Volume 863, Issue 1 | MRS Online Proceedings Library

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Volume 863, Issue 1

December 2004

Symposium B — Materials, Technology and Reliability of Advanced Interconnects

Issue Editors:

P. R. Besser,
F. Iacopi,
A. J. McKerrow,
J. Vlassak,
C. P. Wong

62 articles in this issue

Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Hermann Oppermann
Matthias Hutter
Jürgen Wolf
Article 01 October 2005 Article: B10.1
Effect of Electromigration on Mechanical Behavior of Solder Joints
Fei Ren
Jae-Woong Nah
John Pang
Article 01 October 2005 Article: B10.2
Morphology Change, Size Distribution, and Nano-sized Channels in Cu₆Sn₅ Intermetallic Compound Formation at the SnPb Solder and Copper Interface
J. O. Suh
K. N. Tu
A. M. Gusak
Article 01 October 2005 Article: B10.3
A Study of Impact Reliability of Lead-free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad
Shengquan Ou
Yuhuan Xu
Y. C. Chan
Article 01 October 2005 Article: B10.5
Mechanisms of Low-Temperature Ti/Si-Based Wafer Bonding
Jian Yu
Yinmin Wang
Ronald J. Gutmann
Article 01 October 2005 Article: B10.7
Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding
F. Niklaus
R. J. Kumar
R. J. Gutmann
Article 01 October 2005 Article: B10.8
Interconnects for Elastically Stretchable and Deformable Electronic Surfaces
Joyelle Jones
S. P. Lacour
Sigurd Wagner
Article 01 October 2005 Article: B10.9
A New Technique for the Characterization of the Adhesion in Integrated Circuit Interconnect Structures
Ibon Ocana
Jon M. Molina
Jose A. Maiz
Article 01 October 2005 Article: B1.2
Mechanical Properties of Porous MSQ Films: Impact of the Porogen Loading and Matrix Crosslinking.
F. Ciaramella
V. Jousseaume
G. Passemard
Article 01 October 2005 Article: B1.4
High-Temperature Nanoindentation Measurement for Hardness and Modulus Evaluation of Low-k Films
Jiping Ye
Nobuo Kojima
James M. Burkstrand
Article 01 October 2005 Article: B1.5
Depth-profiling Pore Morphology in Nanoporous Thin Films Using Positronium Lifetime Annihilation Spectroscopy
Richard S. Vallery
Hua-Gen Peng
Richard J. Carter
Article 01 October 2005 Article: B1.6
Solid state MAS NMR spectroscopic characterization of plasma damage and UV modification of low k dielectric films
Thomas Abell
Kristof Houthoofd
Karen Maex
Article 01 October 2005 Article: B1.8
Nanoporous Materials Integration Into Advanced Microprocessors
E. Todd Ryan
Cathy Labelle
Paul S. Ho
Article 01 October 2005 Article: B2.1
Poly(ethynyl-p-xylylene), An Advanced Molecular Caulk CVD Polymer
Brad P. Carrow
Rex E. Murray
Jay J. Senkevich
Article 01 October 2005 Article: B2.10
Integration of a Polymer Etch Stop Layer in a Porous Low K MLM Structure
Gregory C. Smith
Neil Henis
Klaus Pfeifer
Article 01 October 2005 Article: B2.11
Double-layered Structure of Surface Modification of Low-k Dielectrics Induced by He Plasma
Ken-Ichi Yanai
Tadayoshi Hasebe
Kazuhiro Koga
Article 01 October 2005 Article: B2.3
Nanoscale Observation of Dielectric Damage to Low k MSQ Interconnects from Reactive Ion Etching and Ash Treatment
Todd S. Gross
Shaoning Yao
Article 01 October 2005 Article: B2.4
First Pass Study of Surface Modified Porous Low-k by Ion Implantation for Zero Thickness Barrier Requirement of Cu/MSQ/Si Stacks in Copper Metallization Scheme
Alok Nandini
U. Roy
H. Bakhru
Article 01 October 2005 Article: B2.6
Observation of Intrusion Rates of Hexamethyldisilazane During Supercritical Carbon Dioxide Functionalization of Triethoxyfluorosilane Low-k Films
P. M. Capani
P. D. Matz
R. F. Reidy
Article 01 October 2005 Article: B2.7
Pore Structure and Integration Performance of a Porous CVD Ultra Low k Dielectric
Youfan Liu
Andreas Knorr
Bernd Kastenmeier
Article 01 October 2005 Article: B3.1
Effect of Plasma Treatment and TMCTS Vapor Annealing on the Reinforcement of Porous low-k Films
Kazuo Kohmura
Hirofumi Tanaka
Takamaro Kikkawa
Article 01 October 2005 Article: B3.10
High Strength Low Dielectric Constant Aromatic Thermosets
Yongqing Huang
James Economy
Article 01 October 2005 Article: B3.11
Ultra low κ PECVD Porogen Approach: Matrix Precursors Comparison and Porogen Removal Treatment Study
L. Favennec
V. Jousseaume
G. Passemard
Article 01 October 2005 Article: B3.2
Determining Pore Structure and Growth Mechanisms in Templated Nanoporous Low-k Films
Hua-Gen Peng
Richard S. Vallery
Jongmin Kim
Article 01 October 2005 Article: B3.4
Fracture Property Improvements of a Nanoporous Thin Film Via Post Deposition Bond Modifications
Jeannette M. Jacques
Ting Y. Tsui
Robert Kraft
Article 01 October 2005 Article: B3.8
Constraint Effects on Cohesive Failures in Low-k Dielectric Thin Films
Ting Y. Tsui
Andrew J. McKerrow
Joost J. Vlassak
Article 01 October 2005 Article: B4.1
Barrier Integrity Effect on Leakage Mechanism and Dielectric Reliability of Copper/OSG Interconnects
Yunlong Li
Zsolt Tökei
Karen Maex
Article 01 October 2005 Article: B4.4
Structure Evolution in Plated Cu Films
D. P. Field
NJ Park
JE Sanchez
Article 01 October 2005 Article: B5.2
Effect of Temperature on Incubation Time for Spontaneous Morphology Change in Electrodeposited Copper Metallization
S. Ahmed
D. N. Buckley
Y. Kuo
Article 01 October 2005 Article: B5.4
Thermal Oxidation of Cu Interconnects Capped with CoWP
J. Gambino
S. Smith
P. DeHaven
Article 01 October 2005 Article: B6.11
Plasma-assisted Atomic Layer Deposition of TiN Films at low Deposition Temperature for High-aspect Ratio Applications
S. B. S. Heil
E. Langereis
W. M. M. Kessels
Article 01 October 2005 Article: B6.4
Integration of ALD-TaN Liners on Nanoporous Dielectrics
Bum Ki Moon
Tadashi Iijima
Vincent McGahay
Article 01 October 2005 Article: B6.5
Effect of Dielectric Pore Size Distribution on Interfacial Adhesion of the Tantalum-Porous Dielectric Interface
R. Saxena
W. Cho
S. Grunow
Article 01 October 2005 Article: B6.6
CVD Boron Carbo-Nitride as Pore Sealant for Ultra Low-K Interlayer Dielectrics
P. Ryan Fitzpatrick
Sri Satyanarayana
John G. Ekerdt
Article 01 October 2005 Article: B6.8
TEM-Based Analysis of Defects Induced by AC Thermomechanical versus Microtensile Deformation in Aluminum Thin Films
R. H. Geiss
R. R. Keller
Y. W. Cheng
Article 01 October 2005 Article: B7.2
Employing Thin Film Failure Mechanisms to Form Templates for Nano-electronics
Rainer Adelung
Mady Elbahri
Michael Scharnberg
Article 01 October 2005 Article: B7.3
Degradation of Fracture and Fatigue Properties of MEMS Structures Under Cyclic Loading
Jong-Jin Kim
Dongil Kwon
Article 01 October 2005 Article: B7.4
Effect of Microstructure and Dielectric Materials on Stress-Induced Damages in Damascene Cu/Low-k Interconnects
Young-Chang Joo
Jong-Min Paik
Jung-Kyu Jung
Article 01 October 2005 Article: B7.6
Comparison of Line Stress Predictions with Measured Electromigration Failure Times
Rao R. Morusupalli
William D. Nix
Arief S. Budiman
Article 01 October 2005 Article: B7.7
Stress-induced Void Formation in Passivated Cu Films
Dongwen Gan
Bin Li
Paul S. Ho
Article 01 October 2005 Article: B7.8
Stress Generation in PECVD Silicon Nitride Thin Films for Microelectronics Applications
M. Belyansky
N. Klymko
C.W Lai
Article 01 October 2005 Article: B7.9
A Novel Organic Low-k Film Deposited by Plasma-Enhanced Co-Polymerization
Nobutaka Kunimi
Jun Kawahara
Takamaro Kikkawa
Article 01 October 2005 Article: B8.1
New Carbon-bridged Hybrid Polymers for Low-k Materials
Bum-Gyu Choi
Byung Ro Kim
Min-Jin Ko
Article 01 October 2005 Article: B8.10
The Effect of Methylating Treatments on the Dielectric Reliability of Low-k/Cu Structures
Swarnal Borthakur
Sri Satyanarayana
Paul S. Ho
Article 01 October 2005 Article: B8.12
Capacitance Measurement Technique for Determining the Out-of-Plane Coefficient of Thermal Expansion for Low-k Dielectrics
Swarnal Borthakur
Andreas Knorr
Wen-Li Wu
Article 01 October 2005 Article: B8.14
Determination of Elastic Modulus and Yield Stress of Ultra-thin Cu and low-k Films Using Spherical Nanoindentation Measurement
Satoshi Shimizu
Nobuo Kojima
Jiping Ye
Article 01 October 2005 Article: B8.15
Application of Nanoindentation to Characterize Fracture in ILD Films Used in the BEOL.
Eva E. Simonyi
E. Liniger
C. Tyberg
Article 01 October 2005 Article: B8.18
Advanced Al Damascene Process for Fine Trench Under 70nm Design Rule
Sung Ho Han
Kyung-In Choi
Byung-Il Ryu
Article 01 October 2005 Article: B8.23
Modeling the Impact of Packaging Stress on Device Performance
Xiaopeng Xu
Victor Moroz
Article 01 October 2005 Article: B8.25
Material Reliability and Integration Issues of Polyimide and Benzocyclobutene Interlayer Dielectric Materials
Parshuram B. Zantye
Ashok Kumar
S. Balakumar
Article 01 October 2005 Article: B8.26