An Overview of Multichip Module Technology for low Power Applications Chung W. HoSharon McAfee-Hunter OriginalPaper 24 October 1992 Pages: 3 - 11
New Developments in Soluble Thermoplastic High Glass Transition Temperature Polyimides M. E. RogersT. M. MoyJ. E. McGrath OriginalPaper 24 October 1992 Pages: 13 - 29
Properties and Microstructure of Mullite-Glass Ceramics for Multilayer Ceramic Substrates N. UshifusaK. SakamotoT. Fujita OriginalPaper 24 October 1992 Pages: 31 - 36
Photosensitive Dielectric Film Developed Using a Polymer Blend M. TaniS. MiyaharaT. Sato OriginalPaper 24 October 1992 Pages: 37 - 42
Polymeric Materials Requirements for the GE High-Density Interconnect Process H.S. ColeB. GorowitzJ. Lupinski OriginalPaper 24 October 1992 Pages: 43 - 48
Polymer/Metal Interconnection Systems for Microelectronics Packaging Ho-Ming Tong OriginalPaper 24 October 1992 Pages: 51 - 69
Polyimide for Multichip Modules: Materials and Process Challenges T. RuckerV. MuraliH. Neuhaus OriginalPaper 24 October 1992 Pages: 71 - 82
Fluorinated Parylene as an Interlayer Dielectric for Thin Film MCM’s S. DabralX. ZhangJ. F. McDonald OriginalPaper 24 October 1992 Pages: 83 - 89
Low TCE Polyimides from Polyamic Acid Blends and Copolymers: Preparation and Characterization Studies Krishna G. SachdevSandra Graham-OdePaul S. Ho OriginalPaper 24 October 1992 Pages: 91 - 96
Liquid Etch of Moisture Resistant Polyimides D. E. FjareA. J. BeuhlerC. A. Navar OriginalPaper 24 October 1992 Pages: 97 - 105
The Effect of Photoreactive Substituents on the Morphological Structure and Properties of BPDA-PPD Based Polyimides John C. CoburnM. T. PottigerC. A. Pryde OriginalPaper 24 October 1992 Pages: 107 - 115
Uni-Directional Shrinkage Sintering for Ceramic Packaging Substrates with Low Dimensional Tolerances Hironori Kodama OriginalPaper 24 October 1992 Pages: 117 - 122
Cure Studies of Fluorinated Polyamic Acids by Thermal-IR Robert T. RoginskiDouglas E. Fjare OriginalPaper 24 October 1992 Pages: 123 - 134
Cure Technology for Controlled Stress in Thin Benzocyclobutene Coatings P. H. TownsendD. C. BurdeauxM. G. Dibbs OriginalPaper 24 October 1992 Pages: 135 - 140
Mechanical Characterization and Constitutive Description of Thin-Film Polymeric Materials T. Y. WuD. L. Questad OriginalPaper 24 October 1992 Pages: 143 - 160
Studies of PQ-100(TM) Polyquinoline Film for Multichip Module(MCM) Applications Kyung W. PaikHerbert S. ColeNeil H. Hendricks OriginalPaper 24 October 1992 Pages: 161 - 166
Experimental Measurement and Analysis of Microelectronics Application Polymer Materials Properties Y.H. JengMirng-Ji LiiP.A. Flinn OriginalPaper 24 October 1992 Pages: 167 - 173
Stresses in Polyimide Films during Cure and Thermal Cycling David J. MonkYongxiang HeDavid S. Soane OriginalPaper 24 October 1992 Pages: 175 - 181
The Adhesion of Polymer-Polymer Interfaces Hugh R. Brown OriginalPaper 24 October 1992 Pages: 183 - 198
Characterization of Polyimide Thin Films on Metals Jiong-Ping LuPradnya V. NagarkarStephen D. Senturia OriginalPaper 24 October 1992 Pages: 199 - 204
Experimental Analysis of the Adhesion of Copper and Chromium Films Deposited on a Polymer M. IgnatL. FayetteJ. Torres OriginalPaper 24 October 1992 Pages: 207 - 212
Waxd Study of Low TCE Polyimide Films Formed from Polyamic Acid Blends and Copolymers. Thomas L. NunesKrishna G. Sachdev OriginalPaper 24 October 1992 Pages: 213 - 218
Thermal and Mechanical Analysis of a Multichip Module M. S. Hu OriginalPaper 24 October 1992 Pages: 219 - 224
Water Transport Across Modified Polyimide Surfaces: Ion-Bombarded PMDA-ODA and BPDA-PDA H.M. ClearfieldB.K. FurmanS. Purushothaman OriginalPaper 24 October 1992 Pages: 237 - 242
X-Ray Determination of Residual Stresses of Encapsulated Thin Aluminum Lines M. J. RadlerC.E. CrowderP.H. Townsend OriginalPaper 24 October 1992 Pages: 243 - 249
Stresses in Thin Film Multilayer Interconnect Structures S. M. BruckD. B. Knorr OriginalPaper 24 October 1992 Pages: 251 - 256
Fatigue Failure Mechanisms in Pb95.5 Sn2Ag2.5 Solder Joints: a Combined SIMS/XRD Study A. ScandurraA. TorrisiO. Puglisi OriginalPaper 24 October 1992 Pages: 257 - 262
Characterization of Fluorinated Polyimide Films Pradnya V. NagarkarJiong Ping LuStephen D. Senturia OriginalPaper 24 October 1992 Pages: 263 - 268
A New, Reliable Snap Cure Die Attach Adhesive. David P. GallowayMy N. Nguyen OriginalPaper 24 October 1992 Pages: 271 - 280
Characterization and Use of Polyfluorosiloxanes in Automotive Applications Anthony Polak OriginalPaper 24 October 1992 Pages: 281 - 289
Effects of Electronics Assembly Processes on Benzotriazoletreated Printed Wiring Board Copper Surfaces. Howard E. EvansJulian P. PartridgeMarc W. Jackson OriginalPaper 24 October 1992 Pages: 291 - 296
The Application of Surface Mount Technology in Consumer Products Tatsuo HakutaMinoru Ishikawa OriginalPaper 24 October 1992 Pages: 297 - 304
A New Gold-Indium Eutectic Bonding Method Chin C. LeeChen Y. WangSteve S. Chan OriginalPaper 24 October 1992 Pages: 305 - 310
Formation Kinetics and Thin Film Stress of Tin Containing Intermetallic Compounds Chin-Jong ChanJei-Wei ChangLeo A. Chin OriginalPaper 24 October 1992 Pages: 311 - 316
Optical Interconnects and Interfaces for Electronic Subsystems K. RajasekharanJ.P. KrusiusG. George OriginalPaper 24 October 1992 Pages: 319 - 329
Passive Polymeric Waveguide Materials for Optical Interconnects Lynn D. HutchesonJohn P. ArringtonStephen F. Powell OriginalPaper 24 October 1992 Pages: 331 - 346
Development of New Polymeric Materials for Linear Waveguides H. K. KimS. KahnC. K. Ober OriginalPaper 24 October 1992 Pages: 347 - 352
New Patternable Materials for Electronic Packaging Michael PopallJürgen KappelJochen Schulz OriginalPaper 24 October 1992 Pages: 353 - 359
Electro-Optic Polymer Devices Rick LytelFerris LipscombTony Ticknor OriginalPaper 24 October 1992 Pages: 363 - 378
Coupling of Light into Single-Mode Optical Fiber for Data Communications Ronald C. LaskyJanet L. MackayKurt D. Carlson OriginalPaper 24 October 1992 Pages: 379 - 393
Process Dependence of Microstructure and Properties of Sintered Aluminum Nitride for Electronic Packaging I. DuttaS. MitraJ. Cooper OriginalPaper 24 October 1992 Pages: 395 - 400
Deposition, Characterization, and Application of Aluminum Nitride Thin Films for Microelectronics C. YuS. KimG. Blalock OriginalPaper 24 October 1992 Pages: 401 - 405
Stress Measurement Using a Bilayer Metal-Ceramic Strip Shukla KapurPhilip L. Flaltz OriginalPaper 24 October 1992 Pages: 407 - 413
The use of Microindentations to Measure the Mechanical Protection Provided by Polymeric I.C. Buffer Coatings C.A. GealerY.H. JengJ.M. Gaudette OriginalPaper 24 October 1992 Pages: 415 - 421
Area Array Solder Joints for Passive Alignment John McGroartyBoris YostChe-Yu Li OriginalPaper 24 October 1992 Pages: 423 - 434
