Volume 914, Issue 1

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December 2005

Symposium F — Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects

Issue Editors:

T. Y. Tsui,
Y-C. Joo,
A. A. Volinsky,
M. Lane,
L. Michaelson

66 articles in this issue

Evaluation of Inhibitors for ECMP of Copper Using Electrochemical Quartz Crystal Microbalance (EQCM) Technique
Ashok Muthukumaran
Viral Lowalekar
Srini Raghavan
OriginalPaper 18 June 2006 Article: 1209
CMP-induced Peeling in Multi-level Ultra Low-k / Cu Interconnects
Patrick Leduc
Thierry Farjot
Gerard Passemard
OriginalPaper 14 May 2006 Article: 1207
A Novel Optical Technique to Measure Pad-Wafer Contact Area in Chemical Mechanical Planarization
Carolina L. Elmufdi
Gregory P. Muldowney
OriginalPaper 24 May 2006 Article: 1206
AFM Measurements of Adhesion between CMP Slurry Particles and Copper
Ruslan Burtovyy
Yong Liu
Igor Luzinov
OriginalPaper 15 June 2006 Article: 1205
The Role of Arginine as a Complexing Agent in Copper CMP
Surya Sekhar Moganty
Ramanathan Srinivasan
OriginalPaper 24 May 2006 Article: 1203
Applications of Raman Spectroscopy in Cu CMP: In-situ Detection of Chemical Species in the Slurry
Siddartha Kondoju
Pierre Lucas
Andrea Oehler
OriginalPaper 24 May 2006 Article: 1202
Determination of Poisson’s Ratio of Thin low-k Films using Bidirectional Thermal Expansion Measurement
Jiping Ye
Satoshi Shimizu
Junnji Noro
OriginalPaper 15 June 2006 Article: 1104
Chemical Bonding, Permittivity and Elastic Properties in Locally Modified Organosilicate Glass
Ehrenfried Zschech
Heiko Stegmann
Holm Geisler
OriginalPaper 15 June 2006 Article: 1103
Studies of the Coefficient of Thermal Expansion of Low-k ILD Materials by X-Ray Reflectivity
George A. Antonelli
Tran M. Phung
Mansour Moinpour
OriginalPaper 24 May 2006 Article: 1102
Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs
Sang Hwui Lee
Frank Niklaus
J.-Q. Lu
OriginalPaper 14 May 2006 Article: 1005
Routes to the Formation of Air Gap Structures Using PECVD
Raymond N. Vrtis
Dingjun Wu
Eugene J. Karwacki
OriginalPaper 15 June 2006 Article: 1002
Benefits and Trade-offs in Multi-Level Air Gap Integration
Romano Hoofman
Roel Daamen
Gerald Beyer
OriginalPaper 15 June 2006 Article: 1001
Feasibility Study for Usage of Diluted Fluorine for Chamber Clean Etch Applications as an Environmental Friendly Replacement of NF₃
Ronald Hellriegel
Bernd Hintze
Michael Pittroff
OriginalPaper 15 June 2006 Article: 923
Computer Simulations on the Grain Boundary Grooving and Cathode Edge Displacement in Bamboo-like Metalic Interconnects
Tarik Omer Ogurtani
Oncu Akyildiz
OriginalPaper 26 June 2006 Article: 922
Novel Reducing Chemistry for Supercritical Fluid Deposition of Copper
Takeshi Momose
Tomohiro Ohkubo
Yukihiro Shimogaki
OriginalPaper 24 May 2006 Article: 920
Relationship Between Interfacial Adhesion and Dielectric Reliability of Cu Alloy Films
Seol-Min Yi
Kwang-Ho Jang
Young-Chang Joo
OriginalPaper 26 May 2006 Article: 918
Non-Destructive Measurement of Deep Embedded Defects in Silicon using Photoacoustic Microscope (PAM)
Lu Xu
Donnacha Lowney
Jennifer Stopford
OriginalPaper 15 June 2006 Article: 917
Design an Electroplated Frame Freestanding Specimen for Microtensile Testing of Submicron thin TaN and Cu Film
Ming-Tzer Lin
Chi-Jia Tong
Chung-Hsun Chiang
OriginalPaper 15 June 2006 Article: 916
The Copper Corrosion and Sulfur Contamination Generated by a Three-Step Copper Chemical-Mechanical Polishing Process
Chun-Ping Liu
Yen-Shih Ho
Bae-Heng Tseng
OriginalPaper 15 June 2006 Article: 910
Improvement of Barrier Properties of TaN Film by Plasma Enhanced Atomic Layer Deposition
Cheol Baek
Han Choon Lee
Sahng Kyoo Lee
OriginalPaper 16 June 2006 Article: 909
Low Temperature Plasma Etching of Copper for Minimizing Size Effects in sub-100 nm Features
Nagraj S Kulkarni
Prabhakar Tamirisa
Dennis W Hess
OriginalPaper 15 June 2006 Article: 908
Cu Resistivity in Narrow lines: Dedicated Experiments for Model Optimization
Sylvain Maitrejean
Roland Gers
Gérard Passemard
OriginalPaper 15 June 2006 Article: 907
Aqueous Based Single Wafer Cleaning Process Development and Integration into 65nm Process Flow using Metal Hard Mask
Miao-Chun Lin
Mei-Qi Wang
John TC Lee
OriginalPaper 15 June 2006 Article: 905
A Novel MO Precursor for Metal Tantalum and Tantalum Nitride Film
Kenichi Sekimoto
Taishi Furukawa
Tetsu Yamakawa
OriginalPaper 15 June 2006 Article: 903
Comparison of Ru/Ta and Ru/TaN as Barrier Stack for Copper Metallization
Xin-Ping Qu
Jing-Jing Tan
Bing-Zong Li
OriginalPaper 15 June 2006 Article: 902
Kinetics of Void Drift in Copper Interconnects
Zung-Sun Choi
Reiner Mönig
Michael Burns
OriginalPaper 15 June 2006 Article: 803
The Stepwise Cross-sectional Crystalline Analysis of the Stress Induced Voiding in Cu Interconnect
Hyo-Jong Lee
Heung Nam Han
Kyu Hwan Oh
OriginalPaper 15 June 2006 Article: 704
Influence of Grain Orientation on the Microstructural Characterization in Cu During (Self)-Anneal using a Surface Acoustic Wave Technique
Atsuko Sekiguchi
Kris Vanstreels
Sywert H. Brongersma
OriginalPaper 15 June 2006 Article: 609
Electrical Resistance Anomalies During Electromigration Testing of Cu Conductor Lines: Examples of Local Melting?
Hongqing Zhang
Gan Wang
G. S. Cargill III
OriginalPaper 15 June 2006 Article: 608
Effect of Cu Migration in a Field Induced Dielectric Failure
Sang-Soo Hwang
Sung-Yup Jung
Young-Chang Joo
OriginalPaper 15 June 2006 Article: 607
Thermal and Electromigration-Induced Strains in Copper Conductor Lines: X-ray Microbeam Measurements and Analysis
G. Wang
H. Zhang
A. Maniatty
OriginalPaper 15 June 2006 Article: 606
Electromigration-Induced Plastic Deformation in Cu Damascene Interconnect Lines as Revealed by Synchrotron X-Ray Microdiffraction
Arief S. Budiman
N. Tamura
W. D. Nix
OriginalPaper 01 June 2006 Article: 605
In-situ Observation of the Formation and Growth of Twin in the Copper Electrodeposits for Ultra Large Scale Integration
Heung Nam Han
Hyo-Jong Lee
Kyu Hwan Oh
OriginalPaper 15 June 2006 Article: 604
In-Situ Characterizarion of Interfaces-Induced Resistivity in Nanometric Dimensions
Hagay Marom
Moshe Eizenberg
OriginalPaper 15 June 2006 Article: 603
Scaling of Statistical and Physical Electromigration Characteristics in Cu Interconnects
Martin Gall
Meike Hauschildt
Hisao Kawasaki
OriginalPaper 01 June 2006 Article: 601
Thin and Smooth Cu Seed Layer Deposition using the Reduction of Low Temperature Deposited Cu₂O
Hoon Kim
Yasuhiko Kojima
Yukihiro Shimogaki
OriginalPaper 15 June 2006 Article: 511
Thermal Oxidation of Ni and Co Alloys Formed by Electroless Plating
Jeff Gambino
Igor Ivanov
Marina Polyanskaya
OriginalPaper 15 June 2006 Article: 509
Copper Electroplating on Zero-Thickness ALD Platinum for Nanoscale Computer Chip Interconnects
Alain Kaloyeros
Yu Zhu
Matthew Breslin
OriginalPaper 15 June 2006 Article: 508
Real Time Study of Cu Diffusion through a Ru Thin Film by Photoemission Electron Microscopy (PEEM)
Wei Wei
Gang Xiong
Wayne P. Hess
OriginalPaper 15 June 2006 Article: 507
Comparison of the Fracture Behavior of Brittle ILD Films used in the BEOL in Dry and Wet Environment using Nanoindentation
Eva E Simonyi
Michael Lane
Alfred Grill
OriginalPaper 15 June 2006 Article: 411
Effects of Dielectric Thermal Expansion and Elastic Modulus on the Stress and Deformation Fields in Copper Interconnects
Y.-L. Shen
OriginalPaper 15 June 2006 Article: 410
Fracture Properties of Porous MSSQ Films: Impact of Porogen Loading and Burnout
Markus Daniel Ong
Vincent Jousseaume
Reinhold H. Dauskardt
OriginalPaper 15 June 2006 Article: 407
PECVD Versus Spin-on to Perform Porous ULK for Advanced Interconnects: Chemical Composition, Porosity and Mechanical Behavior
Vincent Jousseaume
Charles Le Cornec
Gerard Passemard
OriginalPaper 14 June 2006 Article: 406
Evaluation of Damages and Pore-sealing Capabilities of Oxidizing and Reducing Etch Plasmas for Single and Dual Damascene Patterning of Porous Ultra-Low-k Materials
Emmanuel Ollier
Mathieu Clain
Stephane Jullian
OriginalPaper 15 June 2006 Article: 405
Topographical and chemical surface modification of porous MSQ using silylating agents with different numbers of methoxy groups
Casey Smith
Dennis Mueller
Rick Reidy
OriginalPaper 22 June 2006 Article: 404
The Effect of Plasma Damage on the Material Composition and Electrical Performance of Different Generations of SiOC(H) Low k Films
Aurelie Humbert
Didem Ernur Badaroglu
Romano J.O.M Hoofman
OriginalPaper 15 June 2006 Article: 403
Challenges of Ultra Low-k Dielectric Measurement and Plasma Damage Assessment
Thomas Abell
Jeffrey Lee
Mansour Moinpour
OriginalPaper 22 June 2006 Article: 402
Low-Temperature PETEOS-to-PETEOS Wafer Bonding Using Titanium as Bonding Intermediate
Jian Yu
Richard L. Moore
Ronald J. Gutmann
OriginalPaper 15 June 2006 Article: 315
Zeolite Low-k Film Properties Dependence on Nanocrystal Size
Salvador Eslava-Fernandez
M. R. Baklanov
K. Maex
OriginalPaper 15 June 2006 Article: 308
Thermal and Dielectric Stability of Parylene X
Jay J. Senkevich
Brad Carrow
Pei-I Wang
OriginalPaper 15 June 2006 Article: 306

Volume 914, Issue 1

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