Optoelectronic Packaging for Computer and Communication Systems H.F. LockwoodC.A. Armiento OriginalPaper 24 October 1993 Pages: 3 - 8
High-Density, High-Speed Connectors Based on Flexible Etched Cricuits David B. Wrisley Jr. OriginalPaper 24 October 1993 Pages: 9 - 20
Z-Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film Lin LiD.D.L. Chung OriginalPaper 24 October 1993 Pages: 21 - 26
Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects J. DionP. BørgesenC.-Y. Li OriginalPaper 24 October 1993 Pages: 27 - 32
Bending of Flex Leads During Thermal Cycling L.T. ShiH. Tong OriginalPaper 24 October 1993 Pages: 33 - 40
Future Direction for Materials in Printed Circuit Technology W.T. ChenW. LafontaineC.S. Chang OriginalPaper 24 October 1993 Pages: 41 - 63
Characterization of Conductive Anodic Filament (CAF) by X-Ray Microtomography and by Serial Sectioning S.R. StockL.L. DollarG.R. Davis OriginalPaper 24 October 1993 Pages: 65 - 69
Reliability Studies on GE High Density Interconnect (HDI) Modules Kyung W. PaikEdward S. Bernard OriginalPaper 24 October 1993 Pages: 71 - 76
Effect of Microstructure on the Dissolution Kinetics of Copper Thin Films in Dilute Aqueous Solutions of Cupric Chloride L. Harper WalshN.B. FeilchenfeldJ.A. Schwarz OriginalPaper 24 October 1993 Pages: 79 - 84
The use of Gravure Offset Printing in the Realisation of Fine Line Thick Film Conductors S. LeppävuoriJ. VäänänenA. Uusimäki OriginalPaper 24 October 1993 Pages: 85 - 90
Diode Laser-Assisted Deposition of Gold and Copper from Thin Organometallic Films Stephane EvoyMarie-Hélène BernierEdward Sacher OriginalPaper 24 October 1993 Pages: 91 - 96
A New Technique to Generate Conductive Paths in Dielectric Materials M.J. DesilvaA.J. PedrazaM.J. Godbole OriginalPaper 24 October 1993 Pages: 97 - 102
Mechanical Properties of Plated Copper M.A. KorhonenD.D. BrownJ.E. Steinwall OriginalPaper 24 October 1993 Pages: 103 - 114
Reliability of Flex Coatings for High-Performance Applications H. TongC. WilsonL. Shi OriginalPaper 24 October 1993 Pages: 115 - 123
Models for the Thermomechanical Behavior of Metal/Ceramic Laminates S.M. SpearingM.A. TenhoverD.K. Hollen OriginalPaper 24 October 1993 Pages: 125 - 130
Ternary Phase Formation in 95PB-5SN Flip-Chip Solder Bonds Alan J. MocklerPeter J. GoodhewElizabeth A. Logan OriginalPaper 24 October 1993 Pages: 131 - 136
A Study of SN-PB-RE Solder Zhu YingFang HongyuanQian Yiyu OriginalPaper 24 October 1993 Pages: 137 - 143
Characterizing Soldering Fluxes Laura J. TurbiniGarth B. FreemanDavid Cauffiel OriginalPaper 24 October 1993 Pages: 147 - 152
An Experimental and Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Solder Joints Y.-H. PaoS. BadgleyE. Jih OriginalPaper 24 October 1993 Pages: 153 - 158
The Effect of Substrate on the Microstructure and Mechanical Behavior of Eutectic Indium-Tin J.L. Freer GoldsteinJ.W. Morris Jr. OriginalPaper 24 October 1993 Pages: 159 - 164
In-Situ TEM Study of Copper-Tin Intermetallic Formation Yujing WuElizabeth G. JacobsRussell F. Pinizzotto OriginalPaper 24 October 1993 Pages: 165 - 170
The Oxygen-Related Defect in Aluminum Nitride Ceramics: A Thermal Conduction Limiting Defect in a Technologically Important Material Jonathan H. HarrisRobert A. YoungmanRudy Enck OriginalPaper 24 October 1993 Pages: 171 - 182
Fabrication of Cofired ALN Multilayer Substrates at Low Temperature Sintering Koichi TeraoIchiro UchiyamaAkihiro Hamano OriginalPaper 24 October 1993 Pages: 183 - 188
Copper-Matrix Molybdenum Particle Composite as a Low-Thermal-Expansion Conductor Pay YihD.D.L. Chung OriginalPaper 24 October 1993 Pages: 189 - 193
Au/Ti and Au/Ni-Cr Metallization of CVD Diamond Substrates for Multichip Module Applications Prasad ChilakamarriIlango MeyyappanW.D. Brown OriginalPaper 24 October 1993 Pages: 195 - 200
Mössbauer Parameters Describing Several Intermetallic Phases in Tin-Containing Solders1 Robert C. RenoLaszlo Takacs OriginalPaper 24 October 1993 Pages: 201 - 206
Aluminum-Matrix Aluminum Nitride Particle Composite as a Low-Thermal-Expansion Thermal Conductor Shy-Wen LaiD.D.L. Chung OriginalPaper 24 October 1993 Pages: 207 - 212
Fluence Dependence of Excimer Laser Ablation of A1N Janet K. LumppChristopher N. CoretsopoulosSusan D. Allen OriginalPaper 24 October 1993 Pages: 213 - 218
Computational Problems in Orthopaedic Biomechanics Dean Taylor OriginalPaper 24 October 1993 Pages: 221 - 231
Density Functional Methods and Applications to Materials Problems Y.S. LiM.A. van DaelenM.P. Teter OriginalPaper 24 October 1993 Pages: 233 - 243
A Damage Integral Based Analysis and Simulation of the Thermal Fatigue of Diebonds David A. LilienfeldPeter BørgesenChe-Yu Li OriginalPaper 24 October 1993 Pages: 245 - 250
Molecular Modeling of the Crystal Structure of LARC-CPI Thermoplastic Polyimide Mark V. BrillhartJustyna TeverovskyPeggy Cebe OriginalPaper 24 October 1993 Pages: 251 - 256
Low Stress, High Resolution Photosensitive Polyimide Based on a BPDA/PDA/6FDAm Copolymer Marie AngelopoulosJeff GelormeJeff Labadie OriginalPaper 24 October 1993 Pages: 259 - 265
Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Applications. III. 1 to 20 Micron Patterned Films E. S. MoyerG. S. BeckerR. F. Harris OriginalPaper 24 October 1993 Pages: 267 - 276
High Temperature Polyimide Nanofoams Y. CharlierT. P. RussellJ. L. Hedrick OriginalPaper 24 October 1993 Pages: 277 - 282
The Effect of Curing on the Thermomechanical Properties of BPDA-PDA Polyimide Thin Films J. LeuY. S. KangP. S. Ho OriginalPaper 24 October 1993 Pages: 283 - 288
Electrical Characterization of Low Dielectric Constant LCP Composite Films L.M. WalpitaG. LundbergJ. Stamatoff OriginalPaper 24 October 1993 Pages: 289 - 294
Micro-ATR-IR as a Probe of BCB Layers for MCM-D/L Applications C. E. MohlerA. J. G. StrandjordT. G. Tessier OriginalPaper 24 October 1993 Pages: 295 - 300
Optical Properties of Low Dielectric Constant Polyimides and Effects of Orientation David C. RichPeggy CebeAnne K. St. Clair OriginalPaper 24 October 1993 Pages: 301 - 306
Moisture Absorption and its Effects on the Performance of Printed Circuit Materials P. C. LiuD. W. WangR. M. Murcko OriginalPaper 24 October 1993 Pages: 309 - 319
Factors Affecting Metal/Polymer Interface Durability in Microelectronics Packaging: Chemistry and Water Uptake H.M. ClearfieldB.K. FurmanS. Purushothaman OriginalPaper 24 October 1993 Pages: 321 - 331
Morphological Effects on the Materials Properties of Polyimides T. W. PoonJ. LeuP. S. Ho OriginalPaper 24 October 1993 Pages: 333 - 344
X-Ray Absorption Study of Ti and Cr Reactions with Triazine and Polyimide K. KonstadinidisR. L. OpilaH. Isaacs OriginalPaper 24 October 1993 Pages: 345 - 350
Investigations of Curing Chemistry and Hydrolytic Stability of Polyimide - on - Metal Interfaces B.H. CumpstonP.V. NagarkarS.D. Senturian OriginalPaper 24 October 1993 Pages: 351 - 357
Theoretical Modelling of Polymer Metallization: An Assessment of Bonding Mechanisms That Effect the Formation of Stable Metal Overlayers S. JansenM. PalmieriG. Whitwell OriginalPaper 24 October 1993 Pages: 359 - 364
Adhesion of Cyclotene™ (BCB) Coatings on Silicon Substrates P. H. TownsendD. SchmidtK. Berry OriginalPaper 24 October 1993 Pages: 365 - 370
An Adhesion Study of Copper and Chromium Films to Polyimide T.G. ChungJin YuI.S. Park OriginalPaper 24 October 1993 Pages: 377 - 382
Micromechanical Testing of Electronic Packaging Components and Materials C.-Y. LiB. YostJ. Dion OriginalPaper 24 October 1993 Pages: 385 - 394
Mechanical and Accelerated Testing of Flip Chip Interconnect Systems Ravi Subrahmanyan OriginalPaper 24 October 1993 Pages: 395 - 406
