Volume 1335, Issue 1

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December 2011

Symposium O – Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics

Issue Editors:

M. Baklanov,
G. Dubois,
C. Dussarrat,
T. Kokubo,
S. Ogawa

17 articles in this issue

Optical Interconnect Technologies based on Silicon Photonics
Wim Bogaerts
Philippe Absil
Roel Baets
Articles 01 May 2011 Article: 1001
Development of Electrochemical Copper Deposition Screening Methodologies for Next Generation Additive Selection
Kevin Ryan
Kathleen Dunn
Jobert van Eisden
Articles 01 May 2011 Article: 927
Ozone Treatment on Nanoporous Ultralow Dielectric Materials to Optimize their Mechanical and Dielectrical Properties
Il-Yong Kang
Bo-Ra Shin
Hee-Woo Rhee
Articles 01 May 2011 Article: 916
Patterning Organic Fluorescent Molecules with SAM Patterns
Qiong Wu
Juanyuan Hao
Nan Lu
Articles 01 May 2011 Article: 908
Specific contact resistance of ohmic contacts to n-type SiC membranes
N. F. Mohd Nasir
A. S. Holland
P. Tanner
Articles 01 May 2011 Article: 901
Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics
Romain Cauchois
Mohamed Saadaoui
Jean-Christophe Fidalgo
Articles 01 May 2011 Article: 809
Microbump Impact on Reliability and Performance in Through-Silicon Via Stacks
Aditya P. Karmarkar
Xiaopeng Xu
Articles 01 May 2011 Article: 805
Comparison of TiN thin films grown on SiO₂ by reactive dc magnetron sputtering and high power impulse magnetron sputtering
F. Magnus
A. S. Ingason
J. T. Gudmundsson
Articles 01 May 2011 Article: 707
Amorphous Ta-N as a Diffusion Barrier for Cu Metallization
Neda Dalili
Qi Liu
Douglas G. Ivey
Articles 01 May 2011 Article: 603
32nm Node Highly Reliable Cu/Low-k Integration Technology with CuMn Alloy Seed
Shaoning Yao
Vincent McGahay
Stephan Grunow
Articles 01 May 2011 Article: 602
Defects in Low-k Insulators (κ=2.5 – 2.0): ESR Analysis and Charge Injection
V. V. Afanas’ev
K. Keunen
G. P. Beyer
Articles 01 May 2011 Article: 404
A Less Damaging Patterning Regime for a Successful Integration of Ultra Low-k Materials in Modern Nanoelectronic Devices
Sven Zimmermann
Nicole Ahner
Thomas Gessner
Articles 01 May 2011 Article: 402
Effect of Chemical Solutions and Surface Wettability on the Stability of Advanced Porous Low-k Materials
Q. T. Le
G. Vereecke
H. Struyf
Articles 01 May 2011 Article: 302
Optimizing Stressor Film Deposition Sequence in Polish Rate Order for Best Planarization
John H Zhang
Changyong Xiao
Ron Sampson
Articles 01 May 2011 Article: 301
Evaluation of Ultra-thin Layer Fabricated by Wet-process as a Pore-Seal for Porous Low-k Films
Shoko Sugiyama Ono
Kazuo Kohmura
Takamaro Kikkawa
Articles 01 May 2011 Article: 204
New designs of hydrophobic and mesostructured Ultra Low k materials with isolated mesopores
Anthony Grunenwald
André Ayral
Jean-Paul Simon
Articles 01 May 2011 Article: 104
Ultra Low-k Materials Based on Self-Assembled Organic Polymers
M. Pantouvaki
L. Zhao
M. R. Baklanov
Articles 01 May 2011 Article: 102

Volume 1335, Issue 1

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