High-aspect-ratio, molded microstructures with electrical isolation and embedded interconnects L. MullerR. T. HoweA. P. Pisano Pages: 47 - 54
A flexible encapsulated MEMS pressure sensor system for biomechanical applications N. K. S. LeeR. S. GoonetillekeGeommi M. Y. So Pages: 55 - 62
A MUMPs angular-position and angular-speed sensor with off-chip wireless transmission W. SunW. J. LiY. Xu Pages: 63 - 70
New type X-ray mask fabricated using inductively coupled plasma deepetching D. ChenW. LeiF. Yi Pages: 71 - 74
Numerical analyses of the micromirror for projection TV using FEM K. JungJ. LeeB. Choi Pages: 75 - 79
Microfabrication of thick tungsten films for use as absorbers of deep X-ray lithography masks H. OkuyamaY. HirataH. Takada Pages: 80 - 84