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Solid State Microjoining Processes in Manufacturing

  • Sharon Mui Ling NaiEmail author
  • Murali Sarangapani
  • Johnny Yeung
Reference work entry

Abstract

This chapter presents the solid-state bonding technologies, in particular the thermocompression bonding and thermosonic bonding technologies, which are used to form microjoints in the electronics industry. The diffusion bonding mechanism and the key bonding conditions required to form reliable joints are presented. Moreover, the recent progresses in the thermocompression bonding and thermosonic ball-wedge bonding technologies are highlighted. Lastly, the effects of different bonding materials and their surface characteristics on the joints’ performance are also discussed.

Keywords

Bonding Temperature Diffusion Bonding Wire Bond Ball Bond Bonding Pressure 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgement

For section “Advances in the Manufacturing of Thermosonic Ball-Wedge Bonding,” the authors sincerely thank their fellow colleagues from R&D-APL, R&D-MCL, MTD, QA, and engineering divisions of Heraeus Materials Singapore Pte. Ltd. for the data collection.

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Copyright information

© Springer-Verlag London 2015

Authors and Affiliations

  • Sharon Mui Ling Nai
    • 1
    Email author
  • Murali Sarangapani
    • 2
  • Johnny Yeung
    • 2
  1. 1.Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR)SingaporeSingapore
  2. 2.Heraeus MaterialsSingaporeSingapore

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