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Typical Processing Steps with Porous Silicon

  • Leigh Canham
Living reference work entry

Later version available View entry history

Abstract

Porosified silicon wafers or powders from electrochemical etching of bulk silicon, or from silica reduction, often require a series of additional processing steps, prior to use. In this expanded review a compendium of over 70 processing techniques is provided, linking all of them to either dedicated process reviews or related chapters in the handbook. The processing techniques are grouped into 8 processing functions: patterning, size reduction, size classification, drying, passivation, coating, pore impregnation and skeleton doping. Typical process flows are illustrated for wafer substrates, membranes, particles and composites, giving examples of where the choice and order of processing steps can be important. Examples are also given of processing topics yet to be widely explored with porous silicon, but which could become important for some of the emerging applications.

Keywords

Processing steps with porous silicon Porosified silicon wafers Porosified silicon powders Electrochemically etched silicon wafers Microwave processing of porous silicon Supercritical fluid processing of porous silicon 

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Copyright information

© Springer International Publishing AG 2017

Authors and Affiliations

  1. 1.School of Physics and AstronomyUniversity of BirminghamBirminghamUK

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