CIRP Encyclopedia of Production Engineering

2019 Edition
| Editors: Sami Chatti, Luc Laperrière, Gunther Reinhart, Tullio Tolio

Chemical Vapor Deposition (CVD)

  • Kurt Coppens
  • Eleonora FerrarisEmail author
Reference work entry
DOI: https://doi.org/10.1007/978-3-662-53120-4_16770

Definition

Chemical vapor deposition (CVD) is a process whereby a solid material is deposited from the reaction of vapor-phase chemical reactants on or close to a substrate surface. The solid material is obtained as a coating, a powder, or single crystals. A reaction chamber is used for the process, into which the reactant gases are introduced to decompose and react. By varying the environmental conditions such as substrate material and temperature, composition of the reaction gas mixture, total pressure gas flows, etc., materials with different properties can be grown (Martin 2010).

Theory and Application

Process Description

Chemical vapor deposition (CVD) is a widely used materials-processing technology. It is a synthesis process capable of producing high-purity, high-performance solid materials through chemical reactions in vapor phase. CVD is commonly used to deposit conformal films to surfaces essential in the manufacture of semiconductors and other electronic components; in the...

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References

  1. Choy K (2003) Chemical vapour deposition of coatings. Prog Mater Sci 48(2):57–170CrossRefGoogle Scholar
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  6. Tracton A (2005) Coatings technology handbook. Taylor & Francis, Boca RatonCrossRefGoogle Scholar
  7. Yan X-T, Xu Y (2010) Chemical vapour deposition: an integrated engineering design for advanced materials. Springer, LondonGoogle Scholar

Copyright information

© CIRP 2019

Authors and Affiliations

  1. 1.KU Leuven – Campus De NayerSint-Katelijne-WaverBelgium
  2. 2.Department of Mechanical Engineering, Production Engineering, Machine Design and Automation (PMA) SectionKU LeuvenLeuvenBelgium