CIRP Encyclopedia of Production Engineering

2019 Edition
| Editors: Sami Chatti, Luc Laperrière, Gunther Reinhart, Tullio Tolio

SMD Component Placement

  • Michael PfefferEmail author
  • Jörg Franke
Reference work entry
DOI: https://doi.org/10.1007/978-3-662-53120-4_16836

Synonyms

Definition

The placement of surface mount technology (SMT) components on printed circuit boards (PCB) and its assembly task is defined as follows:
  • Grip the right component from the pick-up position (respectively feeder)

  • Place the component on the right position (target position) on the surface of printed circuit boards (PCB) with appropriate precision and accuracy

Extended Definition

The process of placing a surface mounted device (SMD) is structured in following steps:
  1. 1.
    Feeding
    1. (a)

      Depending on component shape and according to the packaging type of the components (paper or plastic tape and reel, tray, tubes, and bulk case), there exist different individual feeder types.

       
     
  2. 2.
    Gripping
    1. (a)

      The components are gripped at the top-side by individually designed vacuum grippers respectively nozzles. These are customized according to the shape and weight of the component to hold the components reliable even at high...

This is a preview of subscription content, log in to check access.

References

  1. Feldmann K, Schöppner V, Spur G (eds) (2014) Handbuch Fügen, Handhaben, Montieren [Handbook joining, handling, assembling]. In: Edition Handbuch der Fertigungstechnik [Production engineering handbook], vol 5. Hanser, München (in German)Google Scholar
  2. Klein Wassink R, Verguld M (1995) Manufacturing techniques for surface mounted assemblies. Electrochemical Publications, British IslesGoogle Scholar
  3. Scheel W, Hanke H-J (eds) (1999) Montage [Assembly]. Baugruppentechnologie der Elektronik [Electronics assembly technology]. Verlag Technik, Berlin (in German)Google Scholar
  4. Wohlrabe H (2009). Qualitätsoptimierung bei der Fertigung Elektronischer Baugruppen Mittels Statistischer Analysemethoden [Quality optimization in electronics production by means of statistical analysis methods]. In: System integration in electronic packaging, vol 7. Detert, Templin (in German)Google Scholar
  5. Wormuth D, Zapf J (2001) Grundlagen der Surface Mount Technology [Basics of surface mount technology]. Siemens Dematic AG, München (in German)Google Scholar

Copyright information

© CIRP 2019

Authors and Affiliations

  1. 1.Institute for Factory Automation and Production Systems (FAPS)Friedrich-Alexander-University of Erlangen-Nuremberg (FAU)NurembergGermany

Section editors and affiliations

  • Joerg Krueger
    • 1
  • Kirsten Tracht
  1. 1.IWFTechnische Universität BerlinBerlinGermany