Journal of Electronic Materials

ISSN: 0361-5235 (Print) 1543-186X (Online)

All Volumes & Issues

Volume 48 January 2019 - February 2019

  • February 2019, Issue 2
  • January 2019, Issue 1

    Special Sections: TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder. Guest Editors: Kazuhiro Nogita, Fan-Yi Ouyang, Sergey A. Belyakov, Chih Chen, Christopher M. Gourlay, Kwang-Lung Lin, Won-sik Hong, Mehran Maalekian; and TMS2018 Phase Stability in Electronic Materials. Guest Editor: Shih-kang Lin

Volume 47 January 2018 - December 2018

  • December 2018, Issue 12
  • November 2018, Issue 11
  • October 2018, Issue 10

    Special Section: U.S. Workshop on Physics and Chemistry of II-VI Materials 2017. Guest Editors: N. K. Dhar and S. Sivananthan

  • September 2018, Issue 9

    Special Section: 17th Conference on Defects-Recognition, Imaging and Physics in Semiconductors (DRIP XVII). Guest Editors: Oscar Martínez Sacristán, Martina Baeumler, Deren Yang, Ute Zeimer, Jean-Pierre Landesman, Helena Castan Lanaspa

  • August 2018, Issue 8

    Special Sections: 18th International Conference on II–VI Compounds and Related Materials. Guest Editors: Xinyu Liu and Aidong Shen; and 5th European Conference on Renewable Energy Systems. Guest Editors: Erol Kurt and Shadia Jamil Ikhmayies

  • July 2018, Issue 7
  • June 2018, Issue 6

    2017 International Conference on Thermoelectrics. Guest Editors: Jihui Yang, Matt Beekman, Ryoji Funahashi,Yuri Grin, Emmanuel Guilmeau, Betrand Lenoir, Donald Morelli,Takao Mori, James Salvador, David Singh, Tsunehiro Takeuchi, Xinfeng Tang, Chunlei Wan, Hsin Wang, Shanyu Wang, Wenqing Zhang, Tie-Jun Zhu

  • May 2018, Issue 5
  • April 2018, Issue 4
  • March 2018, Issue 3
  • February 2018, Issue 2

    Special Section: 59th Electronic Materials Conference 2017. Guest Editors: Shadi Shahedipour-Sandvik, Joshua Caldwell, Charles Lutz, Jamie Phillips, Adrienne Stiff-Roberts, Joshua Zide, Nadeem Mahadik, and Patrick B. Shea

  • January 2018, Issue 1

    Special Section: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI. Guest Editors:Shih-kang Lin, Chao-hong Wang, and Chih-Ming Chen; and Special Section: Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Fan-Yi Ouyang, Albert Wu, C. Robert Kao, Yan Li, Babak Arfaei, and Kazuhiro Nogita

Volume 46 January 2017 - December 2017

Volume 45 January 2016 - December 2016

  • December 2016, Issue 12

    TMS Special Sections: Alloys and Compounds for Thermoelectric and Solar Cell Applications IV; Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV. 58th EMC Special Section: 2016 Electronic Materials Conference

  • November 2016, Issue 11
  • October 2016, Issue 10
  • September 2016, Issue 9

    2015 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Guest Editors: S. Sivananthan and N.K. Dhar

  • August 2016, Issue 8

    Special Section: Third European Conference on Renewable Energy Systems. Guest Editors: Erol Kurt and Shadia Ikhmayies

  • July 2016, Issue 7
  • June 2016, Issue 6
  • May 2016, Issue 5

    International Workshop on Nanoscience and Nanotechnology: Opportunities for Academia & High Tech Industry - Joint 4th Asia-Pacific Chemical and Biological Microfluidics Conferences (IWNN-APCBM 2015). Guest Editors: Manh-Huong Phan, Nguyen Xuan Phuc, and Tran Dai Lam

  • April 2016, Issue 4

    Special Section: 2015 Electronic Materials Conference. Guest Editors: Joshua Caldwell, Joshua Zide, Suzanne Mohney, Jamie Phillips, F. Shadi Shahedipour-Sandvik, Nadeem Mahadik, Fareed Qhalid, Suchi Guha, Rachel Goldman, Jian Xu, Angel Yanguas-Gil, Ganesh Balakrishnan

  • March 2016, Issue 3

    2015 International Conference on Thermoelectrics. Guest Editors: Jihui Yang, Matt Beekman, Donald Morelli, James Salvador, David Singh, Hsin Wang, Emmanuel Guilmeau, Juri Grin, Bertrand Lenoir, Xinfeng Tang, Wenqing Zhang, Chunlei Wan, TieJun Zhu, Ryoji Funahashi, Takao Mori, Tsunehiro Takeuchi, Sabah Bux

  • February 2016, Issue 2
  • January 2016, Issue 1

    Special Sections: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII; and Advanced Materials for Power Electronics and Power Conditioning Systems

Volume 44 January 2015 - December 2015

Volume 43 January 2014 - December 2014

  • December 2014, Issue 12

    Special Sections from the 2014 TMS Annual Meeting: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang

  • November 2014, Issue 11
  • October 2014, Issue 10

    European Conference on Thermoelectrics 2013. Guest Editors: Andrea Amaldi and Francois Tang

  • September 2014, Issue 9
  • August 2014, Issue 8

    2013 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Guest Editors: S. Sivananthan and N. K. Dhar

  • July 2014, Issue 7
  • June 2014, Issue 6

    International Conference on Thermoelectrics 2013. Guest Editors: Jihui Yang, Hiroaki Anno, Matt Beekman, Ryoji Funahashi, Yuri Grin, Emmanuel Guilmeau, Jan Koenig, Bertrand Lenoir, Don Morelli, Lasse Rosendahl, James R. Salvador, Jeff Sharp, David Singh, Tsunehiro Takeuchi, Xiegeng Tang, Chunlei Wang, Hsin Wang, Wenqing Zhang, and Tie-Jun Zhu

  • May 2014, Issue 5
  • April 2014, Issue 4

    2013 Electronic Materials Conference. Guest Editors: Joshua Caldwell, Rachel Goldman, Oana Jurchescu, Xuiling Li, Suzanne Mohney, Jamie Phillips, Grace Xing, Jian Xu, and Joshua Zide

  • March 2014, Issue 3

    Special Section: Mechanical Reliability of Electronic Components; Guest Editor: Narayanaswami Ranganathan

  • February 2014, Issue 2
  • January 2014, Issue 1

    Special Sections from the 2013 TMS Annual Meeting: Lead-Free Solders; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reaction Phase Formation in Electronic Materials. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang

Volume 42 January 2013 - December 2013

Volume 41 January 2012 - December 2012

Volume 40 January 2011 - December 2011

Volume 39 January 2010 - December 2010