Thermal Contact Applications: Finite Element Formulations
Reference work entry
DOI: https://doi.org/10.1007/978-94-007-2739-7_737
Overview
We highlight the traditional continuous Galerkin (CG) finite element formulation for thermal contact resistance problems. We briefly review few of the decoupled formulations available in the literature. The decoupled formulations involve first solving for the mechanical field, and then with known mechanical variables, the solution for thermal field is obtained. The CG method employs gap or interface elements to capture the temperature jump in the contact zone. The interface conditions are imposed by adding the interface element conductivity matrix, associated with each contact element, to the global conductivity matrix.
Introduction
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References
- 1.Blandford GE, Tauchert TR (1985) Thermoelastic analysis of layered structures with imperfect layer contact. Comput Struct 21(6):1283–1291MATHGoogle Scholar
- 2.Wriggers P, Zavarise G (1993) Thermomechanical contact-a rigorous but simple numerical approach. Comput Struct 46(1):47–53Google Scholar
- 3.Song S, Yovanovich MM (1987) Explicit relative contact pressure expression: dependence upon surface roughness parameters and vickers microhardness coeffcients. Number: AIAA-87-0152, Reno, Nevada. 12 Jan 15Google Scholar
- 4.Zavarise G, Wriggers P, Stein E, Schreer BA (1992) Real contact mechanisms and finite element formulation-a coupled thermomechanical approach. Int J Numer Meth Eng 35:767–785MATHGoogle Scholar
- 5.Hegazy AA (1985) Thermal Joint conductance of conforming rough surfaces: effect of surface micro-hardness variation. Ph.D., thesis, Department of Mechanical Engineering, Univeristy of Waterloo, Waterloo, CanadaGoogle Scholar
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