Volume 766, Issue 1

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December 2002

Symposium E — Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics — 2003

Issue Editors:

A. McKerrow,
J. Leu,
O. Kraft,
T. Kikkawa

74 articles in this issue

Solvent diffusion in porous low-k dielectric films
Denis Shamiryan
Karen Maex
OriginalPaper 01 October 2003 Article: 911
Development and Application of On-Wafer Small Angle X-Rayscattering for the Quantification of Pore Morphology in Low Kporous Silk Semiconductor Dielectrics
Brian Landes
Brandon Kern
Steve Weigand
OriginalPaper 01 October 2003 Article: 910
Characterization of Boron Carbo-Nitride Films Deposited By Low Temperature Chemical Vapor Deposition
E. R. Engbrecht
C. J. Cilino
J. G. Ekerdt
OriginalPaper 01 October 2003 Article: 821
Effects of Supercritical CO₂ Drying and Photoresist Strip on Low-k Films
R. F. Reidy
Zhengping Zhang
D. W. Mueller
OriginalPaper 01 October 2003 Article: 820
Optimized Materials Properties for Organosilicate Glasses Produced by Plasma-Enhanced Chemical Vapor Deposition
M. L. O’Neill
R. N. Vrtis
M. D. Bitner
OriginalPaper 01 October 2003 Article: 817
Plasma Hydrogenation – A New Method of Reducing the k Value of the Low k Polyimide Film
Yue Kuo
Taewoo Chung
Helinda Nominanda
OriginalPaper 01 October 2003 Article: 816
The characterization and preparation of porous low dielectric films using various cyclodextrins as template materials
Jin-Heong Yim
Jung-Bae Kim
D. W. Gidley
OriginalPaper 01 October 2003 Article: 810
Nanoporous Silica Films Derived from Structural Controllable Poly(silsesquioxane) Oligomers by Templating
Wei-Chih Liu
Yang-Yen Yu
Wen-Chang Chen
OriginalPaper 01 October 2003 Article: 710
Supercritical Carbon Dioxide-based Fluids Used as a Recovery Tool for Low-k Materials
Rosa A. Orozco-Teran
Brian P. Gorman
Richard F. Reidy
OriginalPaper 01 October 2003 Article: 610
Afm Studies of Deformation and Interfacial Sliding in Interconnect Structures in Microelectronic Devices
C. Park
I. Dutta
J. Vella
OriginalPaper 01 October 2003 Article: 411
The Study of Modified Layers in SiCOH Dielectrics using Spectroscopic Ellipsometry
Marcus A. Worsley
Stacey F. Bent
Jeffrey C. Hedrick
OriginalPaper 01 October 2003 Article: 329
Vapor Treatment of Copper Surface Using Organic Acids
Kenji Ishikawa
Teruo Yagishita
Moritaka Nakamura
OriginalPaper 01 October 2003 Article: 328
Enhanced adhesion of Cu film on a low-k material by using Ti glue layer, B dopant and N₂ plasma treatment
Y. K. Ko
S. Lee
J. G. Lee
OriginalPaper 01 October 2003 Article: 327
Near-Threshold Electromigration of Damascene Copper on TiN Barrier
William K. Meyer
Raj Solanki
David Evans
OriginalPaper 01 October 2003 Article: 324
Deposition and Characteristics of Tantalum Nitride films by Plasma Assisted Atomic Layer Deposition as Cu Diffusion Barrier
Kyoung-Il Na
Se-Jong Park
Jung-Hee Lee
OriginalPaper 01 October 2003 Article: 322
Characterization of Electroplated Copper Films with Laser-Generated Surface Acoustic Waves
A. A. Maznev
M. Gostein
S. H. Brongersma
OriginalPaper 01 October 2003 Article: 321
Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects
G. Zhang
C. M. Tan
D. H. Zhang
OriginalPaper 01 October 2003 Article: 316
The formation of low temperature Cu₃Si in Ag(Cu)/Si structure upon annealing and its effects on adhesion and resistivity
Sungjin Hong
Seob Lee
Jaegab Lee
OriginalPaper 01 October 2003 Article: 315
Electromigration of lower and upper Cu lines in dual-damascene Cu interconnects
Ahila Krishnamoorthy
Guo Qiang
Subodh Mhaisalkar
OriginalPaper 01 October 2003 Article: 313
Reduced Time for Uniform Etching of Cu Power Planes during FIB Editing
V. V. Makarov
W. B. Thompson
T. R. Lundquist
OriginalPaper 01 October 2003 Article: 310
Adhesion Enhancement for Multiple Level Cu/SiLK^TM Integration
X. T. Chen
D. Lu
P. D. Foo
OriginalPaper 01 October 2003 Article: 210
Characterization of Atomic Layer DepositedWN_xC_y Thin Film as a Diffusion Barrier for CopperMetallization
Soo-Hyun Kim
Su Suk Oh
Marko Tuominen
OriginalPaper 01 October 2003 Article: 109
A Study of Atomic Layer Deposition and Reactive Plasma Compatibilitywith Mesoporous Organosilicate Glass Films
E. Todd Ryan
Melissa Freeman
David W. Gidley
OriginalPaper 01 October 2003 Article: 108
Characterization of CVD Ti_xC_yN_z Films Deposited as Diffusion Barriers for Cu on Low-k Dielectrics Methylsilsequiazane
W. C. Gau
P. T. Liu
L. J. Chen
OriginalPaper 01 October 2003 Article: 106
The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum-Based Thin Films for Copper Diffusion Barrier Applications
Degang Cheng
Eric T. Eisenbraun
OriginalPaper 01 October 2003 Article: 104
Enhancement of Copper Wetting via Surfactant-Based Post-Treatment of Ultra-Thin Atomic Layer Deposited Tantalum Nitride Liners
Oscar van der Straten
Yu Zhu
Alain Kaloyeros
OriginalPaper 01 October 2003 Article: 103
Silicides for the 65 nm Technology Node
Paul R. Besser
Simon Chan
Laura Pressley
OriginalPaper 01 October 2003 Article: 101
Characterization of Nanoporous Low-k Thin Films by Contrast Match SANS
Ronald C. Hedden
Barry J. Bauer
Hae-Jeong Lee
OriginalPaper 01 October 2003 Article: 97
Advanced characterization of ultra-low-k periodic porous silica films – pore size distribution, pore-diameter anisotropy, and size and macroscopic isotropy of domain structure
N. Hata
C. Negoro
T. Kikkawa
OriginalPaper 01 October 2003 Article: 96
Using multi-dimensional contact mechanics experiments to measure Poisson’s ratio of porous low-k films
B. N. Lucas
J. C. Hay
W. C. Oliver
OriginalPaper 01 October 2003 Article: 95
Environmental Effects on Subcritical Delamination of Dielectric and Metal Films from Organosilicate Glass (OSG) Thin Films
Y. Lin
J. J. Vlassak
A. J. McKerrow
OriginalPaper 01 October 2003 Article: 94
Indentation Fracture Toughness Measurements of Low Dielectric Constant Materials
Dylan J. Morris
Robert F. Cook
OriginalPaper 01 October 2003 Article: 93
Interfacial Relationships in Microelectronic Devices
Michael Lane
Robert Rosenberg
OriginalPaper 01 October 2003 Article: 91
Determination of Pore Size Distributions in Nano-Porous Thin Films from Small Angle Scattering
Barry J. Bauer
Ronald C. Hedden
Da-Wei Liu
OriginalPaper 01 October 2003 Article: 89
Spectrum of Defect States in Porous Organic Low-k Dielectric Films, Annealed in Argon and Nitrogen
V. Ligatchev
T. K. S. Wong
Rusli Suzhu Yu
OriginalPaper 01 October 2003 Article: 85
Electrical, Mechanical, and Structural Properties of Fluoro-Containing Poly(silsesquioxanes) Based Porous Low k Thin Films
Jingyu Hyeon-Lee
Jihoon Rhee
Seok Chang
OriginalPaper 01 October 2003 Article: 83
Creating Nanoporosity by Selective Extraction of Porogens Using Supercritical Carbon Dioxide/Cosolvent Processes
B. Lahlouh
T. Rajagopalan
R. D. Miller
OriginalPaper 01 October 2003 Article: 79
Development of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes
R. J. Strittmatter
J. L. Hahnfeld
G. R. Buske
OriginalPaper 01 October 2003 Article: 75
Plasma Enhanced Chemical Vapor Deposition of Porous Organosilicate Glass ILD Films With k ≤ 2.4.
Raymond N. Vrtis
Mark L. O’Neill
Eugene J. Karwacki
OriginalPaper 01 October 2003 Article: 74
Organofluorosilicate Glass (OFSG): A Dense Low K Dielectric with Superior Materials Properties
M. L. O’Neill
Y. L. Cheng
M. D. Bitner
OriginalPaper 01 October 2003 Article: 73
Expanding thermal plasma for low-k dielectrics deposition
M. Creatore
Y. Barrell
M. C. M. van de Sanden
OriginalPaper 01 October 2003 Article: 69
Mechanical Properties of Organosilicon Thin Films Deposited from Cyclic and Acyclic Precursors using Water as an Oxidant.
Daniel D. Burkey
Karen K. Gleason
OriginalPaper 01 October 2003 Article: 67
Structure and Properties of Polysilsesquioxanes and Copolymers for Ultra-Low Dielectric Films
Do Y. Yoon
Hyun Wook Ro
David W. Gidley
OriginalPaper 01 October 2003 Article: 65
Accelerated Oxidation of Hydrogen Silsesquioxane Thin Films Facilitated by an Organosilicone Resin Additive
Brian R. Harkness
Ron Boisvert
David Gidley
OriginalPaper 01 October 2003 Article: 64
Stress Stability of PECVD Silicon Nitride Films During Device Fabrication
Michael P. Hughey
Robert F. Cook
OriginalPaper 01 October 2003 Article: 63
Sequential Process Modeling for Determining Process-Induced Thermal Stress in Advanced Cu/Low-k Interconnects
Kwanho Yang
Joost J. Waeterloos
Michael E. Mills
OriginalPaper 01 October 2003 Article: 62
Some Aspects of the Materials Science of Low-K Integration
Vincent McGahay
OriginalPaper 01 October 2003 Article: 61
Mim Capacitors with HfO₂ and HfAlO_x for Si RF and Analog Applications
Xiongfei Yu
Chunxiang Zhu
M. B. Yu
OriginalPaper 01 October 2003 Article: 59
Dielectric GlueWafer Bonding For 3D ICs
Y. Kwon
A. Jinda
T. S. Cale
OriginalPaper 01 October 2003 Article: 58
Wafer Thinning for Monolithic 3D Integration
A. Jindal
J. Q. Lu
R. J. Gutmann
OriginalPaper 01 October 2003 Article: 57

Volume 766, Issue 1

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