Skip to main content
SpringerLink
Log in

Failure of Integrated Circuits

  • Living reference work entry
  • First Online:
Handbook of Materials Structures, Properties, Processing and Performance

  • 264 Accesses

Abstract

Although there are many complex, integrated, and interactive systems such as automobiles, aircraft, electrical generation, and distribution systems, integrated circuits and especially very-large-scale integrated (VLSI) and ultra-large-scale integrated (ULSI) device systems demonstrate a length-scale system, in contrast, which is unique because of its continuous evolution. This evolution, driven for roughly four decades by Moore’s law, involves feature sizes driven to the low-nanometer-size regime and transistor densities exceeding billions/cm2. Electromigration is discussed in the context of these phenomena along with related circuit failure phenomena as these relate to product reliability.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution

Institutional subscriptions

References

  • Basaran C, Lin MN (2007) Damage mechanics of electromigration in microelectronics copper interconnects. Int J Mater Struct Integrity 1:16–39

    Article  Google Scholar 

  • Beck F (1998) Integrated circuit failure analysis. Wiley, New York

    Google Scholar 

  • Black JR (1999) Electromigration: a brief survey and some recent results. IEEE Trans Electron Dev 16:338–347

    Article  Google Scholar 

  • Ohring M (1998) Reliability and failure of electronic materials and devices. Academic, San Diego

    Google Scholar 

  • Wagner LC (ed) (1989) Failure analysis of integrated circuits: tools and techniques. Springer Science and Business Media, LLC, New York

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Metallurgical and Materials Engineering, University of Texas at El Paso, Engineering Bldg., Room M201-A, El Paso, TX, USA

    Lawrence E. Murr

Authors
  1. Lawrence E. Murr
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Lawrence E. Murr .

Rights and permissions

Reprints and permissions

Copyright information

© 2014 Springer International Publishing Switzerland

About this entry

Cite this entry

Murr, L.E. (2014). Failure of Integrated Circuits. In: Handbook of Materials Structures, Properties, Processing and Performance. Springer, Cham. https://doi.org/10.1007/978-3-319-01905-5_56-1

Download citation

  • DOI: https://doi.org/10.1007/978-3-319-01905-5_56-1

  • Received:

  • Accepted:

  • Published:

  • Publisher Name: Springer, Cham

  • Online ISBN: 978-3-319-01905-5

  • eBook Packages: Springer Reference Chemistry and Mat. ScienceReference Module Physical and Materials ScienceReference Module Chemistry, Materials and Physics

Publish with us

Policies and ethics

Search

Navigation