Determination of the Mechanical Response of Thin Films with X-rays I. C. NoyanG. Sheikh OriginalPaper 21 October 1993 Pages: 3 - 13
Stress Measurements in Materials for Magnetic Recording V. RamanK.R. CofleyJ.K. Howard OriginalPaper 21 October 1993 Pages: 15 - 20
Real Time Stress Measurements During Growth of Aluminum Nitride on Si(111) and Si(001) W. J. MengJ. A. SellT. A. Perry OriginalPaper 21 October 1993 Pages: 21 - 26
Growth Stress in CVD-WGex Films Deposited by Reduction of WF6 by GeH4 G.J. LeusinkT.G.M. OosterlakenS. Radelaar OriginalPaper 21 October 1993 Pages: 27 - 32
The Transformation Characteristics in Thin Film SMA Heterostructures — The Importance of Interfacial Stress Accommodation Susan Z. HuaC. M. SuM. Wuttig OriginalPaper 21 October 1993 Pages: 33 - 37
Mechanical Stress Measurements in Window-Plated Permalloy Thin Film Strips C. A. Ross OriginalPaper 21 October 1993 Pages: 39 - 44
The Effect of Cold-Working on the Crystallization Temperature of Thin-Film Shape Memory Effect TiNi. John S. MadsenA. Peter Jardine OriginalPaper 21 October 1993 Pages: 45 - 49
Ti-W-N Deposition Stress as a Function of Microstructure A. WitvrouwW. De BosscherK. Maex OriginalPaper 21 October 1993 Pages: 51 - 56
Compressive Stress Increase with Repeated Thermal Cycling in Tantalum(Oxygen) Thin Films C. Cabrai Jr.L.A. ClevengerR.G. Schad OriginalPaper 21 October 1993 Pages: 57 - 61
Thermal Stress in Doped Silicate Glasses (B,P) Deposited by PECVD and LPCVD H. BouchardA. AzelmadT. Darwall OriginalPaper 21 October 1993 Pages: 63 - 68
Stress of TiO2 Thin Films Produced by Different Deposition Techniques C. OttermannJ. OttoK. Bange OriginalPaper 21 October 1993 Pages: 69 - 75
Stress-Temperature Behavior of O3-Teos Sub-Atmospheric CVD (SACVD) Oxide Films Deposited on Various Oxide Underlayers Stuardo A. RoblesEllie YiehBang C. Nguyen OriginalPaper 21 October 1993 Pages: 77 - 83
Stress Relaxation During Diffusional Phase Transformation under Induced Thermal Stress E. C. ZinguB. T. Mofokeng OriginalPaper 21 October 1993 Pages: 85 - 90
Stress in Thin Layers Applied by Substrate Bending; Calibration and Potentialities J.A. ChroboczekM. StöhrT.E. Whall OriginalPaper 21 October 1993 Pages: 91 - 94
ELastic Properties of Sputtered Thin Films: Influence of Different Preparation Conditions C.E. BottantM. ElenaP.M.Ossi OriginalPaper 21 October 1993 Pages: 95 - 100
Dependence of Residual Stress of Diamond-Like Carbon Films on Precursor Gases and Process Parameters of RF PACVD Kwang-Ryeol LeeYoung-Joon BaikKwang Yong Eun OriginalPaper 21 October 1993 Pages: 101 - 106
Effects of Film Thickness and Annealing Temperature on the Stress in Amorphous Gd-Fe Alloy Thin Films Zhi-Feng ZhouYu-Dian Fan OriginalPaper 21 October 1993 Pages: 107 - 112
Mechanical Characterization of Thin Films Using Full-Field Measurement of Diaphragm Deflection R. I. PrattG. C. Johnson OriginalPaper 21 October 1993 Pages: 115 - 120
Load- and Depth-Sensing Indentation Tester for Properties Measurement at Non-Ambient Temperatures Karl B. YoderDonald S. Stone OriginalPaper 21 October 1993 Pages: 121 - 126
Mechanics of Contacts at less than 100Å Scale: Indentation and AFM S.P. JarvisT.P. WeihsJ.B. Pethica OriginalPaper 21 October 1993 Pages: 127 - 132
Micro-Impact Technique and its Applications T.W. WuC.-K. LeeR.H. Wang OriginalPaper 21 October 1993 Pages: 133 - 139
Residual Stress Effects in the Scratch Adhesion Testing of Tantalum Thin Films Richard L. WhiteJohn NelsonWilliam W. Gerberich OriginalPaper 21 October 1993 Pages: 141 - 146
Long-Term Stability of Nickel in Resonant Micro-Mechanical Devices G.L. PovirkJ. BernsteinS.B. Brown OriginalPaper 21 October 1993 Pages: 147 - 152
Silicon Surface Micromachined Structures for the Stress Measurement of Thin Films Risto MutikalnenMarkku Orpana OriginalPaper 21 October 1993 Pages: 153 - 158
Accuracy and Reliability of Bulge Test Experiments Martha K. SmallJoost J. VlassakWilliam D. Nix OriginalPaper 21 October 1993 Pages: 159 - 164
Modeling of the Blister Test to Express Adhesive Strength in Terms of Measurable Quantities Jim SizemoreDavid A. StevensonJohn Stringer OriginalPaper 21 October 1993 Pages: 165 - 170
Mechanical Parameter Extraction Using Resonant Structures J. EldersH.A.C. TilmansM. Elwenspoek OriginalPaper 21 October 1993 Pages: 171 - 176
A Simple Method for Determination of the Elastic Modulus of Thin Films on a Substrate M.V. SwainE.R. Weppelmann OriginalPaper 21 October 1993 Pages: 177 - 182
Study of Bulk and Film-Substrate Composite Materials Behaviour under Vickers Indentation by Three-Dimensional Finite Element Simulation Haifeng WangHerwig Bangert OriginalPaper 21 October 1993 Pages: 183 - 188
Effect of the Substrate on Microindentation Behavior T.J. LardnerJ.E. RitterH.B. Karamustafa OriginalPaper 21 October 1993 Pages: 189 - 194
The Calibration of the Nanoindenter N. J. MccormickM. G. GeeD. J. Hall OriginalPaper 21 October 1993 Pages: 195 - 200
A Quantitative Model for Interpreting Nanometer Scale Hardness Measurements of Thin Films W.H. PoislB.D. FabesW.C. Oliver OriginalPaper 21 October 1993 Pages: 201 - 208
The Analysis of Depth-Sensing Indentation Data Shefford P. Baker OriginalPaper 21 October 1993 Pages: 209 - 216
The Analysis of Depth-Sensing Indentation Data: Review of the Special Discussion Session Shefford P. BakerT.P. Weihs OriginalPaper 21 October 1993 Pages: 217 - 219
Micro-Wear Technique and its Application to Ultra Thin Film Systems T.W. WuC.-K. Lee OriginalPaper 21 October 1993 Pages: 221 - 226
Validity of Adhesion Between Films and Substrate with Friction-Detected Scratch Test Ru Wang OriginalPaper 21 October 1993 Pages: 227 - 233
Stress-Induced Voiding vs Temperature and Passivation Thickness: IN Al-0.5%Cu-2%Si, Al-0.5%Cu and Al-1%Si T. D. SullivanL. A. Miller OriginalPaper 21 October 1993 Pages: 237 - 248
Strain Relaxation and in-situ Observation of Voiding in Passivated Aluminum Alloy Lines. Paul R. BesserThomas N. MariebJohn C. Bravman OriginalPaper 21 October 1993 Pages: 249 - 254
Microstructure Based Modelling of Stress Migration and Electromigration Induced Failure Distributions P. BørgesenM. A. KorhonenC.-Y. Li OriginalPaper 21 October 1993 Pages: 255 - 266
Observation and Modelling of Electromigration-Induced Void Growth in Al-Based Interconnects O. KraftS. BaderE. Arzt OriginalPaper 21 October 1993 Pages: 267 - 272
Mechanical Stress Effects on Electromigration Voiding in a Meandering Test Stripe Lynn E. LowryBeverly H. TaiL.H. Walsh OriginalPaper 21 October 1993 Pages: 273 - 278
Analysis of Stresses at Singular Points of Patterned Structures. A. ChouafG. LoppinJ.M. Terriez OriginalPaper 21 October 1993 Pages: 279 - 284
X-Ray Determination and Analysis of Residual Stresses in Uniform Films and Patterned Lines of Tungsten L. ManiguetM. IgnatPh. Normandon OriginalPaper 21 October 1993 Pages: 285 - 290
Analysis of Thermal Stress Induced Void Growth During Thermal Cycling D.D. BrownM.A. KorhonenC.-Y. Li OriginalPaper 21 October 1993 Pages: 291 - 296
Non-Destructive Evaluation of Strains and Voiding in Passivated Copper Metallizations Richard P. VinciThomas N. MariebJohn C. Bravman OriginalPaper 21 October 1993 Pages: 297 - 302
Grain Boundary Sliding in Thin Substrate–Bonded Al Films M. PrielerH.G. BohnH. Trinkaus OriginalPaper 21 October 1993 Pages: 305 - 315
Dispersion Strengthening of Al Films by Oxygen Ion Implantation S. BaderP.A. FlinnW.D. Nix OriginalPaper 21 October 1993 Pages: 317 - 321
Stress Gradient and Relaxation Measurements in Al and Oxygen-Implanted Al Films. Paul R. BesserStefan BaderJohn C. Bravman OriginalPaper 21 October 1993 Pages: 323 - 328
Effects of Confinement on Plastic Deformation in Passivated Al Films S.G.H. AndersonI.-S. YeoR. Cheung OriginalPaper 21 October 1993 Pages: 329 - 336
Stress in Copper Thin Films with Barrier Layers Richard P. VinciJohn C. Bravman OriginalPaper 21 October 1993 Pages: 337 - 341
