CIRP Encyclopedia of Production Engineering

Living Edition
| Editors: The International Academy for Production Engineering, Sami Chatti, Tullio Tolio

Bonding

  • Tae Hyung Kim
Living reference work entry
DOI: https://doi.org/10.1007/978-3-642-35950-7_6618-3

Definition

Bonding (referred to as adhesive bonding) is a joining method that joins two or more materials by applying and solidifying adhesives.

Theory and Application

Theory

The adhesive bonding is a complex physical and chemical process that creates attractive forces between the substrates (base materials) and adhesive. As shown in Fig. 1, the adhesive bonded joint consists of three areas: cohesion, transition, and adhesion zone. In the cohesion zone, cohesive forces are a result of a number of molecular forces such as intermolecular interactions, mechanical bonds, or chemical bonds within the adhesive during application and curing process. The transition zone is an interphase boundary layer or interdiffusion segment with nonuniform composition formed by interaction between adhesive and the substrate surface. The thickness of the transition zone differs from nanometer to millimeter ranges. In the adhesion zone, adhesive forces are determined by various chemical, mechanical, and...
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References

  1. Brockmann W, GeiB PL, Klingen J, Schröder B (2009) Adhesive bonding: materials, applications and technology. Wiley-VCH, Weinheim, pp 108–114Google Scholar
  2. Cognard P (2006) Handbook of adhesives and sealants volume 2 – general knowledge, application of adhesives, new curing techniques. Elsevier, AmsterdamGoogle Scholar
  3. Habenicht G (2008) Applied adhesive bonding: a practical guide for flawless results. Wiley-VCH, WeinheimCrossRefGoogle Scholar
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  5. Lees WA (1984) Adhesives in engineering design. Springer, Berlin, pp 48–55CrossRefGoogle Scholar
  6. Schultz J, Nardin M (1994) Theories and mechanisms of adhesion. In: Pizzi A, Mittal KL (eds) Handbook of adhesive technology. Marcel Dekker, New YorkGoogle Scholar

Copyright information

© CIRP 2019

Authors and Affiliations

  • Tae Hyung Kim
    • 1
  1. 1.Signal and Image Processing Institute, Biomedical Imaging GroupUniversity of Southern CaliforniaLos AngelesUSA

Section editors and affiliations

  • Joerg Krueger
    • 1
  • Kirsten Tracht
  1. 1.IWFTechnische Universität BerlinBerlinGermany