Volume 563, Issue 1

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December 1999

Symposium M — Materials Reliability in Microelectronics IX

Issue Editors:

D. Brown,
A. H. Verbruggen,
C. A. Volkert

47 articles in this issue

Reliability of Electroless Processed Thin Layered Solder Joints
L. C. Wang
Z. Mei
R. H. Dauskardt
OriginalPaper 01 October 1999 Pages: 3 - 8
Strain Measurements in a Thermally-Cycled Flip-Chip PBGA Solderball
E. S. Drexler
OriginalPaper 01 October 1999 Pages: 9 - 14
Fracture of a Lead-Tin and a Tin-Silver Solder Under Combined Tensile Shear Loading
M. Manoharan
K. S. Siow
OriginalPaper 01 October 1999 Pages: 15 - 20
Effect of a Titanium Interlayer on the Performance of the Titanium Nitride Diffusion Barrier
K. Y. Lu
J. S. Chen
OriginalPaper 01 October 1999 Pages: 21 - 26
Kinetics of the Tial₃ Formation From Al/Ti Thin Films
X. Federspiel
M. Ignat
T. Marieb
OriginalPaper 01 October 1999 Pages: 27 - 32
TiB² as a Diffusion Barrier for Cu/<si> Metallization
J. L. Wang
J. S. Chen
OriginalPaper 01 October 1999 Pages: 33 - 38
Diffusion Barrier Characteristics of Zirconium Diboride Films Grown by Remote Plasma CVD
J. Sung
D. M. Goedde
J. R. Abelson
OriginalPaper 01 October 1999 Pages: 39 - 44
Characteristics of Molybdenum Nitride Thin Film by N₂⁺ Ion Implantation
Dong Joon Kim
Ik-Soo Kim
Jong-Wan Park
OriginalPaper 01 October 1999 Pages: 45 - 50
Homogeneous Ultrathin Diffusion Barriers Deposited on Low Dielectric Constant Polymers
M. Kiene
P. P. Abramowitz
P. S. Ho
OriginalPaper 01 October 1999 Pages: 51 - 56
Interconnect Failure Mechanism Maps for Different Metallization Materials and Processes
V. K. Andleigh
Y. J. Park
C. V. Thompson
OriginalPaper 01 October 1999 Pages: 59 - 64
Simulation of Electromigration Induced Atomic Transport in Al−Cu Alloys
J. P. Dekker
C. Elsässer
P. Gumbsch
OriginalPaper 01 October 1999 Pages: 65 - 70
Immortal InterConnects—Prevent Cracking and Limit Void Size
Z. Suo
Q. Ma
W. K. Meyer
OriginalPaper 01 October 1999 Pages: 71 - 76
Effects of Preexisting Stress Voids on Electromigration Stress Buildup and Flux Divergence
Y. L. Shen
C. A. Minor
Y. L. Guo
OriginalPaper 01 October 1999 Pages: 77 - 82
Interconnect Reliability Study Using a Microscopic Nucleation Model for Electromigration
M. Tammaro
B. Setlik
OriginalPaper 01 October 1999 Pages: 83 - 88
Effect of Cu on Al Interfacial Mass Transport in Bamboo Rie and Damascene Al(Cu)
J. Proost
H. Li
K. Maex
OriginalPaper 01 October 1999 Pages: 91 - 96
Electromigration Voiding in Argon-Implanted Interconnects
N. E. Meier
J. C. Doan
J. C. Bravman
OriginalPaper 01 October 1999 Pages: 97 - 102
A Detailed Study of Void Motion in Passivated Aluminum Interconnects
Jonathan C. Doan
John C. Bravman
Thomas N. Marieb
OriginalPaper 01 October 1999 Pages: 103 - 108
In-Situ Electromigration Damage of Al Interconnect Lines and the Influence of Grain Orientation
A. Buerke
H. Wendrock
A. v. Glasow
OriginalPaper 01 October 1999 Pages: 109 - 114
Electromigration in Sputter Deposited Copper/Zirconium Alloys
N. D. McCusker
H. S. Gamble
B. M. Armstrong
OriginalPaper 01 October 1999 Pages: 115 - 120
Cause of the Decrease in Electromigration Resistance in Am/Al₃Ti Lines
A. Kameyama
K. Masuzaki
H. Mori
OriginalPaper 01 October 1999 Pages: 121 - 126
Evaluation of Current Ramp Test for In-Line Electromigration Test
Kia Seng Low
Alex v. Glasow
Anthony O’Neill
OriginalPaper 01 October 1999 Pages: 127 - 132
Electromigration Testing of via Terminated Test Structures
Kia Seng Low
Hans Poetzlberger
Anthony O’Neill
OriginalPaper 01 October 1999 Pages: 133 - 138
Electrical Reliability of Giant Magneto-Resistive Recording Sensors
I-Fei Tsu
C. Chang
H. S. Edelman
OriginalPaper 01 October 1999 Pages: 139 - 144
Electromigration Reliability Study of a GMR Spin Valve Device
S. Shingubara
Y. Takeda
A. H. Verbruggen
OriginalPaper 01 October 1999 Pages: 145 - 150
X-Ray Microbeam Studies of Electromigration
G. S. Cargill III
A. C. Ho
C. K. Hu
OriginalPaper 01 October 1999 Pages: 153 - 161
In-Situ X-Ray Microbeam Cu Fluorescence and Strain Measurements on Al(0.5 AT.% Cu) Conductor Lines During Electromigration
H. K. Kao
G. S. Cargill III
C. K. Hu
OriginalPaper 01 October 1999 Pages: 163 - 168
X-Ray Microbeam Measurement of Local Texture and Strain in Metals
Jin-Seok Chung
N. Tamura
Walter Lowe
OriginalPaper 01 October 1999 Pages: 169 - 174
Strain and Texture in Al-Interconnect Wires Weasured by X-Xay Microbeam Diffraction
Nobumichi Tamura
J. S. Chung
W. P. Lowe
OriginalPaper 01 October 1999 Pages: 175 - 180
In Situ Stem Technique for Characterization of Nanoscale Interconnects During Electromigration Testing
Ismail Gobulukoglu
Brian W. Robertson
OriginalPaper 01 October 1999 Pages: 181 - 186
Mechanical Stresses in Aluminum and Copper Interconnect Lines for 0.18μm Logic Technologies
Paul R. Besser
Young-Chang Joo
Richard Ortega
OriginalPaper 01 October 1999 Pages: 189 - 199
X-Ray Diffraction Determination of Texture and Stress in Damascene Fabricated Copper Interconnects
Delrose Winter
Paul R. Besser
OriginalPaper 01 October 1999 Pages: 201 - 206
Effects of Thickness and Oxygen Content on Thermomechanical Behavior of Thin Cu Films Passivated with AlN
J. Shu
S. Clyburn
S. P. Baker
OriginalPaper 01 October 1999 Pages: 207 - 212
Determination of the Coefficient of Piezoresistivity in Aluminum Alloy Interconnect Structures
Christopher J. Reilly
John E. Sanchez Jr
OriginalPaper 01 October 1999 Pages: 213 - 218
Effect of Modified Metal/Passivation Interfaces on Stress Voiding in Interconnects⁺
C. E. Kalnas
R. R. Keller
T. N. Marieb
OriginalPaper 01 October 1999 Pages: 219 - 224
The Effect of Film Stress on Indentation Modulus/Hardness for Silicon Oxide Films
Brad Sun
Jin Lee
Jun He
OriginalPaper 01 October 1999 Pages: 225 - 230
Measurement of Thin Film Mechanical Properties by Microbeam Bending
J. Florando
H. Fujimoto
W. D. Nix
OriginalPaper 01 October 1999 Pages: 231 - 236
Analytical Methodology and Design of Advanced Test Structure for the Mechanical Characteristics of Microactuator Materials
Se-Ho Lee
Byung Woo Park
Dongil Kwon
OriginalPaper 01 October 1999 Pages: 237 - 242
On the Methodology of Numerical Etching
X. H. Wang
K. Shyu
Weijia Wen
OriginalPaper 01 October 1999 Pages: 243 - 248
Subcritical Debonding of Multilayer Interconnect Structures: Temperature and Humidity Effects
Michael Lane
Reiner Dauskardt
Nety Krishna
OriginalPaper 01 October 1999 Pages: 251 - 256
Interfacial Diffusivity of Moisture Along A SiO₂/Tin Interface Measured Using Imaging Secondary Ion Mass Spectroscopy (SIMS)
Guanghai Xu
T. E. Mates
Harry Fujimoto
OriginalPaper 01 October 1999 Pages: 257 - 262
Adhesion and Progressive Debonding of Polymer/Metal Interfaces: Effects of Temperature and Environment
Seung-Yeop Kook
Amol Kirtikar
Reinhold H. Dauskardt
OriginalPaper 01 October 1999 Pages: 263 - 268
Environmental Effects on Cu/SiO₂ and Cu/Ti/SiO₂ Thin Film Adhesion
N. I. Tymiak
M. Li
W. W. Gerberich
OriginalPaper 01 October 1999 Pages: 269 - 274
Acoustic Emission Analysis of Fracture Events in Cu Films with W Overlayers
Alex A. Volinsky
William W. Gerberich
OriginalPaper 01 October 1999 Pages: 275 - 284
Measurement of Toughness for Sin Films on Silicon Using Channel Cracking Technique
Qing Ma
Quan Tran
Harry Fujimoto
OriginalPaper 01 October 1999 Pages: 285 - 290
Fatigue of Silane Bonded Epoxy/Glass Interfaces
J. E. Ritter
J. C. Learned
T. J. Lardner
OriginalPaper 01 October 1999 Pages: 291 - 296
Macroscopic Modeling of Fine Line Adhesion Tests
A. A. Volinsky
J. C. Nelson
W. W. Gerberich
OriginalPaper 01 October 1999 Pages: 297 - 302
Measurement of Bonding Stress in Silicon High Power Device Structures by Infrared Photoelasticity Method
H. J. Peng
S. P. Wong
Shounan Zhao
OriginalPaper 01 October 1999 Pages: 303 - 308

Volume 563, Issue 1

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