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Capacitive Links for Power and Data Telemetry to Implantable Biomedical Microsystems

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Handbook of Biochips

Abstract

Wireless interfacing is undoubtedly among the foremost requirements of a biomedical microsystem, which is a necessity for it to be full implantable. Wireless interfacing usually includes both power and data telemetry to the implanted system. Interfacing to biochips wirelessly was traditionally implemented using inductive coupling, but recently capacitive links proved to be advantageous to its inductive counterpart. In this chapter, basic concept of the employment of capacitive links for wireless interfacing to biomedical implants is discussed firstly. Then, the chapter studies practicability of the implementation of capacitive links for transcutaneous interfacing to implantable devices taking into account measured electrical properties of living tissues performing as the capacitor dielectric. Proceedingly, electrical circuit models with different levels of abstraction, which have been formed according to the physical behavior of the different parts of a capacitive link, are reviewed. Moreover, these models are also studied from a designer’s viewpoint in order to provide guidelines for the design of capacitive links in real conditions. Furthermore, the concept of wireless interfacing through capacitive coupling for both power telemetry and data exchange is explained using various case studies and examples. A study on wireless interfacing through living tissues is never complete without studying biological concerns such as the extent of the energy to which the tissue is exposed. Safety concerns associated with the exposure of living tissues to RF electromagnetic fields and the resulting energy absorption and subsequently heating are then studied. Finally, the chapter is concluded with some of the exclusive advantages of capacitive links that introduce it as an interesting method for wireless interfacing to implantable biomedical microsystems.

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References

  • Asgarian F, Sodagar AM (2009) A low-power noncoherent BPSK demodulator and clock recovery circuit for high-data-rate biomedical applications. In: Engineering in medicine and biology conference. EMBC, pp 407–410. doi: 10.1109/IEMBS.2009.5332664

    Google Scholar 

  • Asgarian F, Sodagar AM (2010) A carrier-frequency-independent BPSK demodulator with 100% data-rate-to-carrier-frequency ratio. In: Biomedical circuits and systems conference (BioCAS), pp 29–32. doi: 10.1109/BIOCAS.2010.5709563

    Google Scholar 

  • Asgarian F, Sodagar AM (2011) Wireless telemetry for implantable biomedical microsystems. In: Laskovski AN (ed) Biomedical engineering trends in electronics. Communications and software. InTech, India, pp 21–44

    Google Scholar 

  • Culurciello E, Andreou AG (2005) Capacitive coupling of data and power for 3D silicon-on-insulator. In: IEEE international symposium on circuits and systems (ISCAS), vol 4, pp 4142–4145 doi:10.1109/ISCAS.2005.1465543

    Google Scholar 

  • Erfani R, Sodagar AM (2013) Amplitude-Engraving Modulation (AEM) scheme for simultaneous power and high-rate data telemetry to biomedical implants. In: Biomedical circuits and systems conference (BioCAS). IEEE, pp 290–293. doi:10.1109/BioCAS.2013.6679696

    Google Scholar 

  • Fazzil A, Canegallol R et al (2007) 3D capacitive interconnections with mono and bi-directional capabilities. In: Solid-state circuits conference, 2007 (ISSCC). doi:10.1109/ISSCC.2007.373441

    Google Scholar 

  • Gabriel C, Gabriel S, Corthout E (1996) The dielectric properties of biological tissues: I. Literature survey. Phys Med Biol 41(11):2231–2249

    Article  Google Scholar 

  • Gorton WS (1998) The genesis of the transistor. Proceedings of the IEEE 86(1):50–52

    Google Scholar 

  • IEEE Standard C95.1-2005. IEEE standards for safety levels with respect to human exposure to radio frequency electromagnetic fields, 3 KHz to 300 GHz

    Google Scholar 

  • Kilby JS (1959) Miniaturized electronic circuits. US Patent 3,138,743, filed 6 February 1959, issued 23 June 1964. United States Patent Office

    Google Scholar 

  • Lazzi G (2005) Thermal effects of implants. IEEE Eng Med Biol Mag 24(5):75–81

    Article  Google Scholar 

  • Sodagar AM, Amiri P (2009) Capacitive coupling for power and data telemetry to implantable biomedical microsystems. In: IEEE neural engineering, 2009. NER ’09. 4th International IEEE/EMBS. doi: 10.1109/NER.2009.5109320

    Google Scholar 

  • Takhti M, Asgarian F, Sodagar AM (2011) Modeling of a capacitive link for data telemetry to biomedical implants. IEEE BioCAS. doi:10.1109/BioCAS.2011.6107757

    Google Scholar 

  • Takhti M (2012) Wireless data and power telemetry to implantable biomedical microsystems. Technical report. Research Laboratory for Integrated Circuits and Systems (ICAS), Faculty of E.E., K.N. Toosi University of Technology, Tehran

    Google Scholar 

  • Zverev AI (1967) Handbook of filter synthesis. Wiley, New York

    Google Scholar 

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Correspondence to Mohammad A. Sharif .

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Sharif, M.A., Sodagar, A.M. (2015). Capacitive Links for Power and Data Telemetry to Implantable Biomedical Microsystems. In: Sawan, M. (eds) Handbook of Biochips. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-6623-9_13-1

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  • DOI: https://doi.org/10.1007/978-1-4614-6623-9_13-1

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