Volume 1559, Issue 1

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December 2013

Symposium AA — Advanced Interconnects for Micro- and Nanoelectronics—Materials, Processes and Reliability

Issue Editors:

E. Kondoh,
M. R. Baklanov,
J. D. Bielefeld,
V. Jousseaume,
S. Ogawa

18 articles in this issue

Performance and Reliability of Thick Cu Interconnects for RF and Analog/Mixed Signal Technology
E. Cooney
J. P. Gambino
T. Shaw
Articles 01 August 2013 Article: 808
Mechanisms overview of Thermocompression Process for Copper Metal Bonding
Paul Gondcharton
Floriane Baudin
Bruno Imbert
Articles 01 August 2013 Article: 807
Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling
Chan-Su Yun
Xiaopeng Xu
Tommaso Cilento
Articles 01 August 2013 Article: 805
Evaluating Oxide Liner and Copper Barrier Integrity of Through-Silicon-Via by Electrical Characterization and Microanalysis
Minrui Yu
Bharat Bhushan
Sesh Ramaswami
Articles 01 August 2013 Article: 804
Adhesion Strength and Microstructure of Cu/Ni/OsO_x/glass Structure for Highly-Reliable Cu Interconnection
Mitsuhiro Watanabe
Eiichi Kondoh
Articles 01 August 2013 Article: 803
Understanding the Fundamentals for Package Induced Failure in BEOL Interconnect at 20nm Node
Vivian Ryan
Shan Gao
Matthias U. Lehr
Articles 01 August 2013 Article: 801
Self-learning kinetic Monte Carlo model for arbitrary surface orientations
Andreas Latz
Lothar Brendel
Dietrich E. Wolf
Articles 01 August 2013 Article: 703
Materials and scaling effects on on-chip interconnect reliability
C.-K. Hu
E. G. Liniger
D. Edelstein
Articles 01 August 2013 Article: 701
Structural Analysis of Pore Seal Layer Fabricated by Wet-process on Porous Low-k Films
Shoko S. Ono
Yasuhisa Kayaba
Hirofumi Tanaka
Articles 01 August 2013 Article: 604
Sealing of low-k dielectric (k=2.0) with self-assembled monolayers (SAMs) for the atomic layer deposition (ALD) of TiN
Yiting Sun
Elisabeth Levrau
Silvia Armini
Articles 01 August 2013 Article: 522
A New Solution to the Ni-fill issue for Silicide-last Process
Shu J. Mao
Li C. Zhao
Jiang Yan
Articles 01 August 2013 Article: 515
Electrophoretic Deposition of Carbon Nanotubes for Interconnections in Microelectronics
Chiew Keat Lim
Yadong Wang
Shixin Wu
Articles 01 August 2013 Article: 508
Analysis of Cu-Line EM Failure Kinetics Using Mass Transport TCAD Simulations
Mankoo Lee
Xuena Zhang
Dipankar Pramanik
Articles 01 August 2013 Article: 507
Post-etch treatment enabled electroless copper metallization of porous dielectric
Yezdi N. Dordi
Articles 01 August 2013 Article: 401
Effects of VUV and EUV Radiation on Ultra Low-k Materials Damage
Oleg Braginsky
Alexander Kovalev
Mikhail Baklanov
Articles 01 August 2013 Article: 311
SiC multilayer add/drop filter for optical interconnects
M. Vieira
M. A. Vieira
J. Costa
Articles 01 August 2013 Article: 206
Silicon photonics transceivers with InP on Si lasers
J. M. Fedeli
G. H. Duan
F. Lelarge
Articles 01 August 2013 Article: 205
Horizontal carbon nanotube interconnects for advanced integrated circuits.
Jean Dijon
Nicolo Chiodarelli
Raphael Ramos
Articles 01 August 2013 Article: 201

Volume 1559, Issue 1

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