Volume 991, Issue 1

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December 2006

Symposium C — Advances and Challenges in Chemical Mechanical Planarization

Issue Editors:

C. Borst,
L. Economikos,
A. Philipossian,
G. Zwicker

40 articles in this issue

Towards a Quantitative Description of Pattern-Dependent Planarization with Ceria Slurries
Roland Rzehak
Thomas Vogel
OriginalPaper 30 December 2007 Article: 1305
Single Asperity Tribochemical Wear of Silicon by Atomic Force Microscopy
Futoshi Katsuki
OriginalPaper 30 December 2007 Article: 1303
Contact Model for a Pad Asperity and a Wafer Surface in the Presence of Abrasive Particles for Chemical Mechanical Polishing
Dincer Bozkaya
Sinan Muftu
OriginalPaper 30 December 2007 Article: 1302
On a Particle-Augmented Mixed Lubrication Approach to Predicting CMP
C. Fred Higgs
Elon J. Terrell
Sarah Biltz
OriginalPaper 30 December 2007 Article: 1301
Application of Scatterometry to BEOL Measurements: Post Cu CMP Measurements
Deepak Kulkarni
Shom Ponoth
Alex Elia
OriginalPaper 30 December 2007 Article: 1203
Wafer Level Modeling of Electrochemical-Mechanical Polishing (ECMP)
Daniel Truque
Xiaolin Xie
Duane Boning
OriginalPaper 30 December 2007 Article: 1104
ECMP Enhances the Planarization Efficiency — a Phenomenon of Reverse Topography during Cu Removal
Feng Q Liu
Wei-Yung Hsu
Liang Chen
OriginalPaper 30 December 2007 Article: 1103
Effects of Additives in KOH Based Electrolytes on Cu ECMP
Tae-Young Kwon
In-Kwon Kim
Jin-Goo Park
OriginalPaper 30 December 2007 Article: 1102
Enabling Damascene Solutions for 45 nm Beyond
Manabu Tsujimura
OriginalPaper 30 December 2007 Article: 1101
Development and Optimization of Slurry for Ru CMP
In-Kwon Kim
Tae-Young Kwon
Hyung-Soon Park
OriginalPaper 30 December 2007 Article: 1004
Effect of Wettability of Poly Silicon on CMP Behavior
Young-Jae Kang
Bong-Kyun Kang
Chang-Ki Hong
OriginalPaper 30 December 2007 Article: 906
A Study in Selectivity Variations of WCMP Slurries Related to pH, ζ-Potential and Dilutions with De-Ionized Water
Davide Gianni
Silvia Ardizzone
Norberto Masciocchi
OriginalPaper 30 December 2007 Article: 904
Surfactants in Controlling Removal Rates and Selectivity in Barrier Slurry for Cu CMP
Jinru Bian
OriginalPaper 30 December 2007 Article: 903
Improved Defect Classification Techniques of a Laser Scattering Detection System for Post CMP Silicon Dioxide Wafers
Daniel Mateja
Toshi Kasai
Haresh Siriwardane
OriginalPaper 30 December 2007 Article: 902
New Particle Metrology for CMP Slurries
S. Kim R. Williams
Ilyong Park
Mansour Moinpour
OriginalPaper 30 December 2007 Article: 901
Composite polymer core – ceria shell abrasive particles during silicon oxide CMP
Silvia Armini
Joke De Messemaeker
Karen Maex
OriginalPaper 30 December 2007 Article: 804
Screening Study on Frictional Force Analysis in Relation to Silica Abrasive and Slurry Properties
Yun Zhuang
Yasa Adi Sampurno
Ara Philipossian
OriginalPaper 30 December 2007 Article: 803
Nano-scale Characterization of Surface Defects on CMP-finished Si Wafers by Scanning Probe Microscopy Combined with Laser Light Scattering
Kenta Arima
Takushi Shigetoshi
Mizuho Morita
OriginalPaper 30 December 2007 Article: 802
Cu Post-CMP Displacement Cleaning: A Mechanistic Product Development Approach Based on Selected Thermodynamic and Kinetic Data
Darryl W. Peters
OriginalPaper 30 December 2007 Article: 801
High Rate Silicon Carbide Polishing to Ultra-Smooth Surfaces
Michael L. White
Kevin Moeggenborg
Nevin Naguib
OriginalPaper 30 December 2007 Article: 702
An Approach to Modeling Particle-Based and Contact-Based Wear in CMP
Elon Jahdal Terrell
Michael Kuo
C. Fred Higgs
OriginalPaper 30 December 2007 Article: 604
Micromachined Shear Stress Sensors for Characterization of Surface Forces during Chemical Mechanical Polishing
Andrew Mueller
Robert White
Mansour Moinpour
OriginalPaper 30 December 2007 Article: 603
Experimental Investigation and Numerical Simulation of Pad Stain Formation during Copper CMP
Hyosang Lee
Yun Zhuang
Ara Philipossian
OriginalPaper 30 December 2007 Article: 602
Advances in Understanding and Control of CMP Performance: Contact-Hydrodynamics at Wafer, Groove, and Asperity Scale
Gregory P. Muldowney
OriginalPaper 30 December 2007 Article: 601
Particles as Transport Carriers in CMP Slurries
Daniela White
John Parker
Vinayak Dravid
OriginalPaper 30 December 2007 Article: 505
Influence of Microstructure on Aggressive Chemical Mechanical Planarization Processes for Thick Copper Films
Patrick J. Andersen
Megan Frary
OriginalPaper 30 December 2007 Article: 504
Measurement of Interactions between Abrasive Silica Particles and Copper, Titanium, Tungsten and Tantalum
Ruslan Burtovyy
Alex Tregub
Igor Luzinov
OriginalPaper 30 December 2007 Article: 503
Low Defect Ceria for ILD CMP
Jai Kasthurirangan
John Parker
Charles Dowell
OriginalPaper 30 December 2007 Article: 404
Advances in the Characterization of Particle Size Distributions of Abrasive Particles used in CMP
Mungai Kamiti
Stacey Popadowski
Edward E. Remsen
OriginalPaper 30 December 2007 Article: 403
Particle Metrology in CMP Slurries - Potential and Limitations of Relevant Measuring Methods
Michael Stintz
Herbert Barthel
Mansour Moinpour
OriginalPaper 30 December 2007 Article: 402
AFM Investigations of Chemical-Mechanical Processes on Silicon(100) Surfaces
Ruiji Iomoto
Forrest Stevens
Tom Dickinson
OriginalPaper 30 December 2007 Article: 401
Newly Developed Abrasive-Free Copper CMP Slurry Based on Electrochemical Analysis
Jin Amanokura
Katsumi Mabuchi
Haruo Akahoshi
OriginalPaper 30 December 2007 Article: 301
Spectroscopic and Topographic Investigations of Nanoparticle Abrasive Retention in Polyurethane CMP Pads for Cu CMP
Iftikhar Ul-hasan
Robert Geer
OriginalPaper 30 December 2007 Article: 202
Fundamentals of Post-CMP Cleaning
Jin-Goo Park
Tae-Gon Kim
OriginalPaper 30 December 2007 Article: 201
Investigation of Diamond Grit Size and Conditioning Force Effect on CMP Pads Topography
Ting Sun
Leonard Borucki
Ara Philipossian
OriginalPaper 30 December 2007 Article: 107
Computational Solid Mechanics Modeling of Asperity Deformation and Pad-Wafer Contact in CMP
Bo Jiang
Gregory P. Muldowney
OriginalPaper 30 December 2007 Article: 105
Determining Pad-Wafer Contact using Dual Emission Laser Induced Fluorescence
Caprice Gray
Chris Rogers
Sriram Anjur
OriginalPaper 30 December 2007 Article: 104
Surface Chemical Characteristics of CMP Polyurethane Pads
Hongqi Xiang
Abaneshwar Prasad
Edward E. Remsen
OriginalPaper 30 December 2007 Article: 103
The Impact of Diamond Conditioning on Surface Contact in CMP Pads
Carolina L. Elmufdi
Gregory P. Muldowney
OriginalPaper 30 December 2007 Article: 102
CMP Active Diamond Characterization and Conditioner Wear
Leonard Borucki
Rumin Zhuang
Naoki Rikita
OriginalPaper 30 December 2007 Article: 101

Volume 991, Issue 1

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