Introduction

  • John R. Barnes
Reference work entry

Introduction

Welcome to the most important part of this book—actually designing our printed circuit boards! We've spent  Chapters 4 through  30, with numerous side trips to Appendices A through U, preparing for this step.

If we do a careful, thorough job of printed circuit board (PCB) layout, the rest of our development effort should be fairly straightforward—at least as far as the electronics are concerned. If this is a first-pass board, we can expect to find a few things that aren't quite perfect, and that we will want to tweak. Most of these corrections will be components that we must change or add—for which we have provided “wiggle room” in the circuits and the PCB layout—so they will only require changing the bill-of-material and the assembly drawing. The rest will be minor wiring changes, maybe with a patch PAL installed to fix logic and signal-level errors. If the board is going into equipment, where we only need to make a few units, and we have a very-tight deadline, a few cuts...

Keywords

Print Circuit Board Signal Trace Return Plane Power Plane Signal Layer 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
This is a preview of subscription content, log in to check access.

Books

  1. Applications Guide to EMI, RFI, ESD Solutions. AVX, pp. 2.Google Scholar
  2. Applications Handbook. Merrimack, NH: Unitrode, 1997, pp. 4-104–4-106.Google Scholar
  3. Designing for Immunity to Pulsed EMI. Wilmington, MA: KeyTek, 1990.Google Scholar
  4. Handbook of EC EMC Compliance. Boxborough, MA: Compliance Design, 1993, pp. 37, 38, 45.Google Scholar
  5. Handbook of EU EMC Compliance. Boxborough, MA: Compliance Design, 1995, pp. 35–40.Google Scholar
  6. Handbook of EU EMC Compliance. Boxborough, MA: Compliance Design, 1996, pp. 40–45.Google Scholar
  7. Low Level Measurements, 5th Edition. Cleveland, OH: Keithley Instruments, 1998, pp. 2-14–2-16.Google Scholar
  8. LVDS Owner's Manual, 2nd Edition. National Semiconductor, 2002, pp. 23–41.Google Scholar
  9. Practical Design Techniques for Power and Thermal Management. Norwood, MA: Analog Devices, 1998, pp. 2.55, 8.72–8.76.Google Scholar
  10. Radio, RF and Video Applications. Phoenix, AZ: Motorola, 1991, pp. 79–101.Google Scholar
  11. Reference Data for Radio Engineers, 4th Edition. New York: International Telephone and Telegraph, 1949, pp. 920–922.Google Scholar
  12. Reference Data for Radio Engineers, 6th Edition. New York: Howard W. Sams, 1975, pp. 5-32–5-37.Google Scholar
  13. Signal Integrity Issues in PCB Design. Bellevue, WA: UltraCAD Design, 2002, pp. 3-4–3-13, 4-18–4-21, 10-6–11-2.Google Scholar
  14. Teradyne Printed Circuit Backplane Design Guide. Nashua, NH: Teradyne Connection Systems, 1984, pp. 2–2, 2–3, 10-3–10-24.Google Scholar
  15. The ARRL Handbook for Radio Communications 2003. Newington, CT: American Radio Relay League, 2002, pp. 25.12–25.20.Google Scholar
  16. The Best of Analog Dialogue 1967 to 1991. Analog Devices, 1991, pp. 147, 148.Google Scholar
  17. TOPSwitch®-FX Design Seminar Handbook. Sunnyvale, CA: Power Integrations, 2000, pp. 1–140, 1–141, 2–22, 2–23.Google Scholar
  18. Unitrode Power Supply Design Seminar SEM-1200. Merrimack, NH: Unitrode, 1997, pp. 4-1–4-3.Google Scholar
  19. Archambeault, Bruce R., PCB Design for Real-World EMI Control. Boston, MA: Kluwer Academic Publishers, 2002, pp. 69–84, 105–119, 187–197.Google Scholar
  20. Arsenault, J. E., and Roberts, J. A., Reliability & Maintainability of Electronic Systems. Computer Science Press, 1980, pp. 190.Google Scholar
  21. Axelson, Jan, Making Printed Circuit Boards. New York: TAB Books, 1993, pp. 81–143, 267–280.Google Scholar
  22. Bakoglu, H. B., Circuits, Interconnections, and Packaging for VLSI. New York: Addison-Wesley, 1990, pp. 416–421.Google Scholar
  23. Bell Telephone Laboratories, Physical Design of Electronic Systems: Volume II Materials Technology. Englewood Cliffs, NJ: Prentice-Hall, 1970, pp. 448–486.Google Scholar
  24. Biddulph, Dick, Radio Communication Handbook, 6th Edition. Herts, UK: Radio Society of Great Britain, 1994, pp. 16.18–16.21.Google Scholar
  25. Blankenhorn, James C., PCB Design of High-Speed Digital Circuits. Scotts Valley, CA: SMT Plus, 2002, pp. 34–58, 115–124, 154–196, 213–236.Google Scholar
  26. Blood, Jr., William R., MECL System Design Handbook, 4th Edition. Motorola Semiconductor Products, 1983, pp. 173–178.Google Scholar
  27. Boxleitner, Warren. Electrostatic Discharge and Electronic Equipment. New York: IEEE Press, 1989, pp. 21–29.Google Scholar
  28. Breed, Gary A., RFI/EMI/EMC: A Designer's Handbook. Englewood, CO: Cardiff Publishing, 1992, pp. 56, 57, 76.Google Scholar
  29. Brooks, Douglas, Signal Integrity Issues and Printed Circuit Board Design. Upper Saddle River, NJ: Prentice Hall PTR, 2003, pp. 158–168, 297–309.Google Scholar
  30. Buchanan, James E., BiCMOS/CMOS Systems Design. New York: McGraw-Hill, 1991, pp. 76.Google Scholar
  31. Buchanan, James, CMOS/TTL Digital Systems Design. New York: McGraw-Hill, 1990, pp. 92.Google Scholar
  32. Buchanan, James E., Signal and Power Integrity in Digital Systems: TTL, CMOS, & BiCMOS. New York: McGraw-Hill, 1996, pp. 123–149, 173–197.Google Scholar
  33. Capillo, Carmen, Surface Mount Technology. New York: McGraw-Hill, 1990, pp. 59–101, 317–342.Google Scholar
  34. Chatterton, Paul A., and Houlden, Michael A., EMC: Electromagnetic Theory to Practical Design. New York: John Wiley & Sons, 1992, pp. 257–265.Google Scholar
  35. Clark, Raymond H., Printed Circuit Engineering: Optimizing for Manufacturability. New York: Von Nostrand Reinhold, 1989, pp. 7–241.Google Scholar
  36. Classon, Frank, Surface Mount Technology for Concurrent Engineering and Manufacturing. New York: McGraw-Hill, 1993, pp. 11–13, 215–225.Google Scholar
  37. Coombs, Jr., Clyde F., Printed Circuits Handbook, 3rd Edition. New York: McGraw-Hill, 1988, pp. 2.1–2.11, 3.41–3.45, 4.3–5.13, 17.1–17.8, 21.1–22.29, 31.3–31.32, 35.17–35.23.Google Scholar
  38. Coombs, Jr., Clyde F., Printed Circuits Handbook, 5th Edition. New York: McGraw-Hill, 2001, pp. 4.1–4.14, 13.3–15.17, 18.11–18.28, 35.1–35.15, 52.1–52.20, 57.1–57.15, 60.1–60.16.Google Scholar
  39. Cooper, W. Fordham, Electrical Safety Engineering, 3rd Edition. Boston, MA: Newnes, 1993, pp. 292–296.Google Scholar
  40. Corp, M. Bruce, ZZAAP! Taming ESD, RFI, and EMI. New York: Academic Press, 1990, pp. 195–203.Google Scholar
  41. Crandall, Earl, Power Supply Testing Handbook: Strategic Approaches in Test Cost Reduction. New York: International Thomson Publishing, 1997, pp. 55, 56, 227–238.Google Scholar
  42. Cuthbertson, Paul, Electronics Constructors Guide. Boston, MA: Newnes, 1995, pp. 227–231.Google Scholar
  43. Dally, William J., and Poulton, John W., Digital Systems Engineering. New York: Cambridge University Press, 1998, pp. 39–46.MATHGoogle Scholar
  44. Fessler, John T., and Hardin, Keith B., Lexmark's EMC Design Seminar. Lexington, KY: Lexmark International, 1993.Google Scholar
  45. Ganssle, Jack G., The Art of Designing Embedded Systems. Boston, MA: Newnes, 2000, pp. 126–131, 172–174.Google Scholar
  46. Ginsberg, Gerald L., Printed Circuits Design. New York: McGraw-Hill, 1991, pp. 1–317.Google Scholar
  47. Gore, Gregory V., The Engineer's Master Guide to EMI Control. West Conshohocken, PA: R & B Enterprises, 1986, pp. 206, 218–220.Google Scholar
  48. Harper, Charles A., and Sampson, Ronald M., Electronic Materials & Processes Handbook, 2nd Edition. New York: McGraw-Hill, 1994, pp. 2.1–2.40.Google Scholar
  49. Harper, Charles A. Electronic Packaging & Interconnection Handbook, 2nd Edition. New York: McGraw-Hill, 1997, pp. 8.78–8.89, 9.63–9.166, 11.34–11.59.Google Scholar
  50. Harper, Charles A. Electronic Packaging & Interconnection Handbook, 3rd Edition. New York: McGraw-Hill, 2000, pp. 11.44–11.54, 12.52–12.59.Google Scholar
  51. Harper, Charles A., Handbook of Electronic Packaging. New York: McGraw-Hill, 1969, pp. 1-60–1-118, 10-2–10-89, 14-5–14-42.Google Scholar
  52. Harper, Charles A., Handbook of Wiring, Cabling, and Interconnecting for Electronics. New York: McGraw-Hill, 1972, pp. 9-1–9-60.Google Scholar
  53. Harper, Charles A., High Performance Printed Circuit Boards. New York: McGraw-Hill, 2000, pp. 5.1–6.69, 9.16–9.114.Google Scholar
  54. Harper, Charles A., Passive Electronic Component Handbook, 2nd Edition. New York: McGraw-Hill, 1997, pp. 239–244.Google Scholar
  55. Hartal, Oren, Electromagnetic Compatibility by Design, 4th Edition. West Conshohocken, PA: R & B Enterprizes, 1996, pp. 274–307.Google Scholar
  56. Hartley, Rick, High Speed Design: A Practical Approach. IPC, pp. 1–37.Google Scholar
  57. Henney, Keith, Reliability Factors for Ground Electronic Equipment. New York: McGraw-Hill, 1956, pp. 6-1–6-39.Google Scholar
  58. Hollomon, Jr., James K., Surface-Mount Technology for PC Boards. Indianapolis, IN: Prompt Publications, 1995, pp. 141–184, 196–207, 275–295.Google Scholar
  59. Johnson, Howard, and Graham, Martin, High-Speed Digital Design: A Handbook of Black Magic. Upper Saddle River, NJ: Prentice Hall, 1993, pp. 189–221, 249–262, 295–321.Google Scholar
  60. Johnson, Howard, and Graham, Martin, High-Speed Signal Propagation: Advanced Black Magic. Upper Saddle River, NJ: Prentice-Hall, 2003, pp. 338–361.Google Scholar
  61. Jordan, Edward C., Reference Data for Engineers: Radio, Electronics, Computer, and Communications, 7th Edition. Indianapolis, IN: Howard W. Sams, 1985, pp. 5-28–5-32, 48-4, 48-6, 48-9.Google Scholar
  62. Keenan, R. Kenneth, Decoupling and Layout of Digital Printed Circuits. Pinellas Park, FL: The Keenan Corporation, 1985, pp. 4.1-1–4.1-7.Google Scholar
  63. Keenan, R. Kenneth, Digital Design for Interference Specifications. Pinellas Park, FL: TKC, 1983, pp. 4.1-1–4.2-7.Google Scholar
  64. Keiser, Bernhard E., EMI Control in Aerospace Systems. Gainesville, VA: Don White Consultants, 1979, pp. 2.56–2.58.Google Scholar
  65. Kervill, Gregg, Practical Guide to the Low Voltage Directive. Boston, MA: Newnes, 1998, pp. 180–197.Google Scholar
  66. Kimmel, William D., and Gerke, Daryl D., Electromagnetic Compatibility in Medical Equipment. New York: IEEE Press, 1995, pp. 77–101.Google Scholar
  67. Lenk, John D., Simplified Design of Switching Power Supplies. Boston, MA: Butterworth-Heinemann, 1995, pp. 87, 88.Google Scholar
  68. Lindsey, Darryl, The Design & Drafting of Printed Circuits. New York: McGraw-Hill, 1979, pp. 3–43, 71–118, 135–137.Google Scholar
  69. Lopez, Gilbert T., Printed Circuit Design Guide. Boulder, CO: Hapco, 1980, pp. 2–15.Google Scholar
  70. Lund, Preben, Generation of Precision Artwork for Printed Circuit Boards. New York: John Wiley & Sons, 1978, pp. 92–138, 160–208.Google Scholar
  71. Lund, Preben, Printed Circuit Board Precision Artwork Generation and Manufacturing Methods. Westlake Village, CA: Bishop Graphics, 1986, pp. 92–138, 160–208.Google Scholar
  72. Mancini, Ron, Op Amps for Everyone, 2nd Edition. New York: Newnes, 2003, pp. 325–334, 338–353.Google Scholar
  73. Marcoux, Phil P., Surface Mount Technology: Design for Manufacturability. Dearborn, MI: SME, 1989, pp. 37–154, 234–255.Google Scholar
  74. Mardiguian, Michel, Controlling Radiated Emissions by Design, 2nd Edition. Boston, MA: Kluwer Academic Publishers, 2001, pp. 108–176.Google Scholar
  75. Mardiguian, Michel, Electromagnetic Control in Components and Devices. Gainesville, VA: Interference Control Technologies, 1988, pp. 8.1–8.31.Google Scholar
  76. Mardiguian, Michel, Electrostatic Discharge: Understand, Simulate and Fix ESDProblems. Gainesville, VA: Interference Control Technologies, 1986, pp. C.1–C.3.Google Scholar
  77. Mardiguian, Michel, How to Control Electrical Noise. Gainesville, VA: Don White Consultants, 1983, pp. 5.6–5.8.Google Scholar
  78. Mardiguian, Michel, Interference Control in Computers and Microprocessor-Based Equipment. Gainesville, VA: Don White Consultants, 1984, pp. 2.17–4.6.Google Scholar
  79. Marks, Leonard, and Caterina, James A., Printed Circuit Assembly Design. New York: McGraw-Hill, 2000, pp. 45–65, 102–174.Google Scholar
  80. Markum, J. A., and Silva, M. P., Intermediate Electronic Fabrication, 2nd Edition. Seal Beach, CA: Technical Education Press, 1984, pp. 23–78, 125–136.Google Scholar
  81. Matisoff, Bernard S., Handbook of Electronics Packaging Design and Engineering, 2nd Edition. New York: Van Nostrand Reinhold, 1990, pp. 163–176, 197–207, 340–350.CrossRefGoogle Scholar
  82. Matisoff, Bernard S., Wiring and Cable Designer's Handbook. Blue Ridge Summit, PA: TAB Professional and Reference Books, 1987, pp. 113–147.Google Scholar
  83. Mills, Jeffrey P., Electromagnetic Interference Reduction in Electronic Systems. Englewood Cliffs, NJ: PTR Prentice Hall, 1993, pp. 82–92.Google Scholar
  84. Molyneux-Child, J. W., EMC Shielding Materials: A Designer's Guide. Oxford, UK: Newnes, 1997, pp. 121–125.Google Scholar
  85. Montrose, Mark I., EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple. New York: IEEE Press, 1999, pp. 23–25, 28–52, 60–124.Google Scholar
  86. Montrose, Mark I., Printed Circuit Board Design Techniques for EMC Compliance, 2nd Edition. New York: IEEE Press, 2000, pp. 13–63, 151–191, 211–271.CrossRefGoogle Scholar
  87. Morrison, Ralph, Noise and Other Interfering Signals. New York: John Wiley & Sons, 1992, pp. 105, 106.Google Scholar
  88. Morrison, Ralph, Solving Interference Problems in Electronics. New York: John Wiley & Sons, 1995, pp. 177–186.Google Scholar
  89. O'Hara, Martin, EMC at Component and PCB Level. Boston, MA: Newnes, 1998, pp. 90–94, 100–104, 118–160.Google Scholar
  90. Ott, Henry W., Noise Reduction Techniques in Electronic Systems, 2nd Edition. New York: John Wiley & Sons, 1988, pp. 274–309, 342–344.Google Scholar
  91. Paul, Clayton R., Introduction to Electromagnetic Compatibility. New York: John Wiley & Sons, 1992, pp. 75, 76, 401–443, 720–752.Google Scholar
  92. Perez, Reinaldo, Handbook of Electromagnetic Compatibility. New York: Academic Press, 1995, pp. 193–202.Google Scholar
  93. Poon, Ron K., Computer Circuits Electrical Design. Englewood Cliffs, NJ: Prentice Hall, 1995, pp. 107–119, 391–394.Google Scholar
  94. Prise, Walter J., Electronic Circuit Packaging. Columbus, OH: Charles E. Merrill Books, 1967, pp. 113–135.Google Scholar
  95. Ritchey, Lee W., Right the First Time: A Practical Hand Book on High Speed PCB and System Design, Volume 1. Speeding Edge, 2003, pp. 69–79, 90–95, 103–121, 125–131, 135, 139–151, 164–190, 196–228, 261–265.Google Scholar
  96. Ritenour, Bill, and White, Donald, EMI Control in Computers & Microprocessor-Based Equipment. NTU: 1992, pp. 3.1–5.12, 7.5–7.7.Google Scholar
  97. Scarlett, J. A., An Introduction to Printed Circuit Board Technology. Ayr, Scotland: Electrochemical Publications, 1984, pp. 47–66.Google Scholar
  98. Scarlett, J. A., Printed Circuit Boards for Microelectronics. Electrochemical Publications, 1980, pp. 16–21, 85–170.Google Scholar
  99. Scarlett, J. A., The Multilayer Printed Circuit Board Handbook. Electrochemical Publications, 1985, pp. 3–7, 59, 236–290, 340–355, 367–372, 409–422, 430–487, 499–526.Google Scholar
  100. Scarlett, J. A., Transistor-Transistor Logic and Its Interconnections. New York: Van Nostrand Reinhold, 1972, pp. 200–216.Google Scholar
  101. Schlabach, T. D., and Rider, D. K., Printed and Integrated Circuitry: Materials and Processes. New York: McGraw-Hill, 1963, pp. 55–82, 199–259.Google Scholar
  102. Scott, John, and Van Zyl, Clinton, Introduction to EMC. Oxford, UK: Newnes, 1997, pp. 124, 125.Google Scholar
  103. Seraphim, Donald P., Lasky, Ronald, and Li, Che-Yu, Principles of Electronic Packaging. New York: McGraw-Hill, 1989, pp. 104–124.Google Scholar
  104. Sinnadurai, F. N., Handbook of Microelectronics Packaging and Interconnection Technologies. Ayr, Scotland: Electrochemical Publications, 1985, pp. 175–180.Google Scholar
  105. Solberg, Vern, Design Guidelines for Surface Mount Technology. Blue Ridge Summit, PA: TAB Professional and Reference Books, 1990, pp. 2–30, 52–130.Google Scholar
  106. Stout, David F., and Kaufman, Milton, Handbook of Operation Amplifier Circuit Design. New York: McGraw-Hill, 1976, pp. III-5, III-6.Google Scholar
  107. Tihanyi, Laszlo, Electromagnetic Compatibility in Power Electronics. New York: IEEE Press, 1995, pp. 309–313.Google Scholar
  108. Tummala, Rao R., Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001, pp. 615–628.Google Scholar
  109. Tummala, Rao R., and Rymaszewski, Eugene J., Microelectronics Packaging Handbook. New York: Van Nostrand Reinhold, 1989, pp. 11–30, 65–107.Google Scholar
  110. Tummala, Rao R., Rymaszewski, Eugene J., and Klopfenstein, Alan G., Microelectronics Packaging Handbook: Technology Drivers, Part I, Second Edition. New York: International Thompson Publishing, 1997, pp. I-139–I-149, I-245–I-252.CrossRefGoogle Scholar
  111. Tummala, Rao R., Rymaszewski, Eugene J., and Klopfenstein, Alan G., Microelectronics Packaging Handbook: Subsystem Packaging, Part III, Second Edition. New York: International Thompson Publishing, 1997, pp. III-21–III-71.CrossRefGoogle Scholar
  112. Violette, J. L. Norman, White, Donald R. J., and Violette, Michael F., Electromagnetic Compatibility Handbook. New York: Van Nostrand Reinhold, 1987, pp. 569–591.Google Scholar
  113. Violette, J. L. Norman, Noise Control & Design Considerations in High Performance Electronic Circuits & Systems. Falls Church, VA: Violette Engineering, 1993, pp. 211–300.Google Scholar
  114. Walker, N. Edward, The Design Analysis Handbook. Land-O-Lakes, FL: DBS Publishing, 1994, pp. 123, 124, 164–188.Google Scholar
  115. Wheeler, Gershon J., The Design of Electronic Equipment. Englewood Cliffs, NJ: Prentice-Hall, 1972, pp. 91–114.Google Scholar
  116. White, Donald R. J., EMI Control in the Design of Printed Circuit Boards and Backplanes. Gainesville, VA: Don White Consultants, 1981, pp. 1.10–2.25, 3.6–3.25.Google Scholar
  117. White, Don, The EMC, Telecom and Computer Encyclopedia Handbook, 3rd Edition. Gainesville, VA: emf-emi control, 1999, pp. M-37–M-39, P-6.Google Scholar
  118. Williams, Tim, EMC for Product Designers. 2nd Edition. Oxford, UK: 1996, pp. 143–164, 271–273.Google Scholar
  119. Williams, Tim, and Armstrong, Keith, EMC for Systems and Installations. Oxford, UK: Newnes, 2000, pp. 134–137.Google Scholar

Standards

  1. ANSI/UL 60950, Safety of Information Technology Equipment, Including Electrical Business Equipment. Northbrook, IL: Underwriters Laboratories, 2002.Google Scholar
  2. CAN/CSA-C22.2 No. 60950-00, Safety of Information Technology Equipment. Toronto, Canada, Canadian Standards Association, 2000.Google Scholar
  3. IEC 950, Safety of information technology equipment, 2nd Edition Amendment 2. Geneva, Switzerland: International Electrotechnical Commision, 1996.Google Scholar
  4. IPC-2221, Generic Standard on Printed Circuit Board Design. Northbrook, IL: IPC, 1998, pp. 4–94.Google Scholar
  5. IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Northbrook, IL: IPC, 1998, pp. 3–22.Google Scholar
  6. IPC-2251, Design Guide for Electronic Packaging Utilizing High-Speed Techniques, 4th Working Draft. Northbrook, IL: IPC, February 2001.Google Scholar
  7. IPC-D-317A, Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques. Northbrook, IL: IPC, January 1995, pp. 7–39, 67, 68.Google Scholar
  8. MIL-STD-275E, Printed Wiring for Electronic Equipment. Department of Defense, 26 April 1978, pp. 13.Google Scholar
  1. UL 60950, UL Standard for Safety for Information Technology Equipment, 3rd Edition. Northbrook, IL: Underwriters Laboratories, 2000.Google Scholar

Catalogs

  1. Printed Circuit Drafting Technical Manual & Catalog 107A. Westlake Village, CA: Bishop Graphics, 1985, pp. 154–170Google Scholar
  2. SMD Process Applications. Sunnyvale, CA: Signetics, April 1987, pp. 3–15, 37–78.Google Scholar

Papers and Articles

  1. “AMD-K6® Processor EMI Design Considerations,” AMD Application Note 22023, April 2000. download from http://www.nalanda.nitc.ac.in/industry/AppNotes/AMD/22023.pdfGoogle Scholar
  2. “Manufacturability Guidelines for Printed Circuit Boards,” South Bay Circuits.Google Scholar
  3. “Manufacturing Information and Design for Manufacturing Guidelines,” Photocircuits, June 2000.Google Scholar
  4. “PCB Design Guidelines for Reduced EMI,” Texas Instruments SZZA009, Nov. 1999. download from http://www-s.ti.com/sc/psheets/szza009/szza009.pdfGoogle Scholar
  5. “PCB Design Handbook,” Pro-Tech, February 2001.Google Scholar
  6. “Printed-Circuit-Board Layout for Improved Electromagnetic Compatibility,” Texas Instruments SDYA011, Oct. 1996. download from http://www-s.ti.com/sc/psheets/sdya011/sdya011.pdfGoogle Scholar
  7. “Printed Circuit Board Manufacturing Considerations,” Electrotek.Google Scholar
  8. “Z Link® Multilayer Technology,” Sheldahl.Google Scholar
  9. Armstrong, Keith, “Design Techniques for EMC Part 5: PCB Design and Layout.” download from http://www.emc-journal.co.uk/archive1/991005.htmlGoogle Scholar
  10. Banyai, Chris, and Gerke, Daryl, “EMI Design Techniques for Microcontrollers in Automotive Applications,” Intel Application Note AP-711, Feb. 1996. download from http://support.intel.co.jp/design/auto/mcs96/applnots/272673.htmGoogle Scholar
  11. Barnes, John R., “Design Hooks to Enhance Card Testing,” (unpublished). November 18, 1991.Google Scholar
  12. Barnes, John R., “Designing Microprocessor Boards for High-Volume Low-Cost Manufacturing,” (unpublished). May 9, 1985.Google Scholar
  13. Barnes, John R., “Designing Printed Circuit Boards for High-Volume Low-Cost Manufacturing,” (unpublished) 1985.Google Scholar
  14. Berry, John, “Signal Integrity,” 2001, pp. 21–26.Google Scholar
  15. Bisenius, William S., “Product Safety-“Designing For Compliance” A Development System for 1st Time Success,” 2002 IEEE International Symposium on Electromagnetic Compatibility Symposium Record-Volume 2, Minneapolis, MN, August 19–23, 2002, pp. 677–685.Google Scholar
  16. Bogatin, Eric, “High Bandwidth Measurement Techniques for Low Inductance Structures,” 2003. download from http://www.gigatest.com/Google Scholar
  17. Briano, Bob, and Liberman, Max, “Just Lay It Out; It's Only a High-Speed Op Amp,” Microwave Product Digest, pp. 14, 58, October 2002.Google Scholar
  18. Brooks, Douglas, “90° Corners: the Final Turn,” Printed Circuit Design, vol. 15 no. 1, pp. 14–17, January 1998.Google Scholar
  19. Brooks, Douglas, “Controlling Impedance,” Printed Circuit Design, vol. 14 no. 1, pp. 29–30, January 1997.Google Scholar
  20. Brooks, Douglas, “Controlling signal timing,” Printed Circuit Design, vol. 14 no. 3, pp. 52–53, March 1997.Google Scholar
  21. Brooks, Douglas, “Ground Plane 101,” Printed Circuit Design, vol. 14 no. 10, pp. 34–35, October 1997.MathSciNetGoogle Scholar
  22. Brooks, Douglas, “Loop Areas: Close 'Em Tight!,” Printed Circuit Design, vol. 16 no. 1, pp. 22–23, January 1999.MathSciNetGoogle Scholar
  23. Brooks, Douglas, “Right-angle corners,” Printed Circuit Design, vol. 14 no. 2, pp. 36–37, February 1997.Google Scholar
  24. Brooks, Douglas, “Slots in Planes: Don't Use 'Em,” Printed Circuit Design, vol. 16 no. 3, pp. 36–37, March 1999.Google Scholar
  25. Brooks, Douglas, “Some Trace Routing Issues,” Printed Circuit Design, vol. 13 no. 11, pp. 29, November 1996.Google Scholar
  26. Brooks, Douglas, “Splitting Planes For Speed and Power,” Printed Circuit Design, December 2000.Google Scholar
  27. Brooks, Douglas, “The Effects of Vias on PCB Traces,” Printed Circuit Design, August 1996, vol. 13 no. 8, pp. 22–27, August 1996. download from http://www.ultracad.com/t009.pdfGoogle Scholar
  28. Chang, Narhyuck, “High-Speed Board Design Techniques,” March 5, 1999. download from http://cselab.snu.ac.kr/course/cad99/hspeed.pdfGoogle Scholar
  29. Chen, Huabo, and Fang, Jiayuan, “Effects of 20-H Rule and Shielding Vias on Electromagnetic Radiation From Printed Circuit Boards,” IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, AZ, October 23–25, 2000, pp. 193–196.Google Scholar
  30. Clarkson, Mark, “Designing the Noise out of DA Boards,” Sensors Data Acquisition, pp. 20–25, 1998.Google Scholar
  31. Coleman, Dave, “Layout Level Analysis,” Printed Circuit Design, vol. 11 no. 7, pp. 10–16, July 1994.Google Scholar
  32. Cui, Wei, Ye, Xiaoning, Archambeault, Bruce, White, Doug, Li, Min, and Drewniak, James L., “EMI resulting from Signal Via Transitions through the DC Power Bus,” IEEE International Symposium on Electromagnetic Compatibility Symposium Record Volume Two, Washington, D.C., Aug. 21–25, 2000, pp. 821–826.Google Scholar
  33. Fan, Juan, Ren, Yong, Chen, Juan, Hockanson, David M., Shi, Hao, Drewniak, James L., Hubing, Todd H., Van Doren, Thomas P., and DuBroff, Richard E., “RF Isolation Using Power Islands in DC Power Bus Design,” 1999 IEEE EMC Symposium Recod, Volume 2, Seattle, WA, August 2–6, 1999, pp. 838–843.Google Scholar
  34. Georgieva, Natalia, Chen, Zhizhang, and Oberhammer, Wolfgang, “On Resonant Effects in Multilayer RF/Microwave Printed Circuit Board Applications,” IEEE Transactions on Advanced Packaging, vol. 22 no. 2, pp. 200–206, May 19CrossRefGoogle Scholar
  35. Gerke, Daryl, and Kimmel, Bill, “The Designer's Guide to Electromagnetic Compatibility,” EDN, vol. 39 no. 2, pp. S3–S114, January 20, 1994.Google Scholar
  36. Getz, Robin, and Moeckel, Bob, “Understanding and Eliminating EMI in Microcontroller Applications,” National Semiconductor Application Note 1050, August 1996.Google Scholar
  37. Gilleo, Ken, “A New Multilayer Circuit Process Based on Anisotropicity.”Google Scholar
  38. Harada, Takashi, Sasaki, Hideki, and Kami, Yoshio, “Controlling Power-Distribution-Plane Resonance in Multilayer Printed Circuit Boards,” IEICE Transactions on Communications, vol. E83-B no. 3, pp. 577–585, Mar. 2000. download from http://search.ieice.org/2000/pdf/e83-b_3_577.pdfGoogle Scholar
  39. Harada, Takashi, Sasaki, Hideki, and Kami, Yoshio, “Investigation on Radiated Emission Characteristics of Multilayer Printed Circuit Boards,” IEICE Transactions on Communications, vol. E80-B no. 11, pp. 1645–1651, Nov. 1997Google Scholar
  40. Harada, Takashi, Sasaki, Hideki, and Kami, Yoshio, “Radiated Emission Arising from Power Distribution in Multilayer Printed Circuit Boards,” IEEE 1997 International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 18–22, 1997, pp. 518–522.Google Scholar
  41. Haussmann, Gary, Matthews, Marty, and Gisin, Franz, “Impact on Radiated Emissions of Printed Circuit Board Stitching,” 1999 IEEE EMC Symposium, Seattle, WA, Aug. 2–6, 1999, pp. 793–796.Google Scholar
  42. Henke, Reinhold and Ohnstad, Daniel, “EMC-Controlled Board Design,” Printed Circuit Design, vol. 8 no. 7, pp. 28–37, July 1991.Google Scholar
  43. Hockanson, David, and Nuebel, Joe, “Report on the Efficacy of Split Groundplanes as an EMI Deterrent,” Electromagnetic Compatibility Laboratory TR97-1-020, February 19, 1997.Google Scholar
  44. Hubing, Todd, Chen, Juan, Drewniak, James, Van Doren, Tom, Ren, Yong, Fan, Jun, and DuBroff, Richard, “Power Bus Noise Reduction Using Power Islands in Printed Circuit Board Designs,” Nov. 11, 1999. download from http://www.ewh.ieee.org/r5/denver/rockymountainemc/archive/PowerBus2.pdfGoogle Scholar
  45. Johnson, Howard, “Bypass Capacitor Layout,” Printed Circuit Design, vol. 14 no. 8, Aug. 1997. download from http://signalintegrity.com/articles/straight/bypass.htmGoogle Scholar
  46. Johnson, Howard, “Improving Bypass Capacitor Layout.” Printed Circuit Design, vol. 14 no. 9, pp. 27–28, Sep. 1997.Google Scholar
  47. Johnson, Howard, “Measuring Power Plane Resonance,” High-Speed Digital Design On-Line Newsletter, vol. 2 issue 27. download from http://www.sigcon.com/news/2_27.htmGoogle Scholar
  48. Johnson, Howard, “Moats and Floats,” Electronic Design, vol. 45 no. 4, pp. 181, Feb. 17, 1997. download from http://www.sigcon.com/articles/straight/moats.htmGoogle Scholar
  49. Johnson, Howard, “Signal Integrity: What's that got to do with it?,” Seattle, WA: August 2, 1999.Google Scholar
  50. Ladd, Darcy N., and Costache, George I., “Considerations of Using Vias as a Cross-Talk Reduction Technique,” Electromagnetic Compatibility 1991, Zurich, Switzerland, March 12–14, 1991, pp. 631–634.Google Scholar
  51. Leferink, Frank B. J., and Doorn, Marcell J. C. M. van, “Inductance of Printed Circuit Board Ground Planes,” 1993 International Symposium on Electromagnetic Compatibility, Dallas, TX, Aug. 9–13, 1993, pp. 327–329.Google Scholar
  52. Loaiza-Montiel, Rosie, “Layout techniques boost dynamic range for high-speed ICs,” EDN, June 23, 1994. download from http://www.ednmag.com/reg/1994/062394/13df1.htmGoogle Scholar
  53. Luciano, Dante, “Maximizing PCB Real Estate Through Buried and Blind Vias,” Surface Mount Technology, vol. 6 no. 12, pp. 17–19. October 1992.Google Scholar
  54. McCammon, Roy, “Guard Rings: Quantitative estimates of leakage reduction,” Printed Circuit Design, vol. 15 no. 1, pp. 19–26, January 1998.Google Scholar
  55. McCune, Earl, “Ground-current control enhances dynamic range in high-speed circuits,” EDN, Jan. 19, 1995. download from http://www.ednmag.com/reg/1995/011995/02df3.htmGoogle Scholar
  56. Montrose, Mark I., “Analysis on Loop Area Trace Radiated Emissions from Decoupling Capacitor Placement on Printed Circuit Boards,” 1999 IEEE International Symposium on Electromagnetic Compatibility Symposium Record Volume One, Seattle, WA, Aug. 2–6, 1999, pp. 423–428.Google Scholar
  57. Montrose, Mark I., “Printed Circuit Board Suppression Concepts for EMC Compliance,” ITEM, 1998. download from http://www.rbitem.com/ITEM_Publications/ITEM_Archives/i98art02.htmGoogle Scholar
  58. Montrose, Mark I., “Time and Frequency Domain Analysis for Right Angle Corners on Printed Circuit Board Traces,” 1998 IEEE EMC Symposium Record Volume One, Denver, CO, August 24–28, 1998, pp. 551–556.Google Scholar
  59. Morgan, Chad, and Helster, Dave, “The Impact of PWB Construction on High-Speed Signals,” DesignCon 99.Google Scholar
  60. Novak, Istvan, “Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by Dissipative Edge Termination,” 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, NY, Oct. 26–28, 1998, pp. 181–184.Google Scholar
  61. Radu, S., Zeeff, T., Nuebel, J., Drewniak, J. L., Van Doren, T. P., and Hubing, T. H., “An Impact of Layer Stack-up on EMI,” 1998 IEEE EMC Symposium, Denver, CO, Aug. 24–28, 1998, pp. 828–833.Google Scholar
  62. Raper, Tim, and Knauber, Steve, “Designing for Electromagnetic Interference (EMI) Compliance,” AMD Application Note 22507, Mar. 1999. download from http://www.amd.com/products/epd/processors/2.16bitcont/16bitmc/22507/22507.pdfGoogle Scholar
  63. Ritenour, Thurman J. “Stopping Noise Before It Starts,” Medical Electronics Manufacturing, Fall 1998. download from http://www.devicelink.com/mem/archive/98/10/007.htmlGoogle Scholar
  64. Rogers, Philip, “Board layout boosts power-supply performance,” EDN. download from http://www.ednmag.com/reg/1998/110598/23ms435.htmGoogle Scholar
  65. Rothermel, Brent R., Helster, David W., and Sharf, Alex M., “Practical Guidelines for Implementing 5 Gbps in Copper Today, and the Roadmap to 10 Gbps,” DesignCon 2000.Google Scholar
  66. Sayre, Edward, Baxter, Michael, and Chen, Jinhua, “Limits of FR-4 in High-Speed Designs.” download from http://www.nesa.com/tech_papers/fr4loss.pdfGoogle Scholar
  67. Sayre, Edward P., Chen, Jinhua, and Baxter, Michael A., “OC-48/2.5Gbps Interconnect Engineering Design Rules,” 1999 Digital Communications System Design Conference. download from http://www.nesa.com/tech_papers/2.5gbit.pdfGoogle Scholar
  68. Schaper, L. M., Ang, S., Low, Yee L., and Oldham, Danny R., “Electrical Characterization of the Interconnected Mesh Power System (IMPS) MCM Topology,”, IEEE Transactions on Components, Hybrids, and Manufacturing Tech–Part B, vol. 18 no. 1, pp. 99–105, Feb. 1995.CrossRefGoogle Scholar
  69. Siulinski, James A., “Design and layout rules eliminate noise coupling in communication systems,” EDN, June 20, 1996. download from http://www.ednmag.com/reg/1996/062096/13df3.htmGoogle Scholar
  70. Slattery, Bill, and Wynne, John, “Design and layout of a video graphics system for reduced EMI,” Microprocessors and Microsystems, vol. 15 no. 2, pp. 97–112, Mar. 1991.CrossRefGoogle Scholar
  71. Smith, Tim S., and Paul, Clayton R., “Effect of Grid Spacing on the Inductance of Ground Grids,” 1991 International Symposium on Electromagnetic Compatibility, Cherry Hill, NJ, Aug. 12–16, 1991, pp. 72–77.Google Scholar
  72. Solberg, Vern, “DFA: What the Designer Needs to Know,” SMT, vol. 12 no. 8, pp. 142–152, August 1998.Google Scholar
  73. Stoddard, J., and Goodrum, A., “Electrical-design considerations for PCI-X and 66-MHz PCI cards,” EDN, vol. ? no. 19, pp. 85–92, Aug. 30, 2001. download from http://www.e-insite.net/ednmag/index.asp?layout=article&articleId=CA152874&stt=001Google Scholar
  74. Stopperan, Jahn, “Rigid-Flex: The Old and the New.”Google Scholar
  75. Strom, Stephen, “IC alignment and layout considerations,” Electronic Packaging and Production, pp. 149–151, March 1980.Google Scholar
  76. Taylor, Robert, “Component Placement for EMC,” Printed Circuit Design, vol. 13 no. 1, pp. 19–24, 45, January 1886.Google Scholar
  77. Voss, Bernard, and Goedecke, Stephanie, “The Layout of Mixed-Signal PCBs for PCB Design.” download from http://www.siqual.com/publications/mixsig_pcb_layout.pdfGoogle Scholar
  78. Warmke, Rich, “Designing a Multimedia Subsystem with Rambus DRAMs,” Multimedia Systems Design, March 1998. download from http://www.msdmag.com/98/9803art5.htmGoogle Scholar
  79. Williamson, Tom, “Designing Microcontroller Systems for Electrically Noisy Environments,” Intel Application Note AP-125, December 1993.Google Scholar
  80. Zhao, Jin, Zhang, Jingping, and Fang, Jiayuan, “Effects of Power/Ground Via Distribution on the Power/Ground Performance of C4/BGA Packages.”Google Scholar
  81. Zhao, Jin and Fang, Jiayuan, “Validity of Mutual Inductor Model for Electromagnetic Coupling between Vias in Integrated-Circuit Packages and Printed Circuit Boards,” 48th Electronic Components & Technology Conference, Seattle, WA, May 25–29, 1998. download from http://www.sigrity.com/papers/ectc98/p306.htmGoogle Scholar

Web Pages

  1. COMPARATIVE TRACKING INDEX (CTI) OF ELECTRICAL INSULATION TAPES,” P. Leo & Co., 1996–2000. download from http://www.pleo.com/tape/cti.htmGoogle Scholar
  2. Wallace, Hank, “Electronics Design Checklist,” 1998–1999. download from http://www.aqdi.com/pubs.htmGoogle Scholar

Copyright information

© Kluwer Academic Publishers 2004

Authors and Affiliations

  • John R. Barnes

There are no affiliations available

Personalised recommendations