MICRO SYSTEM Technologies 2001, Conference, Düsseldorf, 27th to 29th March 2001 FOREWORD Pages: 203 - 203
Laser micromaching and light induced reaction injection molding as suitable process sequence for the rapid fabrication of microcomponents T. HanemannW. PflegingK.-H. Zum Pages: 209 - 214
A new approach for the assembly of lenses in front of flexible miniature fibre-scopes T. PfeiferG. DusslerF. Bitte Pages: 220 - 224
Wear resistant tools for reproduction technologies produced by micro powder metallurgy A. RotaT.-V. DuongT. Hartwig Pages: 225 - 228
Reduction of the optical loss and optimization of polycyanurate thermosets used in integrated optics C. DreyerM. BauerC. Zawadzki Pages: 229 - 238
Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering G. ElgerM. HutterE. Jäger Pages: 239 - 243
Multichip module with free-space optical interconnects and VCSEL-solder-joints C. GimkiewiczD. Hagedorn Pages: 249 - 255
Microfabrication of single-use plastic microfluidic devices for high-throughput screening and DNA analysis A. GerlachG. KnebelTH. Sshaller Pages: 265 - 268
Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study S.-Y. JangJ. WolfK.-W. Paik Pages: 269 - 272