Temperature compensation of micromachined silicon hot wire sensor using ANN technique M. LaghroucheB. IdjeriS. Ameur Review Paper 07 February 2012 Pages: 237 - 246
Mechanical and tribological characterization of a thermally actuated MEMS cantilever Marius PustanVéronique RochusJean-Claude Golinval Technical Paper 11 January 2012 Pages: 247 - 256
Hot embossing at viscous state to enhance filling process for complex polymer structures Xuelin ZhuTerrence W. SimonTianhong Cui Technical Paper 17 December 2011 Pages: 257 - 265
Flexible balloon actuators for active flow control Haifeng LvChengyu JiangWeizheng Yuan Technical Paper 17 January 2012 Pages: 267 - 275
Determination of residual stress in deep submicron thick films by the critical buckling technique of annular thin plates Da-Yong QiaoXiao-Pei Zheng Technical Paper 06 January 2012 Pages: 277 - 282
Design and characterization of an integrated multifunction micro sensor Yulong ZhaoWeizhong WangZhuangde Jiang Technical Paper 07 February 2012 Pages: 283 - 294
Design and fabrication of a resonant scanning micromirror suspended by V shaped beams with vertical electrostatic comb drives Xiao-Ying LiQian JinYao-Bo Liu Technical Paper 24 December 2011 Pages: 295 - 302
Flip chip solder bump inspection using vibration analysis Junchao LiuTielin ShiGuanglan Liao Technical Paper 02 February 2012 Pages: 303 - 309
Disposable microfluidic chip for rapid pathogen identification with DNA microarrays Johannes R. PehamLisa-Maria RecnikHerbert Wiesinger-Mayr Technical Paper 20 December 2011 Pages: 311 - 318
Determination of residual stresses in a single crystalline 3C-SiC micro-fabricated structure using FE model and measured resonance frequencies Musaab Hassan Technical Paper 07 February 2012 Pages: 319 - 324
A three-axis SOI accelerometer sensing with both in-plane and vertical comb electrodes Jin XieRahul AgarwalJulius Minglin Tsai Technical Paper 15 December 2011 Pages: 325 - 332
Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps Woo-Chang ChoiJee-Youl Ryu Technical Paper 09 February 2012 Pages: 333 - 339
Microelectronic chip cooling: an experimental assessment of a liquid-passing heat sink, a microchannel heat rejection module, and a microchannel-based recirculating-liquid cooling system Bin LuW. J. MengFanghua Mei Technical Paper 14 December 2011 Pages: 341 - 352
Improved process flow for buried channel fabrication in silicon Z. FeketeA. PongráczG. Battistig Technical Paper 07 February 2012 Pages: 353 - 358
Modelling and evaluation of a thermal microfluidic sensor fabricated on plastic substrate G. P. PatsisA. PetropoulosG. Kaltsas Technical Paper 30 December 2011 Pages: 359 - 364
Embedding conductive patterns of elastomer nanocomposite with the assist of laser ablation Chao-Xuan LiuJin-Woo Choi Technical Paper 15 December 2011 Pages: 365 - 371
Fabrication of polystyrene microfluidic devices using a pulsed CO2 laser system Huawei LiYiqiang FanIan G. Foulds Technical Paper 29 December 2011 Pages: 373 - 379