Towards the Integration of Barium Ferrite Sputtered Films for Coplanar Isolators and Circulators in the Millimeter Wave Range A.-S. DehlingerM. Le BerreJ. J. Rousseau OriginalPaper 01 March 2007 Article: 606
Power and Radio Frequency Inductors Using a Hybrid Ferrite-Flex Foil Technology Martin GijsMenouer Saidani OriginalPaper 01 March 2007 Article: 604
Integration of PZT on SOI Wafers: Increasing Piezoelectric Film Thickness for Providing a Wide Range of Ultrasonic MEMS Applications Brahim BelgacemFlorian CalamePaul Muralt OriginalPaper 01 March 2007 Article: 509
BCB Based Packaging for Low Actuation Voltage RF MEMS Devices David PeyrouFabienne PENNECRobert Plana OriginalPaper 01 March 2007 Article: 506
Single-Mode Polymer Optical Fiber Sensors for Large Strain Applications Sharon M. KieselKara PetersMervyn Kowalsky OriginalPaper 01 March 2007 Article: 505
Studies on Curvature Deformation Control of Bilayer Cantilever Fabricated by Surface Micromachining of SOI Wafer Yu-Ming HuangMasayuki SohgawaHaruo Noma OriginalPaper 01 March 2007 Article: 501
Layered Compound Semiconductor GaSe and GaTe Crystals for THz Applications Krishna C. MandalSung H. KangMichael K. Choi OriginalPaper 01 March 2007 Article: 315
Development of Structure-Property Relationships in Disordered Zirconia Thin Films for High Energy Density Mim Capacitors Guneet SethiMichael T. LanaganMark W. Horn OriginalPaper 01 March 2007 Article: 314
A Charge Feedback Controller for a Piezoelectric Voltage Amplifier/Driver Maciej NorasPeter McAnnJerzy Kieres OriginalPaper 22 March 2007 Article: 312
Tailoring Magnetic Microspheres with Controlled Porosity Muhammet S. ToprakBrandon J. McKennaGalen D. Stucky OriginalPaper 01 March 2007 Article: 311
Fabrication of SiN-assisted 0.12um AlGaAs/InGaAs PHEMT and 60GHz-band MMICs for 60GHz WPAN system Hokyun AhnJong-Won LimHaecheon Kim OriginalPaper 05 March 2007 Article: 310
γ-Irradiation Stimulated Change of Recycled Polypropylene Composites Dielectric Permittivity Ulmas GafurovZ. Fazilova OriginalPaper 01 March 2007 Article: 309
Strategy for the Integration of PLZT Thin Films on Base-Metal Foils for High Voltage Embedded Passives Beihai MaU. BalachandranKrishna Uprety OriginalPaper 01 February 2007 Article: 307
Dielectric Properties of PCB Embedded Bismuth-Zinc-Niobium Films Prepared using RF Magnetron Sputtering Seungeun LeeJung Won LeeYul Kyo Chung OriginalPaper 05 March 2007 Article: 107
An Approach for Characterizing Residual Mechanical Stress Caused by Packaging Processes Soeren HirschBertram Schmidt OriginalPaper 01 March 2007 Article: 106
Influence of Full-filled Polymer Molding on High-frequency Circuits Kiyoshi NakanishiMasayuki Fujimoto OriginalPaper 01 March 2007 Article: 105
A Patch-Type Flexible Physiological Monitor on a Non-Woven Material Wen-Yang ChangJin-Sheng ChangYu-Cheng Lin OriginalPaper 20 February 2007 Article: 105
Investigation of Ultralow Loss Interconnection Technique for LTCC based System-in-Package(SIP) Technology at 60GHz Dong-Young KimJae Kyoung MunHaechoen Kim OriginalPaper 22 March 2007 Article: 104
Through Wafer Interconnects - A Technology not only for Medical Applications Gereon VogtmeierChristian DrabeAlexander Wolter OriginalPaper 01 March 2007 Article: 103
Process and Material Requirements for Successful Heterogonous Passive Component Integration in RF System Eric BeyneWalter De RaedtPhilippe Soussan OriginalPaper 01 March 2007 Article: 102
Silicon Based System-in-Package : Breakthroughs in Miniaturization and ‘Nano’-integration Supported by Very High Quality Passives and System Level Design Tools Franck MurrayFrançois LeCornecFred Roozeboom OriginalPaper 01 March 2007 Article: 101
