Volume 1560, Issue 1

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December 2013

Symposium BB — Evolutions in Planarization—Equipment, Materials, Techniques and Applications

Issue Editors:

C. Borst,
D. Canaperi,
T. Doi,
J. Sorooshian

13 articles in this issue

Development of intelligent pad and application to analysis of pressure distribution on polishing pad in CMP process
Masaharu Kinoshita
Jaehong Park
Haedo Jeong
Articles 01 September 2013 Article: 406
Characterization of chemically modified thin films for optimization of metal CMP applications
G. Bahar Basim
Ayse Karagoz
Zeynep Ozdemir
Articles 01 September 2013 Article: 405
Fluorescence Correlation Spectroscopic Investigation of Surface Adsorption of CMP Slurry Additives on Abrasive Particles
Ashley E. Wayman
Daniel K. Turner
Edward E. Remsen
Articles 01 September 2013 Article: 404
Surfactant Mediated Slurry Formulations for Ge CMP Applications
G. Bahar Basim
Ayse Karagoz
Ivan Vakarelski
Articles 01 September 2013 Article: 402
3D TSV - Influence of electrolyte composites and anneal temperatures to copper protrusion and planarization
Catharina Rudolph
Holger Wachsmuth
Juergen M. Wolf
Articles 01 September 2013 Article: 303
Progress and Challenges for Chemical Mechanical Polishing of Gallium Nitride
Hideo Aida
Toshiro Doi
Koji Koyama
Articles 01 September 2013 Article: 302
Characteristics in SiC-CMP using MnO₂ slurry with Strong Oxidant under Different Atmospheric Conditions
Syuhei Kurokawa
Toshiro Doi
Tao Yin
Articles 01 September 2013 Article: 301
The Thermal Effects of CMP as a Particle Augmented Mixed Lubrication Tribosystem
Gagan Srivastava
C. Fred Higgs III
Articles 01 September 2013 Article: 204
A Fast, Experimentally validated, Particle Augmented Mixed Lubrication Framework to Predict CMP
Gagan Srivastava
C. Fred Higgs III
Articles 01 September 2013 Article: 203
A 3D Soft-EHL Model for Simulating Feature-scale Defects in Advanced Node ICs
Jonatan A. Sierra-Suarez
Gagan Srivastava
C. Fred Higgs
Articles 01 September 2013 Article: 202
Modeling of “Pad-in-a-Bottle”: A Novel Planarization Process Using Suspended Polymer Beads
Wei Fan
Joy Johnson
Duane S. Boning
Articles 01 September 2013 Article: 201
Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes
John H. Zhang
Wei-Tsu Tseng
Stephan Grunow
Articles 01 September 2013 Article: 104
Al CMP for Low Resistance Gate Fill for 20nm and Beyond Replacement Metal Gate
Laertis Economikos
Xing Zhang
S. V. Babu
Articles 01 September 2013 Article: 101

Volume 1560, Issue 1

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