Abstract
This chapter focuses on polymer/metal interfaces. Attention is given to two common aspects of tremendous practical interest, namely, surface roughness and moisture. Debonding of polymer/metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer/metal interfacial strength, cohesive failure near the interface is usually desired to enhance the interfacial adhesion. Roughened surfaces generally produce more cohesive failure and, therefore, are used commonly in practice to obtain better adhesion. In this chapter, a fracture mechanics model is developed that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data are given. Moisture, on the other hand, tends to degrade the interfacial strength. To quantify such degradation, a systematic and multidisciplinary study is conducted to better understand the fundamental science of moisture-induced degradation of interfacial adhesion. The approach is comprised of both experimental and modeling components of analysis and addresses some of the key issues needed to advance the understanding of the effect of moisture on interfacial adhesion.
This is a preview of subscription content, log in via an institution.
References
L. Butkus, Environmental durability of adhesively bonded joints, Doctoral thesis, Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, 1997
Y. Cengel, M. Boles, Thermodynamics: An Engineering Approach (McGraw-Hill, New York, 1994)
K. Cho, E. Cho, Effect of the microstructure of copper oxide on the adhesion behavior or epoxy/copper leadframe joints. J. Adhes. Sci. Technol. 14(11), 1333–1353 (2000)
C. Chong, A. Leslie, L. Beng, C. Lee, Investigation on the effect of copper leadframe oxidation on package delamination, in Proceedings of the 45th Electronic Components and Technology Conference, (1995), pp. New York, N.Y. 463–469
P. Chung, M. Yuen, P. Chan, N. Ho, D. Lam, Effect of copper oxide on the adhesion behavior of epoxy molding compound-copper interface, in Proceedings of the 52nd Electronic Components and Technology Conference, 2002, pp. 1665–1670
J. Comyn, C. Groves, R. Saville, Durability in high humidity of glass-to-lead alloy joints bonded with and epoxide adhesive. Int. J. Adhes. Adhes. 14, 15–20 (1994)
T. Ferguson, J. Qu, Moisture and temperature effects on the reliability of interfacial adhesion of a polymer/metal interface, in Proceedings of the 54th Electronic Components and Technology Conference, 2004
R. Gledhill, A. Kinloch, J. Shaw, A model for predicting joint durability. J. Ahdes. 11, 3–15 (1980)
K. Hong, H. Imadojemu, R. Webb, Effects of oxidation and surface roughness on contact angle. Exp. Therm. Fluid Sci. 8, 279–285 (1994)
J. Hutchinson, Z. Suo, Mixed mode cracking in layered materials, in Advances in Applied Mechanics, vol. 29 (Academic, New York, 1992)
S. Kim, The role of plastic package adhesion in IC performance, in Proceedings of the 41st Electronic Components and Technology Conference, 1991, pp. 750–758
A. Kinloch, Interfacial fracture mechanical aspects of adhesive bonded joints – a review. J. Adhes. 10, 193–219 (1979)
A.J. Kinloch, Adhesion and Adhesives Science and Technology (Chapman and Hall, London, 1987)
H. Lee, J. Qu, Microstructure, adhesion strength and failure path at a polymer/roughened metal interface. J. Adhes. Sci. Technol. 17(2), 195–215 (2003)
S. Luo, Study on adhesion of underfill materials for flip chip packaging, Doctoral thesis, Georgia Institute of Technology, School of Textile and Fibers Engineering, Atlanta, 2003
T. Mino, K. Sawada, A. Kurosu, M. Otsuka, N. Kawamura, H. Yoo, Development of moisture-proof thin and large QFP with copper lead frame, in Proceedings of the 48th Electronic Components and Technology Conference, 1998, pp. 1125–1131
S. Shi, C.P. Wong, Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications, in Proceedings of the 48th Electronic Components and Technology Conference, 1998, pp. 117–124
C. Soles, A. Yee, A discussion of the molecular mechanisms of moisture transport in epoxy resins. J. Polym. Sci. B 38, 792–802 (2000)
C. Soles, F. Chang, D. Gidley, A. Yee, Contributions of the nanovoid structure to the kinetics of moisture transport in epoxy resins. J. Polym. Sci. B 38, 776–791 (2000)
J. Wylde, J. Spelt, Measurement of adhesive joint fracture properties as a function of environmental degradation. Int. J. Adhes. Adhes. 18, 237–246 (1998)
S. Yi, C. Yue, J. Hsieh, L. Fong, S. Lahiri, Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes. J. Adhes. Sci. Technol. 13, 789–804 (1999)
Acknowledgments
The work reported here is based on the PhD theses of two former students, Matthew Yao and Timothy Ferguson.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2014 Springer Science+Business Media New York
About this entry
Cite this entry
Qu, J. (2014). Adhesion and Failure of Polymer/Metal Interfaces in Microelectronic Packaging. In: Voyiadjis, G. (eds) Handbook of Damage Mechanics. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-8968-9_27-1
Download citation
DOI: https://doi.org/10.1007/978-1-4614-8968-9_27-1
Received:
Accepted:
Published:
Publisher Name: Springer, New York, NY
Online ISBN: 978-1-4614-8968-9
eBook Packages: Springer Reference EngineeringReference Module Computer Science and Engineering