Introduction to Micro/Nanofabrication

  • Babak Ziaie
  • Antonio Baldi
  • Massood Z. Atashbar
Reference work entry

Abstract

In this chapter, we discuss various micro/nanofabrication micro/nanofabrication techniques used to manufacture structures in a wide range of dimensions (mm–nm). Starting with some of the most common microfabrication techniques (lithography, deposition, and etching), we present an array of micromachining micromachining and MEMS technologies that can be used to fabricate microstructures down to ∼ 1 μm. These techniques have attained an adequate level of maturity to allow for a variety of MEMS MEMS-based commercial products (pressure sensors, accelerometers, gyroscopes, etc.). More recently, nanometer-sized structures have attracted an enormous amount of interest. This is mainly due to their unique electrical, magnetic, optical, thermal, and mechanical properties. These could lead to a variety of electronic, photonic, and sensing devices with a superior performance compared to their macro counterparts. Subsequent to our discussion on MEMS MEMS and micromachining, we present several important nanofabrication nanofabrication techniques currently under intense investigation. Although e-beam and other high resolution lithographies can be used to fabricate nanometer-sized structures, their serial nature and/or cost preclude their widespread application. This has forced investigators to explore alternative and potentially superior techniques such as strain engineering, self-assembly, and nano-imprint lithography. Among these, self-assembly self-assembly is the most promising method, due to its low cost and the ability to produce nanostructures at different length scales.

Keywords

Scanning Tunneling Microscope Etch Rate Quantum Wire Sacrificial Layer Colloidal Sphere 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Abbreviations

A

adenine

AFM

atomic force microscope/microscopy

C

cytosine

CVD

chemical vapor deposition

DMD

digital micromirror device

DPN

dip-pen nanolithography

DRIE

deep reactive ion etching

EDP

ethylene diamine pyrocatechol

G

guanine

IC

integrated circuit

LPCVD

low pressure chemical vapor deposition

MEMS

microelectromechanical systems

MOCVD

metalorganic CVD

OTS

octadecyltrichlorosilane

PDMS

polydimethylsiloxane

PECVD

plasma enhanced CVD

PMMA

poly(methylmethacrylate)

PSG

phosphorus-doped glass

PZT

lead zirconate titanate

RF

radiofrequency

RIE

reactive ion etching

SAM

self-assembling monolayer

SEM

scanning electron microscope/microscopy

SPM

scanning probe microscopy

STM

scanning tunneling microscope/microscopy

T

thymine

TEM

transmission electron microscopy

TMAH

tetramethyl ammonium hydroxide

UHV

ultrahigh vacuum

VLSI

very large-scale integration

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Copyright information

© Springer-Verlag Berlin Heidelberg 2004

Authors and Affiliations

  • Babak Ziaie
    • 1
  • Antonio Baldi
    • 2
  • Massood Z. Atashbar
    • 3
  1. 1.Department of Electrical and Computer EngineeringUniversity of MinnesotaMinneapolisUSA
  2. 2.Centro National Microelectrónica (CNM-CSIC)Institut de Microelectronica de Barcelona (IMB)BarcelonaSpain
  3. 3.Department of Electrical and Computer EngineeringWestern Michigan UniversityKalamazooUSA

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