Volume 812, Issue 1

Search all MRS Online Proceedings Library articles

December 2003

Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004

Issue Editors:

R. Carter,
C. Hau-Riege,
G. Kloster,
T-M. Lu,
S. Schulz

59 articles in this issue

Thermomechanical Stresses in Copper Interconnect/Low-k Dielectric Systems
Y.-L. Shen
E. S. Ege
OriginalPaper 10 December 2003 Article: 626
Three Dimensional Interconnect Stress Modeling for Back End Process
Xiaopeng Xu
Victor Moroz
OriginalPaper 10 December 2003 Article: 625
Chemical Routes to Improved Mechanical Properties of PECVD Low K Thin Films
S.M. Bilodeau
A.S. Borovik
T.H. Baum
OriginalPaper 10 December 2003 Article: 618
Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications
Y. Kwon
J. Yu
R.J. Gutmann
OriginalPaper 10 December 2003 Article: 616
Optical Interconnect Components for Wafer Level Heterogeneous Hyper-Integration
P. D. Persans
M. Ojha
J. Plawsky
OriginalPaper 10 December 2003 Article: 611
Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy
M. Wimplinger
J.-Q. Lu
R.J. Gutmann
OriginalPaper 10 December 2003 Article: 610
Scanning Near-Field Microwave Probe for In-line Metrology of Low-K Dielectrics
Vladimir V. Talanov
Robert L. Moreland
Youfan Liu
OriginalPaper 10 December 2003 Article: 511
Reliability of Dielectric Barrier Films in Copper Damascene Applications
Albert S. Lee
Annamalai Lakshmanan
Hichem M’Saad
OriginalPaper 10 December 2003 Article: 510
Comparative Studies of Ultra Low-k Porous Silica Films with 2-D Hexagonal and Disordered Pore Structures
Nobutoshi Fujii
Kazuhiro Yamada
Takamaro Kikkawa
OriginalPaper 10 December 2003 Article: 410
Morphology of Ti₃₇Al₆₃ Thin-Films Deposited by Magnetron Sputtering
N. David Theodore
Hyunchul C. Kim
Terry L. Alford
OriginalPaper 10 December 2003 Article: 325
Thermal Stability and Electrical Properties of Ag(Al) Metallization
Hyunchul C. Kim
N. David Theodore
Terry L. Alford
OriginalPaper 10 December 2003 Article: 324
Preparation and Characterization of Copper Film on Plastic Substrate by ECR-MOCVD Coupled with a DC Bias
Bup Ju Jeon
Joong Kee Lee
OriginalPaper 10 December 2003 Article: 323
Pulsed MOCVD of Cu Seed Layer using a (Hfac)Cu(3,3-Dimethyl-1-Butene) Source Plus H₂ Reactant
Jaebum Park
Heejung Yang
Jaegab Lee
OriginalPaper 10 December 2003 Article: 321
Free-standing line patterns of nanocrystalline electrodeposits
Karen Pantleon
Henrik Myhre Jensen
Marcel A.J. Somers
OriginalPaper 10 December 2003 Article: 320
Silver Patterning by Reactive Ion Beam Etching for Microelectronics Application
L. Gao
J. Gstoettner
D. Schmitt-Landsiedel
OriginalPaper 10 December 2003 Article: 319
Thermal Conductivity of Carbon Nanotube Composite Films
Quoc Ngo
Brett A. Cruden
Cary Y. Yang
OriginalPaper 10 December 2003 Article: 318
Effect of Annealing on the Structural, Mechanical and Tribological Properties of Electroplated CU thin Films
P. Shukla
A. K. Sikder
M. Sanganaria
OriginalPaper 10 December 2003 Article: 316
Atomic Layer Deposition of Tantalum Nitride on Organosilicate and Organic Polymer- based Low Dielectric Constant Materials
Oscar van der Straten
Yu Zhu
Alain Kaloyeros
OriginalPaper 10 December 2003 Article: 313
Barrier Layer Morphological Stability and Adhesion to Porous LOW-κ Dielectrics
R. Saxena
W. Cho
J. L. Plawsky
OriginalPaper 10 December 2003 Article: 312
Structural and functional characterization of W-Si-N sputtered thin films for copper metallizations
Alberto Vomiero
Stefano Frabboni
Laura Felisari
OriginalPaper 10 December 2003 Article: 310
Textural Evolution of Cu Damascene Interconnects after Annealing
Jae-Young Cho
Hyo-Jong Lee
Jerzy A. Szpunar
OriginalPaper 10 December 2003 Article: 89
The Influence of Temperature and Concentration on Copper Deposition Kinetics in Supercritical Carbon Dioxide
Yinfeng Zong
James J. Watkins
OriginalPaper 10 December 2003 Article: 86
Electrical Behavior of Nano-Scaled Interconnects
M. Engelhardt
G. Schindler
M. Traving
OriginalPaper 10 December 2003 Article: 84
Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films
L. Gao
J. Gstottner
D. Schmitt-Landsiedel
OriginalPaper 10 December 2003 Article: 83
“Chlorine-based Reactive Ion Etching Process to Pattern Platinum for MEMS Applications”
Sung H. Choi
Jon V. Osborn
Brent A. Morgan
OriginalPaper 10 December 2003 Article: 82
MEMS Metallization
Christian Lohmann
Knut Gottfried
Thomas Gessner
OriginalPaper 10 December 2003 Article: 81
Stressmigration studies on dual damascene Cu/oxide and Cu/low k interconnects
Won-Chong Baek
Paul. S. Ho
Jong Sun Maeng
OriginalPaper 10 December 2003 Article: 78
Statistical Analysis of Electromigration Lifetimes and Void Evolution for Cu Interconnects
M. Hauschildt
M. Gall
P. S. Ho
OriginalPaper 10 December 2003 Article: 77
Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects
Z. -S. Choi
C. L. Gan
W. K. Choi
OriginalPaper 10 December 2003 Article: 76
Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation
Ehrenfried Zschech
Moritz A. Meyer
Eckhard Langer
OriginalPaper 10 December 2003 Article: 75
Coupling Between Precipitation and Plastic Deformation During Electromigration in a Passivated Al (0.5wt%Cu) Interconnect
R.I. Barabash
G.E. Ice
J.R. Patel
OriginalPaper 10 December 2003 Article: 74
Unexpected Mode of Plastic Deformation in Cu Damascene Lines Undergoing Electromigration
Arief S. Budiman
N. Tamura
J. R. Patel
OriginalPaper 10 December 2003 Article: 73
Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segment
C.W. Chang
C.L. Gan
N. Hwang
OriginalPaper 10 December 2003 Article: 72
Effect of Surface Chemistry on the diffusion of Copper in nanoporous dielectrics
Oscar Rodriguez
Woojin Cho
Joel L Plawsky
OriginalPaper 10 December 2003 Article: 68
Modification of Nanoporous Silica Structures by Fluorocarbon Plasma Treatment
Woojin Cho
Ravi Saxena
Mikhail R. Baklanov
OriginalPaper 10 December 2003 Article: 67
Dry Etch and Wet Clean Process Characterization of Ultra Low-k (ULK) Material Nanoglass^®E
B. Ramana Murthy
C.K. Chang
Ananth Naman
OriginalPaper 10 December 2003 Article: 66
Probing Effects of Etching Plasmas on the Properties of Porous Low-k Dielectrics
L. Wang
J. Liu
A. F. Yee
OriginalPaper 10 December 2003 Article: 65
Effect of Aqueous Solution Chemistry on the Accelerated Cracking of Lithographically Patterned Arrays of Copper and Nanoporous Thin-Films
E. P. Guyer
R. H. Dauskardt
OriginalPaper 10 December 2003 Article: 64
A Novel Organosiloxane Vapor Annealing Process for Improving Elastic Modulus of Porous Low-k Films
Kazuo Kohmura
Shunsuke Oike
Takamaro Kikkawa
OriginalPaper 10 December 2003 Article: 62
Deposition and Integration of a Novel Ultra-Low k (2.2) Material
Michelle T. Schulberg
Raashina Humayun
Jia-Ning Sun
OriginalPaper 10 December 2003 Article: 61
Anisotropic Elastic Properties of Low-k Dielectric Materials
A.A. Maznev
A. Mazurenko
Jia-Ning Sun
OriginalPaper 10 December 2003 Article: 59
Effect of Mode-Mixity and Porosity on Interfacial Fracture of Low-k Dielectrics
Caroline C. Merrill
Paul S. Ho
OriginalPaper 10 December 2003 Article: 57
Adhesion Strength Evaluation of Low-k Interconnect Structures Using a Nanoscratch Method
Jiping YE
Kenichi Ueoka
Shinichi Ogawa
OriginalPaper 10 December 2003 Article: 56
Cross-Section Nano-Indentation for Rapid Adhesion Evaluation
S. H. Brongersma
Dominiek Degryse
K. Maex
OriginalPaper 10 December 2003 Article: 55
Ellipsometric Porosimetry of Porous Low-k Films with Quazi-Closed Cavities
Mikhail R. Baklanov
Konstantin P. Mogilnikov
Jin-Heong Yim
OriginalPaper 10 December 2003 Article: 54
3-dimensional evaluation of nm-pores in porous low-k films using TEM stereoscopic / electron tomographic observation method
J. Shimanuki
Y. Inoue
S. Ogawa
OriginalPaper 10 December 2003 Article: 52
Supercritical CO₂ Treatments for Semiconductor Applications
S. Gangopadhyay
J.A. Lubguban
R. D. Miller
OriginalPaper 10 December 2003 Article: 46
Novel Epoxy Siloxane Polymer as Low-K Dielectric
Pei-I Wang
Jasbir S. Juneja
Rajat Ghoshal
OriginalPaper 10 December 2003 Article: 44
New hybrid low-k dielectric materials prepared by vinylsilane polymerization
Jung-Won Kang
Byung Ro Kim
Min-Jin Ko
OriginalPaper 10 December 2003 Article: 36
Evaluation of PECVD deposited Boron Nitride as Copper Diffusion Barrier on Porous Low-k Materials
J. Liu
W. D. Wang
K. P. Loh
OriginalPaper 10 December 2003 Article: 29

Volume 812, Issue 1

Search

Navigation