1. Low Dielectric Constant Materials for IC Intermetal Dielectric Applications: A Status Report on the Leading Candidates

   • Neil H. Hendricks

   OriginalPaper 15 February 2011 Pages: 3 - 14

2. A Study Of Anisotropy Of Spin Cast And Vapor Deposited Polyimide Films Using Internal Reflection Techniques

   • Vladimir Liberman
   • Vincent Malba
   • Anthony F. Bernhardt

   OriginalPaper 15 February 2011 Pages: 15 - 20

3. Parylene AF-4: A Low ε_R Material Candidate For ULSI Multilevel Interconnect Applications

   • A. S. Harrus
   • M. A. Plano
   • J. Kelly

   OriginalPaper 15 February 2011 Pages: 21 - 33

4. Interconnect Process Technology Using Perfluorocyclobutane (PFCB)

   • P. H. Townsend
   • E. O. Shaffer
   • M. J. Radler

   OriginalPaper 15 February 2011 Pages: 35 - 40

5. Fluorocarbon Films from Plasma Polymerization of Hexafluoropropylene and Hydrogen

   • T. W. Mountsier
   • D. Kumar

   OriginalPaper 15 February 2011 Pages: 41 - 46

6. Toughened, Inorganic-Organic Hybrid Materials for Microelectronic Application

   • J. L. Hedrick
   • S. Srinivasan
   • J. Hummel

   OriginalPaper 15 February 2011 Pages: 47 - 58

7. Fluorinated Heteroaromatic Polyethers for Low Dielectric Constant/High Temperature Applications

   • G. Maier
   • J. M. Schneider
   • R. Hecht

   OriginalPaper 15 February 2011 Pages: 59 - 70

8. Thermal Curing Conditions for Low K-Fluorinated Polyimide Film for Use as the Interlayer Dielectric in ULSI

   • Y. K. Lee
   • S. P. Murarka
   • B. Auman

   OriginalPaper 15 February 2011 Pages: 71 - 77

9. Mechanical and Dielectric Properties of Low Permittivity Dielectric Materials

   • A. Alptekin
   • G. Czeremuszkin
   • M. DiRenzo

   OriginalPaper 15 February 2011 Pages: 79 - 84

10. Evaluation of PTFE Nanoemulsion as a Low Dielectric Constant Material ILD

    • S. C. Sun
    • Y. C. Chiang
    • H. Wu

    OriginalPaper 15 February 2011 Pages: 85 - 90

11. Nanoporous Silica for Low k Dielectrics

    • Teresa Ramos
    • Kevin Roderick
    • Douglas M. Smith

    OriginalPaper 15 February 2011 Pages: 91 - 98

12. Deposition and Characterization of Porous Silica Xerogel Films

    • Changming Jin
    • Scott List
    • Alok Maskara

    OriginalPaper 15 February 2011 Pages: 99 - 104

13. Low K Mesoporous Silica Films Through Template-Based Processing

    • P. J. Bruinsma
    • N. J. Hess
    • S. Baskaran

    OriginalPaper 15 February 2011 Pages: 105 - 110

14. Chemical Bonding of Fluorine Atoms in Siof Alloys: Microscopic Mechanisms for Reductions in the Dielectric Constant Relative to SiO₂

    • G. Lucovsky
    • H. Yang

    OriginalPaper 15 February 2011 Pages: 111 - 118

15. The Thermal Stability of Fluorine Doped Silicon Oxide Films Formed by Ecrcvd With SiF₄ and O₂ Gases

    • Seoghyeong Lee
    • Jae-Yoon Yoo
    • Jong-Wan Park

    OriginalPaper 15 February 2011 Pages: 119 - 125

16. Characterization of PECVD Deposited Fluorosilicate Glass (FSG) After CMP and Cleaning

    • D. Mordo
    • I. Goswami
    • B. Withers

    OriginalPaper 15 February 2011 Pages: 127 - 135

17. PE-CVD of F-Doped SiO₂ Thin Films Using Tetraisocyanatesilane and Tetrafluorosilane

    • T. Shirafuji
    • M. Sawada
    • S. Nishino

    OriginalPaper 15 February 2011 Pages: 137 - 142

18. Effect of Fluorine Addition to Plasma-Enhanced Chemical Vapor Deposition Silicon Oxide Film

    • S. W. Lim
    • M. Miyata
    • H. Komiyama

    OriginalPaper 15 February 2011 Pages: 143 - 148

19. Thermal Stability of Fluorinated SiO₂ Films: Effects of Hydration and Film-Substrate Interaction

    • J. P. Sullivan
    • D. R. Denison
    • A. G. Baca

    OriginalPaper 15 February 2011 Pages: 149 - 154

20. Diamondlike Carbon Materials as Low-k Dielectrics for Multilevel Interconnects in Ulsi

    • A. Grill
    • V. Patel
    • J. R. Paraszczak

    OriginalPaper 15 February 2011 Pages: 155 - 164

21. Fluorinated Amorphous Carbon Thin Films Grown from C₄F₈ for Multilevel Interconnections of Integrated Circuits

    • Kazuhiko Endo
    • Torn Tatsumi
    • Tadahiko Horiuchi

    OriginalPaper 15 February 2011 Pages: 165 - 170

22. Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications

    • Raymond N. Vrtis
    • Kelly A. Heap
    • Lloyd M. Robeson

    OriginalPaper 15 February 2011 Pages: 171 - 176

23. Comparison of Three Low Dielectric Constant Organic Polymers

    • C. B. Case
    • C. J. Case
    • R. Liu

    OriginalPaper 15 February 2011 Pages: 177 - 182

24. Optimization of AICu Wiring Delay in Advanced CMOS Technology

    • A. K. Stamper
    • V. McGahay
    • L. A. Serianni

    OriginalPaper 15 February 2011 Pages: 183 - 188

25. Preliminary Electrical Characterization of Pulsed-Plasma Enhanced Chemical Vapor Deposited Teflon-like Thin Films

    • Catherine B. Labelle
    • Scott J. Limb
    • James A. Burns

    OriginalPaper 15 February 2011 Pages: 189 - 194

26. Influence of the Cure Process on the Properties of Hydrogen Silsesquioxane Spin-On-Glass

    • D. Többen
    • P. Weigand
    • S. A. Cohen

    OriginalPaper 15 February 2011 Pages: 195 - 200