Anisotropic Conductive Adhesives

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Abstract

Anisotropic conductive adhesives (ACAs) are a set of materials typically combining either epoxy or acryl adhesives and conductive particles to allow electrical connection across what would otherwise be a standard mechanical adhesive assembly. They differ from isotropic conductive adhesives such as silver epoxy in that the conductive particles are loaded and distributed in such a way that they do not conduct within the bulk of the adhesive but do conduct in the Z-axis when they are trapped between electrodes on the top and bottom substrates. This allows them to offer some unique advantages compared with isotropic adhesives or various solder technologies. In the case of touch panels, these advantages are primarily related to its low temperature and high interconnect density capabilities, although cost and speed of assembly may also be considerations.

ACAs are widely used in the display and electronics assembly industries. In flat panel displays, they are used to make the connection between the drive circuitry and the display itself. They are also used extensively in other applications that require high-density and/or low-temperature assembly at high volume. This includes touch panels, camera modules for mobile phones, touchpads for notebook computers, and RFID assemblies for smartcards. ACAs have also had limited success in semiconductor packaging, but the reliability requirements for these applications are not always possible to achieve with ACA technology.

Keywords

Contact Resistance Flat Panel Display Peel Strength Conductive Particle Anisotropic Conductive Film 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

List of Abbreviations

ACA

Anisotropic conductive adhesives

ACF

Anisotropic conductive film

ACP

Anisotropic conductive paste

COB

Chip-on-board

COF

Chip-on-flex

COG

Chip-on-glass

DSC

Differential scanning calorimetry

FOB

Flex-on-board

FOF

Flex-on-flex

FOG

Flex-on-glass

FPC

Flexible printed circuit

FTIR

Fourier transform infrared spectroscopy

PCB

Printed circuit board

RFID

Radio frequency identification

SMT

Surface mount technology

UPH

Units per hour

Further Reading

  1. A list of high-quality papers on ACF that are available online is maintained at http://autoacf.com/ACF_Online_Resources.aspx
  2. Chen X, Zhang J, Jao C, Liu Y (2005) Bonding parameters of anisotropic conductive adhesive film and peeling strength. Key Eng Mater 297–300:918–923CrossRefGoogle Scholar
  3. Islam RA, Chan YC (2004) Effect of drop impact energy on contact resistance of anisotropic conductive film adhesive film joints. J Mater Res 19(6):1662–1668CrossRefGoogle Scholar
  4. Kim H-J, Chung C-K, Yim M-J, Hong S-M, Jang S-Y, Moon Y-J, Paik K-W (2006) Study on bubble formation in rigid-flexible substrates bonding using anisotropic conductive films (ACFs) and their effects on the ACF joint reliability. In: Proceedings of the 56th electronic components and technology conference, 2006, San DiegoGoogle Scholar
  5. Savolainen P, Saarinen I, Rusanen O (2004) High-density interconnections in mobile phones using ACF. In: Polytronics 2004 I.E. international conference on polymers & adhesives, Portland, September 2004, AP22Google Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  1. 1.Ito CorporationChuo-kuJapan

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