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Solder Joint Technology

  • Sharon Mui Ling NaiEmail author
  • Long Bin Tan
  • Cheryl Selvanayagam
Reference work entry

Abstract

This chapter introduces the key functions of solder joints and the various soldering processes. The evolution from leaded to lead-free solder materials is reported. Furthermore, the recent developments of high-temperature solders and composite solders due to the ever demanding functional and service requirements are discussed. The properties of different solder materials and their solder joints are also presented. Finally, reliability studies of the solder materials and their solder joints are discussed in terms of mechanical behavior, temperature cycling, and drop impact.

Keywords

Solder Joint Print Circuit Board Solder Alloy Solder Ball Solder Bump 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag London 2015

Authors and Affiliations

  • Sharon Mui Ling Nai
    • 1
    Email author
  • Long Bin Tan
    • 2
  • Cheryl Selvanayagam
    • 3
  1. 1.Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR)SingaporeSingapore
  2. 2.National University of SingaporeSingaporeSingapore
  3. 3.Advanced Micro DevicesSingaporeSingapore

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