Volume 154, Issue 1

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December 1989

Symposium K — Electronic Packaging Materials Science IV

Issue Editors:

R. Jaccodine,
K.A. Jackson,
E.D. Lilley,
R.C. Sundahl

56 articles in this issue

Acetylene-Terminated Polyimide Composites for Advanced Electronic Packaging Applications
A. Mahammad Ibrahim
OriginalPaper 21 February 2011 Pages: 3 - 10
Area-Selective Laser Processing Techniques for Multichip Interconnect
Y. S. Liu
H. S. Cole
OriginalPaper 21 February 2011 Pages: 11 - 20
Development of New Ion Beam Modification Techniques to Enhance Copper and Polyimide (PI) Adhesion in Multilevel Electronic Packaging.
Kyung W. Paik
Arthur L. Ruoff
OriginalPaper 21 February 2011 Pages: 21 - 26
Film Stress in High Density Thin Film Interconnect
J. Tony Pan
Steve Poon
OriginalPaper 21 February 2011 Pages: 27 - 37
Control of Thin Film Materials Properties Used in High Density Multichip Interconnect
J. J. H. Rechell
OriginalPaper 21 February 2011 Pages: 39 - 46
The Processing and Properties of Multilayer Interconnection Structures Using Thermoset Films Derived from Bisbenzocyclobutene.
P. H. Townsend
D. C. Burdeaux
J. N. Carr
OriginalPaper 21 February 2011 Pages: 47 - 52
Silicon Hybrid Multi-Chip Modules
Alastair D. Trigg
OriginalPaper 21 February 2011 Pages: 53 - 62
Mechanisms for Conduction Pathway Formation in Polymer Encapsulants
J. E. Anderson
D. A. Hoffmann
L. J. Bousse
OriginalPaper 21 February 2011 Pages: 65 - 71
Moisture and Purity in Polyimide Coatings
A. J. Beuhler
M. J. Burgess
R. T. Roginski
OriginalPaper 21 February 2011 Pages: 73 - 90
Protective Coating of Integrated Circuits for Operation in Corrosive Environments
E. J. Charlson
R. Sabeti
H. K. Yasuda
OriginalPaper 21 February 2011 Pages: 91 - 96
Gravimetric Measurements of Moisture Uptake in Polyimide Films Used in Integrated Circuit Packaging
Denice D. Denton
Hartono Pranjoto
OriginalPaper 21 February 2011 Pages: 97 - 105
Formation and Properties of Thermosetting and High T_gSystems
John K. Gillham
OriginalPaper 21 February 2011 Pages: 107 - 122
Dynamic Control of Water Concentration to Prolong The Life Time of Encapsulated Electronic Devices in High Humidity Environments
I. U. Kim
P. R. Troyk
J. E. Anderson
OriginalPaper 21 February 2011 Pages: 123 - 130
Moisture and Plastic Package Stability
K. R. Kinsman
W. E. Jahsman
R. C. Sundahl
OriginalPaper 21 February 2011 Pages: 131 - 141
Stress Measurement in Spin Coated Polyimide Films Using Time Average Holographic Interferometry
Michele A. Maden
Richard J. Farris
OriginalPaper 21 February 2011 Pages: 143 - 148
Low Dielectric, Hydrophobic Polyimide Homopolymers and Poly(Siloxane Imide) Segmented Copolymers for Electronic Applications
C. A. Arnold
Y. P. Chen
J. E. McGrath
OriginalPaper 21 February 2011 Pages: 149 - 160
Laser-Induced Formation of Thin Silicone Layers with High Purity
W. Roth
H.-J. Henkel
H. Markert
OriginalPaper 21 February 2011 Pages: 161 - 166
The Influence of Thermal and Solvent Cycling on the State of Stress in Polyimide Coatings
Scott T. Sackinger
R. Van Royan
R. J. Farris
OriginalPaper 21 February 2011 Pages: 167 - 172
Spin-On Dielectrics: Good News and Bad News
G. Smolinsky
N. Lifshitz
V. Ryan
OriginalPaper 21 February 2011 Pages: 173 - 182
Polyimides for Passivation of VLSI Circuits
Maarten A. van Andel
Wil F. M. Gootzen
OriginalPaper 21 February 2011 Pages: 183 - 193
Passivating Organic Coatings with Silicone Gels: The Correlation Between the Material Cure & its Electrical Reliability
C. P. Wong
OriginalPaper 21 February 2011 Pages: 195 - 204
Applications of SIMS to Spatially Modified Polymer Film Characterization
Richard W. Linton
Cheryl L. Judy
Sean F. Corcoran
OriginalPaper 21 February 2011 Pages: 207 - 215
surface Enrichment in Polymer Blends: Simple Theory and an Experimental Test
R. A. L. Jones
E. J. Kramer
S. A. Schwarz
OriginalPaper 21 February 2011 Pages: 217 - 225
Rutherford Backscattering Spectrometry Studies on Copper and Chromium Diffusion in Polyimide
Kyung W. Paik
Arthur L. Ruoff
OriginalPaper 21 February 2011 Pages: 227 - 232
Characterization of Interfaces Between Polymers and Metals by Static SIMS
W. J. Van Ooij
OriginalPaper 21 February 2011 Pages: 233 - 239
XPS Identification of Al-PVA Complex
S. Akhter
S. K. Jo
J. M. White
OriginalPaper 21 February 2011 Pages: 241 - 246
New Simulation of Polymers on Surfaces
F. Aguilera-Granja
Ryoichi Kikuchi
OriginalPaper 21 February 2011 Pages: 247 - 251
In Situ FTIR Investigations Of Polymer Surface Modification In Downstream Microwave Plasma Etching
Jihperng Leu
K. F. Jensen
OriginalPaper 21 February 2011 Pages: 253 - 258
Moisture Intrusion in Sio₂/Epoxy Interfaces
Ken M. Takahashi
OriginalPaper 21 February 2011 Pages: 259 - 264
Morphology of Lignin-Polyurethane Blends
D. FeldMan
N. A. Lacasse
OriginalPaper 21 February 2011 Pages: 265 - 270
Effect of Oxygen Plasma Treatments on Polypropylene-Epoxy Interfacial Strength
E. Occhiello
M. Morra
F. Garbassi
OriginalPaper 21 February 2011 Pages: 271 - 276
Corrosion of Aluminum Interconnect Passivated with Polyimide or Silicon Nitride
R. B. Comizzoli
R. L. Opila
Y. H. Wong
OriginalPaper 21 February 2011 Pages: 277 - 282
Solvent and Curing Effects on Diffusion at Polyimide Interfaces
S. F. Tead
E. J. Kramer
W. Volksen
OriginalPaper 21 February 2011 Pages: 283 - 292
Determination of the Bond Strength of a Metal Coating on a Substrate
Wolfgang Sachse
Kwang Yul Kim
H. D. Conway
OriginalPaper 21 February 2011 Pages: 293 - 303
”Automatized” Peel Testing: Calculated Stresses and Deflections in the Film
Ephraim Suhir
OriginalPaper 21 February 2011 Pages: 305 - 310
Fluorinated Monomolecular Assemblies: Model Systems to Probe Chemical Interactions at the Polymer-Metal Interface
Lai-Kwan Chau
Marc D. Porter
OriginalPaper 21 February 2011 Pages: 311 - 316
XPS Study of the Interface of Polyimide on Cr And Ni.
Marco Garilli
Giovanni Marletta
Giuseppe Ferla
OriginalPaper 21 February 2011 Pages: 317 - 322
Adhesion of Copper to Polytetrafluoroethylene
Yong-Kil Kim
Chin-An Chang
M. Cali
OriginalPaper 21 February 2011 Pages: 323 - 328
FTIR and XPS Studies of Polyimide/Metal Interface Formation
William C. Stewart
Jihperng Leu
Klavs F. Jensen
OriginalPaper 21 February 2011 Pages: 329 - 334
The Aspects of Thermal Anneal to Intrinsic Stress and Microstructiire of Multilayer Thin Films
C. H. Yang
P. C. Chen
OriginalPaper 21 February 2011 Pages: 335 - 342
Influence of Substrate on Cracking of Vapour-Deposited Thin Films Due to Residual Stresses
Robert M. Fisher
J. Z. Duan
OriginalPaper 21 February 2011 Pages: 343 - 348
Low Temperature Route to Cordierite Ceramics Using a Reactive Liquid Phase Sintering Aid. Dense Body Preparation and Green Tape Fabrication
Ryan W. Dupon
Richard L. Mcconville
Mark S. Thompson
OriginalPaper 21 February 2011 Pages: 351 - 356
Conducting Polymer Films by Ion Implantation
P. H. Lu
R. A. Moody
I. H. Loh
OriginalPaper 21 February 2011 Pages: 357 - 362
XPS Study of Polyimide H-Film After Heat Treatment and Laser Processing
P. V. Nagarkar
E. K. Sichela
G. L. Doll
OriginalPaper 21 February 2011 Pages: 363 - 368
Mullite Ceramics for the Application to Advanced Packaging Technology
Jun Tanaka
Satoshi Kajita
Masami Terasawa
OriginalPaper 21 February 2011 Pages: 369 - 378
Ceramics in Microelectronics Packaging: Past, Present and Future
Rao R. Tummala
OriginalPaper 21 February 2011 Pages: 379 - 386
Dielectric, Conducting, and Photonic Polymers for Devices in Multichip Packaging
John F. Mcdonald
Nickolas P. Vlannes
Toh-Ming Lu
OriginalPaper 21 February 2011 Pages: 387 - 387
Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices
George G. Harman
Charles L. Wilson
OriginalPaper 21 February 2011 Pages: 401 - 413
Investigations into the use of Adhesives For Level-1 Microelectronic Interconnections
Peter B. Hogerton
J. B. Hall
R. S. Reylek
OriginalPaper 21 February 2011 Pages: 415 - 424
Straight Wall Bumps for High Lead Count Devices: Photolithography and Physical Properties.
Ivana Milosevic
Joerg Jasper
OriginalPaper 21 February 2011 Pages: 425 - 430

Volume 154, Issue 1

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