Volume 516, Issue 1 | MRS Online Proceedings Library

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Volume 516, Issue 1

December 1998

Symposium E — Low Dielectric Constant Materials IV

Issue Editors:

J. Bravman,
M. A. Korhonen,
J. R. Lloyd,
T. Marieb

49 articles in this issue

Electromigration Damage in Aluminum Alloys Studied by 1/f Noise
C. A. Kruelle
E. Ochs
I. Bloom
OriginalPaper 10 February 2011 Pages: 3 - 8
Evolution of the Electrical Properties of Interconnects Under Electromigration Stress
B. K. Jones
Jianping Guo
G. Trefan
OriginalPaper 10 February 2011 Pages: 9 - 14
Early Detection of the Metallization Quality Using Moderately Accelerated Electromigration Stress Conditions
A. Scorzoni
I. De Munari
M. Forde
OriginalPaper 10 February 2011 Pages: 15 - 25
Investigations of Electromigration Failure by Electrical Measurement and Scanning Probe Microscopy With Additional Simulation
Alexander Fabricius
Volkmar Breternitz
Silvia Vogel
OriginalPaper 10 February 2011 Pages: 27 - 32
Quantitative Measure of EM-Induced Drift in Sub-Micron Al Lines
C. Witt
C. A. Volkert
OriginalPaper 10 February 2011 Pages: 33 - 38
In-Situ X-ray Photoemission Spectromicroscopy of Electromigration in Patterned Al-Cu Lines With Maximum
H. H. Solak
G. F. Lorusso
P. Batson
OriginalPaper 10 February 2011 Pages: 39 - 43
Local Channel Temperature Measurements on Pseudomorphic High Electron Mobility Transistors by Photoluminescence Spectroscopy
J. P. Landesman
E. Martin
P. Braun
OriginalPaper 10 February 2011 Pages: 45 - 50
Interface Effect on the Transverse Thermal Conductivity of SiO₂ Films Deposited on Silicon
W. Zhao
F. R. Brotzen
P. J. Loos
OriginalPaper 10 February 2011 Pages: 51 - 56
Novel Electromigration Failure Mechanism for Aluminium-Based Metallization on Titanium Substrate
G. Girardi
C. Caprile
L. Riva
OriginalPaper 10 February 2011 Pages: 59 - 64
Statistical Evaluation of Stressmigration Reliability in Al-Cu Interconnects
D. Jawarani
M. Gall
H. Kawasaki
OriginalPaper 10 February 2011 Pages: 65 - 70
Diffusion and Electromigration of Cu in Single Crystal Al Interconnects
V. T. Srikar
C. V. Thompson
OriginalPaper 10 February 2011 Pages: 71 - 75
Segregation of Cu on Etched and Non-Etched Al(Cu) Surface
Hua Li
Karen Maex
Ludo Froyen
OriginalPaper 10 February 2011 Pages: 77 - 82
A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects
Jonathan C. Doan
John C. Bravman
Thomas N. Marieb
OriginalPaper 10 February 2011 Pages: 83 - 88
Electromigration-Induced Drift in Damascene vs. Conventional Interconnects: An Intrinsic Difference
J. Proost
I. Samajdar
K. Maexo
OriginalPaper 10 February 2011 Pages: 89 - 94
Grain Growth by Digm in Ni Thin Film Under High Tensile Stress
Zhengyi Jia
G. Z. Pan
K. N. Tu
OriginalPaper 10 February 2011 Pages: 95 - 101
Effect of Ar Sputtering Pretreatment on the Electromigration Resistance in Al-Cu/TiN/Ti Interconnects
L. P. Wang
A. Chuang
J. Hwang
OriginalPaper 10 February 2011 Pages: 103 - 108
Microstructure Evolution of Al-1.5% Cu Alloy as a Function of Resistance Change Due to Isothermal DC Stressing
T. Lee
M. Schade
K. Evans
OriginalPaper 10 February 2011 Pages: 109 - 114
Texture and Grain Boundary Structure Dependence of Hillock Formation in Thin Metal Films
Matithew M. Nowell
David P. Field
OriginalPaper 10 February 2011 Pages: 115 - 120
TEM Observations on the Evolution of Grain Structure in Pressurized Al-0.5Cu Thin Films
H. D. Yang
C. U. Kim
H. A. Le
OriginalPaper 10 February 2011 Pages: 121 - 126
Electromigration Failure Kinetics in Al Alloy Lines: A Microstructure-Based Constitutive Equation
S. H. Kang
J. W. Morris Jr.
C. U. Kim
OriginalPaper 10 February 2011 Pages: 129 - 134
Modelling Electromigration and Stress Migration Damage in Advanced Interconnect Structures
Dirk Brown
OriginalPaper 10 February 2011 Pages: 135 - 146
Modelling of Failure Time Distributions for Interconnects Due to Stress Voiding and Electromigration
W. G. Wolfer
M. C. Bartelt
W. D. Nix
OriginalPaper 10 February 2011 Pages: 147 - 158
Grain Structure Statistics in As-Patterned and Annealed Interconnects
W. Fayad
V. Andleigh
H. J. Frost
OriginalPaper 10 February 2011 Pages: 159 - 164
Analysis of Failure in Metallic Thin-Film Interconnects Due to Stress and Electromigration-Induced Void Propagation
M. Rauf Gungor
Leonard J. Gray
Dimitrios Maroudas
OriginalPaper 10 February 2011 Pages: 165 - 170
Model for Estimation of Metallization Lifetime Including Electromigration and Thermo-Mechanical Stress Relaxation
Herbert F. Roloff
Johannes Fellinger
OriginalPaper 10 February 2011 Pages: 171 - 176
Modelling of Heat Conduction and Thermal Stresses in Multilevel Interconnects
Y. L. Shen
OriginalPaper 10 February 2011 Pages: 177 - 182
The Effects of Microstructures on Normal and Early Failures of Interconnects Caused by Electromigration
Yongkun Liu
R. J. Diefendorf
OriginalPaper 10 February 2011 Pages: 183 - 188
Defect Generation and Diffusion Mechanisms in Al and Al-Cu
C. L. Liu
X. Y. Liu
L. J. Borucki
OriginalPaper 10 February 2011 Pages: 189 - 193
Electric Field Direct Force in Electromigration Mechanism
A. A. Karpushin
A. N. Sorokin
K. Maex
OriginalPaper 10 February 2011 Pages: 195 - 198
Thermomechanical Behavior of Continuous and Patterned Al Thin Films
O. Kraft
W. D. Nix
OriginalPaper 10 February 2011 Pages: 201 - 212
The Stress Change in Passivated Al Lines Due to the Reaction Between Ti and Al
T. Marieb
A. Mack
M. Dibattista
OriginalPaper 10 February 2011 Pages: 213 - 218
Determination of the Effects of Strain on Electrical Resistivity in Patterned Interconnects
John E. Sanchez Jr.
Christopher J. Reilly
OriginalPaper 10 February 2011 Pages: 219 - 230
Critical Length and Resistance Saturation Effects in Al(Cu) Interconnects
M. Gall
J. Müller
H. Kawasaki
OriginalPaper 10 February 2011 Pages: 231 - 236
Stress- and Electromigration-Induced Voiding and Its Correlation to Macroscopic Stress Changes
Herbert Schroeder
OriginalPaper 10 February 2011 Pages: 237 - 248
The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior
Samantha Lee
John C. Bravman
Tom N. Marieb
OriginalPaper 10 February 2011 Pages: 249 - 254
Dependence of Stress-Related Reliability of Metallic Power Line on Physical Properties of Its Overlayer, Chip Location and Package Structure in Memory Devices
Seong-Min Lee
OriginalPaper 10 February 2011 Pages: 255 - 260
Measuring Local Strain Variations Full-Field in Photoresist Thin Films Using Photolithographic Dot Arrays
P. P. Lin
R. E. Rowlands
OriginalPaper 10 February 2011 Pages: 261 - 266
Copper Versus Magnesium as an Alloying Element in Aluminum Interconnects: Effects on Electromigration
R. Spolenak
J. Mason
E. Arzt
OriginalPaper 10 February 2011 Pages: 269 - 274
Electromigration and Diffusion in Short Al-Ni-Cr Lines
L. C. Jacobs
A. H. Verbruggen
S. Radelaar
OriginalPaper 10 February 2011 Pages: 275 - 280
The Electromigration of CVD-Copper and PVD-Copper Polycrystalline Lines
Seok Kim
Doo-Jin Choi
OriginalPaper 10 February 2011 Pages: 281 - 286
Deformation Mechanisms in Thin Cu Films
Shefford P. Baker
Rose-Marie Keller
Eduard Arzt
OriginalPaper 10 February 2011 Pages: 287 - 298
Effect of Poly-Si on Electromigration Behaviors and Microstructure Characteristics of Au Metallization
T. Lee
B. R. York
K. Evans
OriginalPaper 10 February 2011 Pages: 299 - 304
Evaluation of the Electromigration Performance of New Aluminium Via Plug-Fill Techniques for 0.25μm and 0.18μm Technologies
S. Foley
N. Chan Tung
A. Mathewson
OriginalPaper 10 February 2011 Pages: 305 - 310
Cracking and Debonding in Integrated Microstructures
X. H. Liu
Z. Suo
H. Fujimoto
OriginalPaper 10 February 2011 Pages: 313 - 324
Effect of Thermal Treatment on the Hardness and Fracture Toughness of Sputter Deposited Bi-Layered Thin Films on Silicon
M. Manoharan
B. Narayanan
G. Muralidharan
OriginalPaper 10 February 2011 Pages: 325 - 330
Channel Cracking Technique for Toughness Measurement of Brittle Dielectric Thin Films on Silicon Substrates
Qing Ma
Joseph Xie
Harry Fujimoto
OriginalPaper 10 February 2011 Pages: 331 - 336
On the Interaction Between Indentation Cracks on Metallized Silicon
M. Manoharan
G. Muralidharan
OriginalPaper 10 February 2011 Pages: 337 - 342
FEM Analysis of Thermal Stresses in Advanced Electronic Packages
Sven Rzepka
Matt A. Korhonen
Ekkehard Meusel
OriginalPaper 10 February 2011 Pages: 345 - 356
The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach
Peng Su
Chen Zhou
Che-Yu Li
OriginalPaper 10 February 2011 Pages: 357 - 362