1. Deformation Mechanisms in Thin Films

   • H. J. Frost

   OriginalPaper 24 October 1992 Pages: 3 - 14

2. Understanding Void Phenomena in Metal Lines: Effects of Mechanical and Electromigration Stress

   • Paul A. Flinn

   OriginalPaper 24 October 1992 Pages: 15 - 26

3. Prediction and Prevention of Stress Migration and Electromigration Damage in Passivated Lines

   • P. Børgesen
   • M. A. Korhonen
   • C.-Y. Li

   OriginalPaper 24 October 1992 Pages: 27 - 32

4. High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration Stress

   • Michael C. Madden
   • Edward V. Abratowski
   • Paul A. Flinn

   OriginalPaper 24 October 1992 Pages: 33 - 38

5. Estimation of Thermal Stresses and Stress Concentrations in Confined Interconnect Lines of Rectangular Cross Section

   • M. A. Korhonen
   • P. Børgesen
   • Che-Yu Li

   OriginalPaper 24 October 1992 Pages: 39 - 44

6. A Simple Model for Stress Voiding in Passivated Thin Film Conductors

   • J.R. Lloyd
   • E. Arzt

   OriginalPaper 24 October 1992 Pages: 45 - 50

7. Electromigration Reliability Simulator

   • J. Niehof
   • D. C. L. van Geest
   • J. F. Verwey

   OriginalPaper 24 October 1992 Pages: 51 - 56

8. Vacancy Supersaturation Model for Electromigration Failure Under DC and Pulsed DC Stress

   • J. J. Clement

   OriginalPaper 24 October 1992 Pages: 57 - 63

9. Reliability of Interconnects Exhibiting Bimodal Electromigration-Induced Failure Distributions

   • H. Kahn
   • C. V. Thompson
   • S. S. Cooperman

   OriginalPaper 24 October 1992 Pages: 65 - 70

10. Microstructure Evolution in Metal Interconnects

    • D. A. Smith
    • T. Kwok
    • C. Stanis

    OriginalPaper 24 October 1992 Pages: 73 - 82

11. Microstructure and the Development of Electromigration Damage in Narrow Interconnects

    • A. L. Greer
    • W. C. Shih

    OriginalPaper 24 October 1992 Pages: 83 - 94

12. Electromigration in Bicrystal Al Lines

    • Hai P. Longworth
    • C. V. Thompson

    OriginalPaper 24 October 1992 Pages: 95 - 100

13. A Microscopical and Statistical Study of Electromigration Damage and Failure in Al-4wt.%Cu Tracks

    • W. C. Shih
    • T. C. Denton
    • A. L. Greer

    OriginalPaper 24 October 1992 Pages: 101 - 106

14. Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films

    • K. P. Rodbell
    • D. B. Knorr
    • D. P. Tracy

    OriginalPaper 24 October 1992 Pages: 107 - 112

15. Effects of Film Texture on Electromigration Lifetime Predictions

    • D. B. Knorr
    • K. P. Rodbell

    OriginalPaper 24 October 1992 Pages: 113 - 118

16. Quantitative Analysis of Electromigration-Induced Damage in Al-Based Interconnects

    • O. Kraft
    • J. E. Sanchez
    • E. Arzt

    OriginalPaper 24 October 1992 Pages: 119 - 124

17. Electromigration Performance of Fluorinated Aluminum Films for VLSI Applications

    • K. P. MacWilliams
    • W. E. Yamada
    • M. Isaac

    OriginalPaper 24 October 1992 Pages: 125 - 130

18. Microstructural Aspects of Interconnect Failure

    • J. Sanchez
    • E. Arzt

    OriginalPaper 24 October 1992 Pages: 131 - 142

19. Interconnection Challenges of the 1990's

    • Michael A. Fury

    OriginalPaper 24 October 1992 Pages: 145 - 154

20. Reliable Metallization System for Flip-Chip Optoelectronic Integrated Circuits

    • Osamu Wada

    OriginalPaper 24 October 1992 Pages: 155 - 163

21. Effects of Line Width, Thickness and Alloy Temperature on the Breakdown Energy of Thin Aluminum Lines

    • Rahul Jairath
    • Kamesh Gadepall
    • Rajeeva Lahri

    OriginalPaper 24 October 1992 Pages: 165 - 170

22. Electromigration in Cu/W Structure

    • C-K. Hu
    • M. B. Small
    • P. S. Ho

    OriginalPaper 24 October 1992 Pages: 171 - 176

23. Quick Tests for Electromigration: Useful but Not Without Danger

    • J. R. Lloyd

    OriginalPaper 24 October 1992 Pages: 177 - 186

24. Planarized Copper Interconnects by Selective Electroless Plating

    • M. H. Kiang
    • J. Tao
    • S. S. Wong

    OriginalPaper 24 October 1992 Pages: 187 - 197

25. Ion Implantation to Inhibit Corrosion of Copper

    • P. J. Ding
    • W. A. Lanford
    • S. P. Murarka

    OriginalPaper 24 October 1992 Pages: 199 - 204

26. The Effect of Copper on the Titanium-Silicon Dioxide Reaction and the Implications for Self-Encapsulating, Self-Adhering Metallization Lines

    • Stephen W. Russell
    • Jian Li
    • James W. Mayer

    OriginalPaper 24 October 1992 Pages: 205 - 210

27. Stress-Related Phenomena in Capped Aluminum-Based Metallizations

    • Carole D. Graas

    OriginalPaper 24 October 1992 Pages: 211 - 216

28. Hardness and Modulus Studies on Dielectric Thin Films

    • Chien Chiang
    • Gabi Neubauer
    • David B. Fraser

    OriginalPaper 24 October 1992 Pages: 219 - 230

29. The Role of “Antenna” Structure on Thin Oxide Damage from Plasma Induced Wafer Charging

    • Sychyi Fang
    • James P. McVittie

    OriginalPaper 24 October 1992 Pages: 231 - 236

30. Reliability of Submicron Mosfet's with Deposited Gate Oxides under F-N Injection and Hot-Carrier Stress

    • Ming-Yin Hao
    • Jack C. Lee
    • Clarence W. Teng

    OriginalPaper 24 October 1992 Pages: 237 - 242

31. Effects of X-ray Irradiation on MOSFET Characteristics and DRAM Leakage Phenomena

    • Srinandan R. Kasi
    • Steven H. Voldman

    OriginalPaper 24 October 1992 Pages: 243 - 248

32. Positive Charge in Silicon Dioxide Due to High Electric Field FN Injection

    • X. Gao
    • S. Yee
    • H. Mollenkopf

    OriginalPaper 24 October 1992 Pages: 249 - 254

33. Electrical and Reliability Characteristics of Silicon-Rich Oxide for Non-Volatile Memory Applications

    • Bikas Maiti
    • Jack C. Lee

    OriginalPaper 24 October 1992 Pages: 255 - 260

34. Highly Reliable Stacked Thermal/LPCVD Oxides for Ultrathin Gate Dielectric Applications

    • Bikas Maiti
    • Jack C. Lee

    OriginalPaper 24 October 1992 Pages: 261 - 266

35. A New Polymeric Material for ESD and Corrosion Protection

    • J. P. Franey
    • R. S. Freund
    • B. Beamer

    OriginalPaper 24 October 1992 Pages: 267 - 274

36. Advances in the Thermal-Oxidative Stabilization of Divinyl Siloxane Bis-Benzocyclobutene Polymer Coatings

    • T. M. Stokich Jr.
    • D. C. Burdeaux
    • R. M. Dettman

    OriginalPaper 24 October 1992 Pages: 275 - 280

37. Imaging VLSI Cross Sections by Atomic Force Microscopy

    • Gabi Neubauer
    • M. Lawrence
    • Thad J. Johnson

    OriginalPaper 24 October 1992 Pages: 283 - 288

38. The Evaluation of the True Test Temperature During Wafer-Level Electromigration Tests

    • G. L. Baldini
    • A. Scorzoni
    • D. Trombetti

    OriginalPaper 24 October 1992 Pages: 289 - 294

39. Tem Investigation of Implanted Photoresist Residues Remaining After Oxygen Plasma Ashing

    • S. Yegnasubramanian
    • C. W. Draper
    • C. W. Pearce

    OriginalPaper 24 October 1992 Pages: 295 - 300

40. Computer Simulation of Materials Failure Processes in a Thermal or Radiational Environment

    • S. Shimamura

    OriginalPaper 24 October 1992 Pages: 301 - 306

41. Analysis of Stresses in a Multilevel Configuration by Using a Design of Experiment Method

    • M. Ignat
    • A. Chouaf
    • M. Marty

    OriginalPaper 24 October 1992 Pages: 307 - 312

42. The Impact of Device Asymmetry on the Electrical and Reliability Properties of Ferroelectric PZT for Memory Applications

    • Jiyoung Kim
    • C. Sudhama
    • Al Tasch

    OriginalPaper 24 October 1992 Pages: 313 - 318

43. Plasma Enhanced Liquid Source-Cvd Of Ta₂O₅ using penta Ethoxy tantalum source and its characteristics

    • P. A. Murawala
    • M. Sawai
    • Sg. Fujita

    OriginalPaper 24 October 1992 Pages: 319 - 324