Volume 226, Issue 1

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December 1991

Symposium H — Mechanical Behavior of Materials and Structures in Microelectronics

Issue Editors:

R. C. Cammarata,
D. D. L. Chung,
E. Suhir

57 articles in this issue

Isothermal Fatigue of 62Sn-36Pb-2Ag Solder
Semyon Vaynhan
Morris E. Fine
OriginalPaper 15 March 1991 Pages: 3 - 13
Presence of Anelastic Strains in High Lead Solders at Ambient and High Temperatures
J.K. Tien
A.I. Attarwala
OriginalPaper 15 March 1991 Pages: 15 - 22
A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling
Yi-Hsin Pao
Kuan-Luen Chen
An-Yu Kuo
OriginalPaper 15 March 1991 Pages: 23 - 28
Continuous Wettability Measurement for Solder Reflow
Cynthia M. Melton
Susan M. Yarling
Carl J. Raleigh
OriginalPaper 15 March 1991 Pages: 29 - 35
Numerical Simulation & Experimental Investigation of SMT Laser Microsoldering Thermal Process
Wang Chunqing
Qian Yiyu
Jiang Yihong
OriginalPaper 15 March 1991 Pages: 37 - 41
A Comparison of the Metallurgical Behavior of Gold and Copper Wires in Ball Bonding
Tomohiro Uno
K. Tatsumi
Y. Ohno
OriginalPaper 15 March 1991 Pages: 43 - 48
Numerical Analysis of the Bali. Forming Process in Copper Ball Bonding
Fang Hongyuan
Qian Yiyu
Jiang Yihong
OriginalPaper 15 March 1991 Pages: 49 - 54
Mechanical Behavior of Encapsulants in Microelectronic Packaging
C. P. Wong
OriginalPaper 15 March 1991 Pages: 57 - 65
Thermal Modeling of Plastic Ic Packages
A. Bar-Cohen
Devin E. Mix
OriginalPaper 15 March 1991 Pages: 67 - 84
Elastomeric Conductors for Electrical Contacts
Mingguang Zhu
D. D. L. Chung
OriginalPaper 15 March 1991 Pages: 85 - 90
Mechanical Modeling of Stress Generation During Cure of Encapsulating Resins ¹
R. R. Lagasse
R. S. Chambers
C. Bero
OriginalPaper 15 March 1991 Pages: 91 - 96
A Methodology for Reliability Assessment of Non-Ductile Encapsulants
Boon Wong
David C. Sandkulla
OriginalPaper 15 March 1991 Pages: 97 - 107
Mechanical Characterization of Photoresist Polymer Coatings as a Function of Processing History
Kun Tong
Jeffery F. Taylor
Richard J. Farris
OriginalPaper 15 March 1991 Pages: 109 - 114
The Interplay of Thermo-Mechanical Properties in the Growth and Processing of III-V Materials
A. S. Jordan
V. Swaminathan
OriginalPaper 15 March 1991 Pages: 117 - 127
The Effects of Stress on the Interdiffusion in Si_1-xGe_x/Si Superlattices
S. M. Prokes
OriginalPaper 15 March 1991 Pages: 129 - 140
Experimental Evaluation of Mechanical Behavior of GaAs Wafer Material
Jun Ming Hu
Michael Pecht
Donald Barker
OriginalPaper 15 March 1991 Pages: 141 - 146
Crystal Plasticity Analysis of Thermal Deformation and Dislocation Accumulation in Gaas/Si Patterned Structure
Tetsuya Ohashi
Naoyuki Honda
OriginalPaper 15 March 1991 Pages: 147 - 152
Silicon Carbide Whisker Reinforced Aluminum with Improved Temperature Resistance Due to the Use of a Phosphate Binder
Jeng-Maw Chiou
D. D. L. Chung
OriginalPaper 15 March 1991 Pages: 153 - 156
Stress Dependent Electrical Activation of Implanted Si IN GaAs - A Four Point Bending Study
J. G. Huang
R. J. Jaccodine
R. Bhat
OriginalPaper 15 March 1991 Pages: 157 - 162
The AC-Indentation Technique and its Application to Al and Al-Si Coatings
T. W. Wu
OriginalPaper 15 March 1991 Pages: 165 - 178
New Developments in the Dynamic Mechanical Analysis of Thin-Layer Materials
B. S. Berry
W. C. Pritchet
OriginalPaper 15 March 1991 Pages: 179 - 190
On The Electronic Contribution to Elastic Constants of Ultrathin Films of P-Type Si
Kamaxhya P Ghatak
Badal De
OriginalPaper 15 March 1991 Pages: 191 - 195
Stress in Metal Foils During Processing and Thermal Cycling.
A. Jagota
M. F. Lemon
Y. H. Hu
OriginalPaper 15 March 1991 Pages: 197 - 202
Microstructure and Mechanical Behavior of Magnetron Sputtered Al-Cu Films
Tsann Lin
V. Raman
OriginalPaper 15 March 1991 Pages: 203 - 208
Growth and Microstructure of Aluminum Nitride Thin Films
M. Grant Norton
Paul G. Kotula
James W. Mayer
OriginalPaper 15 March 1991 Pages: 209 - 214
Mechanical Behavior of Benzocyclobutene Films on Silicon Substrates
P. H. Townsend
T. M. Stokich
B. S. Huber
OriginalPaper 15 March 1991 Pages: 215 - 223
Microhardness of Thin SIO₂ Films On Silicon.
B. Yost
Che-Yu Li
Tim Sullivan
OriginalPaper 15 March 1991 Pages: 225 - 229
Laser Ultrasonic Measurement of Thin Film Elastic Properties
Sarah E. Bobbin
J. W. Wagner
R. C. Cammarata
OriginalPaper 15 March 1991 Pages: 231 - 234
Control of Microstructure and Stress in Sputtered Tungsten Thin Films on Silicon
R. R. Kola
G. K. Celler
OriginalPaper 15 March 1991 Pages: 235 - 240
Selective Growth of Poly-Diamond Thin Films Using Selective Damaging by Ultrasonic Agitation on a Variety of Substrates
R. Ramesham
T. Roppel
C. Ellis
OriginalPaper 15 March 1991 Pages: 241 - 248
Preparation of TI-Ba-Ca-Cu Superconducting Oxide Films by Spray Pyrolysis Technique
H. S. Koo
T. L. Kuo
P. T. Wu
OriginalPaper 15 March 1991 Pages: 249 - 254
Relaxation of Thermal Stresses in Al-Films
H. G. Bohn
W. Pill
W. Schilling
OriginalPaper 15 March 1991 Pages: 255 - 259
Stress and Resistivity in Reactively Sputtered Amorphous Metallic Ta-Si-N Films
C.. -K. Kwok
E. Kolawa
Ray C. Lee
OriginalPaper 15 March 1991 Pages: 261 - 266
Mechanical Behavior of Materials in Microelectronic and Fiber-Optic Structures: Application of Analytical Modeling - Review
E. Suhir
OriginalPaper 15 March 1991 Pages: 269 - 277
Strains and Relaxations Near metal Alumlnide/Semiconductor Interfaces
W. W. Gerberich
J. E. Angelo
P. I. Cohen
OriginalPaper 15 March 1991 Pages: 279 - 289
Spiral Cracking Around a Strained Cylindrical Inclusion in a Brittle Material and Implications for Vias in Integrated Circuits
L. B. Freund
K. S. Kim
OriginalPaper 15 March 1991 Pages: 291 - 302
Fracture Strength of A1₂0₃ Insulating Thin Film for High Density Wiring Substrate
Masahiro Jono
Atsushi Sugeta
OriginalPaper 15 March 1991 Pages: 303 - 314
Aging and Fracture Behavior of Polymers
A. Chudnovsky
C. P. Bosnyak
OriginalPaper 15 March 1991 Pages: 315 - 323
A Micromechanical Analysis of the Signal Propagation in Composite Materials
C. S. Chen
OriginalPaper 15 March 1991 Pages: 325 - 329
Thermal Expansion Model for Multiphase Electronic Packaging Materials
Ronald E. Allred
William E. Warren
OriginalPaper 15 March 1991 Pages: 331 - 338
Curvature Measurements of Tri-Material Structures Under Thermal Excursion
Guo-Quan Lu
Boris Mogilevsky
Tapan K. Gupta
OriginalPaper 15 March 1991 Pages: 339 - 344
Residual Stress Measurement in Silicon Substrate After Local Thermal Oxidation Using Microscopic Raman Spectroscopy
Hideo Miura
Hiroshi Sakata
Shinji Sakata Merl
OriginalPaper 15 March 1991 Pages: 345 - 350
Effects of Plastic Deformation on Charge Transport in Mercuric Iodide Radiation Detectors
J. Marschall
F. Milstein
V. Gerrish
OriginalPaper 15 March 1991 Pages: 351 - 356
Stereoimaging Determination of Strains in Surface Mounted Components and Plated Through Holes Resulting from Thermal Cycung
David L. Davidson
OriginalPaper 15 March 1991 Pages: 357 - 361
Fracture Behavior of Silicon Cut with a High Power Laser
C. C. Chao
R. Chleboski
T. S. Gross
OriginalPaper 15 March 1991 Pages: 363 - 368
A New Approach to Evaluate the Delayed Fracture Behavior of an Optical Glass Fiber
M. Muraoka
H. Abé
OriginalPaper 15 March 1991 Pages: 369 - 374
The Singular Behavior of the Lattice Hardness of Bismuth Cuprates Under Thermocycling
V. N. Belomestnykh
O. L. Khasanov
A. A. Bush
OriginalPaper 15 March 1991 Pages: 375 - 381
Testing of Fracture Resistance of Materials
Beta Y. Ni
T. Y. Zhang
J. C. M. Li
OriginalPaper 15 March 1991 Pages: 383 - 388
Mechanisms of Inelastic Deformation and Stress Relaxation in Thin Metallizations Bonded to Hard Substrates
M. A. Korhonen
P. Børgesen
Che-Yu Li
OriginalPaper 15 March 1991 Pages: 391 - 400
Stress Induced Void Nucleation in Narrow Aluminum Alloy Lines
P. Børgesen
M. A. Korhonen
C.-Y. Li
OriginalPaper 15 March 1991 Pages: 401 - 406

Volume 226, Issue 1

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