Volume 476, Issue 1

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December 1997

Symposium N — Low-Dielectric Constant Materials III

Issue Editors:

C. Case,
T. Kikkawa,
P. Kohl,
W.W. Lee

40 articles in this issue

Polynorbornene for Low K Interconnection
N. R. Grove
P. A. Kohl
S. Jayaraman
OriginalPaper 15 June 1997 Pages: 3 - 8
Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric
P. H. Townsend
S. J. Martin
J-H. Im
OriginalPaper 15 June 1997 Pages: 9 - 17
Adhesion of a-C:F during oxygen plasma annealing
Y. Matsubara
K. Endo
T. Horiuchi
OriginalPaper 15 June 1997 Pages: 19 - 24
Properties of New Low Dielectric Constant Spin-on Silicon Oxide based Polymers
Nigel P. Hacker
Gary Davis
Richard Spear
OriginalPaper 15 June 1997 Pages: 25 - 30
Thermal Stability of a-C:F,H Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition
Jeremy A. Theil
Francoise Mertz
Gerrit Kooi
OriginalPaper 15 June 1997 Pages: 31 - 36
Cure of Hydrogen Silsesquioxane for Intermetal Dielectric Applications
J.N. Bremme
Y. Liu
F.C. Dall
OriginalPaper 15 June 1997 Pages: 37 - 44
Low K Sog Etchback and Teos Oxide Capping
K.G. Huang
D. Cheung
L. Forester
OriginalPaper 15 June 1997 Pages: 45 - 50
Direct Patterning of Low-K Material for Damascene Process
Cheng-Jye Chu
C-T. Chu
Q. Wei
OriginalPaper 15 June 1997 Pages: 51 - 57
Mocvd of Cu on Teflon-AF and Alumina-Modified Teflon-AF
D. Martini
R. Sutcliffe
J. Kelber
OriginalPaper 15 June 1997 Pages: 61 - 67
The Influence of Fluorine Desorption from ECR-CVD SiOF Film
Tatsuya Usami
Hiraku Ishikawa
Hideki Gomi
OriginalPaper 15 June 1997 Pages: 69 - 74
Reaction between Low Dielectric Constant Fluorinated Polyimide and Aluminum
H. Y. Tong
F. J. Szalkowski
P. K. Vasudev
OriginalPaper 15 June 1997 Pages: 75 - 80
Material and Interface Characterization of Cu₉₉Ti₁ Thin Films Metallized on Polyimide
E. Kondoh
T.P. Nguyen
OriginalPaper 15 June 1997 Pages: 81 - 86
Recent Advances in Low K Polymeric Materials
K. R. Carter
OriginalPaper 15 June 1997 Pages: 87 - 97
Temperature and Moisture Dependence of Dielectric Constant for Bulk Silica Aerogels*
L. W. Hrubesh
S. R. Buckley
OriginalPaper 15 June 1997 Pages: 99 - 104
The Processing and Characterization of Hybrid Silica-Based Xerogel Films
Loren A. Chow
Ted Yu
Chien Chiang
OriginalPaper 15 June 1997 Pages: 105 - 110
Low Dielectric Constant Fluorinated Polyimides for Interlayer Dielectric Applications
John Pellerin
Robert Fox
Huei-Min Ho
OriginalPaper 15 June 1997 Pages: 113 - 119
Effects of Electron Beam Exposure on Poly(Arylene Ether) Dielectric Films
J. S. Drage
J. J. Yang
M. Ross
OriginalPaper 15 June 1997 Pages: 121 - 128
Electrical Extraction of the In-Plane Dielectric Constant of Fluorinated Polyimide
Alvin L.S. Loke
Jeffrey T. Wetzel
S. Simon Wong
OriginalPaper 15 June 1997 Pages: 129 - 134
New Methodologies for Characterization of Low Dielectric Constant Thin Films
E. Todd Ryan
Taiheui Cho
Paul S. Ho
OriginalPaper 15 June 1997 Pages: 135 - 146
Metalized Polypropylene Film in Capacitors: Characterization and the Effect of Interfacial Pressure on the Dielectric Strength
Shalabh Tandon
Richard J. Farris
OriginalPaper 15 June 1997 Pages: 147 - 153
Low-K Dielectric Material Chemical Mechanical Polishing Process Monitoring using Acoustic Emission
Jianshe Tang
Carsten Unger
David Dornfeld
OriginalPaper 15 June 1997 Pages: 155 - 160
Chemical-Mechanical Polishing of Polymer Films: Comparison of Benzocyclobutene(BCB) and Parylene-N Films by XPS and AFM
G.-R. Yang
Y.-P. Zhao
Ronald J. Gutmann
OriginalPaper 15 June 1997 Pages: 161 - 172
Thermomechanical Properties of Hydrogen Silsesquioxanes
W.-Y. Shih
J.-H. Zhao
P. S. Ho
OriginalPaper 15 June 1997 Pages: 173 - 176
Low-k Dielectric Integration Cost Modeling
Ed Korczynski
OriginalPaper 15 June 1997 Pages: 177 - 182
Diagnostics, Mechanisms of Deposition, and Process Control of Thin Fluoropolymeric Films in RF Discharges
R. d’Agostino
OriginalPaper 15 June 1997 Pages: 185 - 196
Parylene Copolymers
Kelly J. Taylor
Mona Eissa
Hoan Nguyen
OriginalPaper 15 June 1997 Pages: 197 - 205
Chemical Vapor Deposited Teflon Amorphous Fluoropolymer as an Interlevel Dielectric Material for Low Power Integrated Circuits
R. Sharangpani
R. Singh
OriginalPaper 15 June 1997 Pages: 207 - 212
The Effect of Deposition Conditions on the Properties of Vapor-Deposited Parylene AF-4 Films
M. A. Plano
D. Kumar
T. J. Cleary
OriginalPaper 15 June 1997 Pages: 213 - 218
Characterization of Parylene-N Thin Films for Low-K Vlsi Applications
Steven C. Selbrede
Martin L. Zucker
OriginalPaper 15 June 1997 Pages: 219 - 224
Effect of Deposition and Annealing on The Thermomechanical Properties of Parylene Films
E. Todd Ryan
Mikel Miller
Paul S. Ho
OriginalPaper 15 June 1997 Pages: 225 - 230
Adhesion and Dielectric Strength of Ultra-Low Dielectric Constant PTFE Thin Films
C.T. Rosenmaver
J. W. Bartz
J. Hammes
OriginalPaper 15 June 1997 Pages: 231 - 236
Low Dielectric Constant Fluorine Doped Teos Films
Viren V. S. Rana
Mohan Bhan
Peter Lee
OriginalPaper 15 June 1997 Pages: 239 - 248
Novel Approaches to Linear Polyimides
J. P. Marasco
J. Garapon
B. Sillion
OriginalPaper 15 June 1997 Pages: 249 - 254
Physical Characterization of Photosensitive Polyimide
Y.L. Zou
T. L. Alford
J. W. Mayer
OriginalPaper 15 June 1997 Pages: 255 - 260
Thermal Stability Study of the Interconnect System with Fluorinated Silicate Glass as IMD Layers
Weidan Li
Wilbur Catabay
OriginalPaper 15 June 1997 Pages: 261 - 266
Thermal Stresses, Interfacial Reactions and Microstructures of Al/Ti and Al/TiN Thin Films Encapsulated by SiOF
Wei-Tsu Tseng
Li-Wen Chen
G. -C. Tu
OriginalPaper 15 June 1997 Pages: 267 - 272
Microscopic Mechanisms for Reduced Static Dielectric Constants in Si-O-F Alloy Films
H. Yang
G. Lucovsky
OriginalPaper 15 June 1997 Pages: 273 - 278
Sidewall Quality and Step Coverage of Thin Fluorosilicate Glass Films
Mark T. Weise
Steven C. Selbrede
OriginalPaper 15 June 1997 Pages: 279 - 283
Adhesion Strength and Deformation Behavior of Al(Cu-Si)/BPDA-PDA Layered Structures
P. Abramowitz
E. Ogawa
J. Wetzel
OriginalPaper 15 June 1997 Pages: 285 - 290
Effect of Post Plasma Treatment on Reliability and Dielectric Properties of SiOF Films Deposited by ECRCVD With SiF₄ and O₂ag]
Seoghyeong Lee
Jae-Yoon Yoo
Jong-Wan Park
OriginalPaper 15 June 1997 Pages: 291 - 296

Volume 476, Issue 1

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