials for Defense and Aerospace Applications

  • J. VargheseEmail author
  • N. Joseph
  • H. Jantunen
  • S. K. Behera
  • H. T. Kim
  • M. T. Sebastian
Living reference work entry


Microwave materials are fundamental building blocks for defense and aerospace applications, which have been used as dielectric resonators, radomes, multilayer packages, electromagnetic shield, and so on. These materials and devices made of them should survive in harsh environmental conditions, and hence the availability of suitable materials is limited. Microwave materials are used for signal propagation as well as shielding unwanted signals in military and aerospace applications depending on their properties. The essential material characteristics required for signal propagation applications are very low relative permittivity, low dielectric loss, low-temperature variation of relative permittivity/resonant frequency, and low coefficient of thermal expansion. The materials used for these applications are in the form of substrates, foams, inks, bulk resonators, high-temperature co-fired ceramics (HTCC), low-temperature co-fired ceramics (LTCC), printed circuit boards (PCBs), etc. The materials should absorb or reflect microwaves for electromagnetic interference (EMI) shielding applications. The present chapter gives an overview of microwave material requirements, properties, and their applications in antennas, filters, and oscillators in the military and aerospace sector.


Microwave materials HTCC LTCC ULTCC EMI Shielding Composites Rubber-Ceramics PCBs Dielectric Resonators Microstrip antenna Dielectric Resonator Antenna Bandwidth Metamaterials Oscillator Filter Reflection Coefficient Gain Beamwidth 



Fifth generation


Active electronically steered antennas


Biaxially oriented poly-ethylene terephthalate


Bore sight errors


Coefficients of thermal expansion


Dielectric resonator


Dielectric resonator antenna


Dielectric resonator oscillator


Electromagnetic bandgap


Electronic countermeasures


Electromagnetic interference


Electromagnetic pulse


Electrostatic discharge


Global positioning systems


Halpern anti-radiation paint


Hot-pressed silicon nitride


High-temperature co-fired ceramics


Heat-treated polyaromatic hydrocarbons


Integrated circuits


Internet of Things


Information technology


Intelligent transport system


Low-temperature co-fired ceramics


Multi-chip module


Mesocarbon microbead


Microwave integrated circuits


Multilayer capacitor


Monolithic microwave integrated circuits


Melting point


Multiwall carbon nanotube


Negative refractive index


Printed circuit board


Polyolefin elastomer


Polypropylene random copolymer




Reaction-bonded silicon nitride




Radio-frequency interference


Radio-frequency identification


Slip-cast fused silica


System in package


System on package


Thermal conductivity




Wireless fidelity


Worldwide interoperability for microwave access


Wireless local area network


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Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • J. Varghese
    • 1
    Email author
  • N. Joseph
    • 1
  • H. Jantunen
    • 1
  • S. K. Behera
    • 2
  • H. T. Kim
    • 3
  • M. T. Sebastian
    • 3
  1. 1.Microelectronics Research UnitUniversity of OuluOuluFinland
  2. 2.Department of Electronics and Communication EngineeringNIT RourkelaRourkelaIndia
  3. 3.Korean Institute for Ceramic Engineering and TechnologyJinju-siSouth Korea

Section editors and affiliations

  • Himadri Sekhar Maiti
    • 1
    • 2
  1. 1.CSIR-Central Glass and Ceramic Research InstituteKolkataIndia
  2. 2.Govt. College of Engg. and Ceramic TechnologyKolkataIndia

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