Volume 1249, Issue 1

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December 2010

Symposia E/F — Advanced Interconnects and Chemical Mechanical Planarization for Micro-and Nanoelectronics

Issue Editors:

C. Bonafos,
Y. Fujisaki,
P. Dimitrakis,
E. Tokumitsu

46 articles in this issue

Nanometer Metrology of Periodic Structures with Ultrafast Optoacoustics
T. J. Grimsley
G. A. Antonelli
A. V. Nurmikko
OriginalPaper 01 August 2010 Article: 1005
Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation
Aditya P. Karmarkar
Xiaopeng Xu
Ajay Bhatnagar
OriginalPaper 01 August 2010 Article: 908
A three dimensional self-folding package (SFP) for electronics
Jeong-Hyun Cho
Steve Hu
David H. Gracias
OriginalPaper 01 August 2010 Article: 907
An Optimized 300 mm BCB Wafer Bonding Process for 3D Integration
Pratibha Singh
John Hudnall
Sitaram Arkalgud
OriginalPaper 01 August 2010 Article: 906
Fluxless Bonding Using Vacuum Ultraviolet and Formic Acid for 3D Interconnects
Katsuyuki Sakuma
Naoko Unami
Jun Mizuno
OriginalPaper 01 August 2010 Article: 904
Interconnect Technologies for Heterogeneous 3D Integration: CMOS and MEMS
Hyung Suk Yang
Muhannad S. Bakir
OriginalPaper 01 August 2010 Article: 901
Towards the Understanding of Resistive Contrast Imaging in In Situ Dielectric Breakdown Studies using a Nanoprober Setup
Konstantina Lambrinou
Kai Arstila
Wilfried Vandervorst
OriginalPaper 01 August 2010 Article: 814
Nanoscale Ruthenium Coatings of MEMS Switches Contacts
Sergey M. Karabanov
Andrey S. Karabanov
Anatoliy A. Krutilin
OriginalPaper 01 August 2010 Article: 809
Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection
Murata Naokazu
Kinji Tamakawa
Hideo Miura
OriginalPaper 01 August 2010 Article: 807
Wafer Bonding for Backside Illuminated CMOS Image Sensors Fabrication
Viorel Dragoi
Gerald Mittendorfer
Markus Wimplinger
OriginalPaper 01 August 2010 Article: 806
Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy
Yu-Chun Liang
Chih Chen
D. J. Yao
OriginalPaper 01 August 2010 Article: 802
Investigation of Joule heating effect in various stages of electromigration in flip-chip solder joints by infrared microscopy
Hsiang Yao Hsiao
Chih Chen
D. J. Yao
OriginalPaper 01 August 2010 Article: 801
Potential of the Ultra-thin Layer Fabricated by Wet-process as a Pore-Seal for Porous Low-k Films
Shoko Sugiyama Ono
Kazuo Kohmura
Kou Maekawa
OriginalPaper 01 August 2010 Article: 603
Silsesquioxane-based Photo-Patternable Porous Low-k Dielectric Materials
Jitendra S. Rathore
Blake Davis
Alshakim Nelson
OriginalPaper 01 August 2010 Article: 602
Barrier Metal Ions Drift into Porous Low k Dielectrics under Bias-Temperature stress
Ming He
Ya Ou
Toh-Ming Lu
OriginalPaper 01 August 2010 Article: 509
Contact Pressure Distribution in the Chemical Mechanical Planarization of 450mm Wafers
Pádraig Timoney
Eamonn Ahearne
Gerald Byrne
OriginalPaper 01 August 2010 Article: 505
Characterization and Modeling of Pad Asperity Response in CMP
Duane Boning
Wei Fan
OriginalPaper 01 August 2010 Article: 504
An Alternative Non-contact Planarization Technique by Utilizing the Electrokinetic Phenomenon
C. S. Leo
S. H. Ng
S. Danyluk
OriginalPaper 01 August 2010 Article: 503
Characterisation of Surface Processes during Oxide CMP by in situ FTIR Spectroscopy with Microstructured Reflection Elements at Silicon Wafers
Henrik Schumacher
Ulrich Künzelmann
Johann W. Bartha
OriginalPaper 01 August 2010 Article: 502
Low Temperature Bonding via Copper Nanowires for 3D Integrated circuits
Shu Rong Chun
Wardhana Aji Sasangka
Chee Mang Ng
OriginalPaper 01 August 2010 Article: 421
Designing Ultra-Low-k Dielectric Materials for Ease of Patterning
G. A. Antonelli
G. Jiang
H. H. Sawin
OriginalPaper 01 August 2010 Article: 415
C₂H₄-Based Plasma-Assisted CD Shrink and Contact Patterning for RRAM Application
Alexey P. Milenin
Judit Lisoni
Werner Boullart
OriginalPaper 01 August 2010 Article: 409
Characterization of Large Particles in Fumed Silica Based CMP Slurry
W. Scott Rader
Tim Holt
Kazusei Tamai
OriginalPaper 01 August 2010 Article: 408
The Mechanism of Low pH Silica Based Oxide Slurries
Michael L. White
Lamon Jones
Richard Romine
OriginalPaper 01 August 2010 Article: 407
Mechanistic Investigations of Ruthenium Polishing Enabled by Heterogeneous Catalysis with Titania Based Slurries
Daniela White
John Parker
R. Nagarajan
OriginalPaper 01 August 2010 Article: 404
Slurry Particle Agglomeration Model for Chemical Mechanical Planarization (CMP)
Joy M. Johnson
Duane S. Boning
OriginalPaper 01 August 2010 Article: 403
Copper-Sulfide Passivation Capping for Cu Interconnects
Uri Cohen
OriginalPaper 01 August 2010 Article: 403
Influence of Ionic Strength and pH-Value on the Silicon Dioxide Polishing Behaviour of Slurries based on Pure Silica Suspensions
Kathrin Estel
Ulrich Künzelmann
Herbert Barthel
OriginalPaper 01 August 2010 Article: 402
Non-Selective, High Removal Rates STI Slurries based on Lewis Acids Abrasives/Cationic Copolymers
Daniela White
John Parker
R. Nagarajan
OriginalPaper 01 August 2010 Article: 309
The Mechanism of Haze and Defectivity Reduction in a New Generation of High Performance Silicon Final Polishing Slurries
Michael L. White
Richard. Romine
William Ackerman
OriginalPaper 01 August 2010 Article: 303
Organometallic chemical liquid deposition (OMCLD) of Cu-SiO₂ films for 3D filling in microelectronic applications
Kilian Piettre
Virginie Latour
Pierre Fau
OriginalPaper 01 August 2010 Article: 302
Effect of Mechanical and Chemical Wear on Consistency of Conditioning in Diamonds
Yohei Yamada
Kazunori Kadomura
Ken Tsugane
OriginalPaper 01 August 2010 Article: 207
Design, Characteristics and Performance of Diamond Pad Conditioners
Doug Pysher
Brian Goers
John Zabasajja
OriginalPaper 01 August 2010 Article: 204
Fabrication of Organic Thin Films for Copper Diffusion Barrier Layers using Molecular Layer Deposition
Paul W. Loscutoff
Scott B. Clendenning
Stacey F. Bent
OriginalPaper 01 August 2010 Article: 203
Real-Time Control System for Improved CMP Pad Profiles
Gregory E. Menk
Sivakumar Dhandapani
Stan Tsai
OriginalPaper 01 August 2010 Article: 202
Retaining Ring Design Impact on CMP Process Stability and Optimization
Joseph E. Smith
Christopher Wargo
Alain Chabourel
OriginalPaper 01 August 2010 Article: 201
High quality NH₂SAM (self assembled monolayer) diffusion barrier for advanced copper interconnects
Arantxa Maestre Caro
Larry Zhao
Youssef Travaly
OriginalPaper 01 August 2010 Article: 201
Reducing Time Dependent Line to Line Leakage Following Post CMP Clean
Donald F. Canaperi
Satyavolu S. Papa Rao
Matthew A. Smalley
OriginalPaper 01 August 2010 Article: 109
High Removal Rate CMP Process on TSV Thick Cu Overburden
Raymond Caramto
Jamal Qureshi
Jerry Mase
OriginalPaper 01 August 2010 Article: 108
Copper migration during tungsten via formation
Jeff Gambino
Ed Cooney
Tom McDevitt
OriginalPaper 01 August 2010 Article: 108
CMP for Copper TSV Applications
Max Gage
Feng Liu
Lakshmanan Karuppiah
OriginalPaper 01 August 2010 Article: 107
Interfacial Resistive Properties of Multi-layered Silicon-based Ohmic Contacts
Madhu Bhaskaran
Sharath Sriram
Anthony S. Holland
OriginalPaper 01 August 2010 Article: 107
Cu CMP Edge Uniformity Improvement Studies for 32 nm Technology Node and Beyond
John H Zhang
Laertis Economikos
Paul Ferreira
OriginalPaper 01 August 2010 Article: 106
Planarization Specification for 22nm and beyond BEOL CMP
Jihong Choi
Changan Wang
Laertis Economikos
OriginalPaper 01 August 2010 Article: 104
Manufacturable 300mm Wafer Thinning for 3D Interconnect Applications
Jamal Qureshi
Raymond Caramto
Eiichi Yamamoto
OriginalPaper 01 August 2010 Article: 102
Effect of TaN Stoichiometry on Barrier Oxidation and Defect Density in 32nm Cu/Ultra-Low K Interconnects
Andrew H. Simon
Frieder Baumann
Matthew Angyal
OriginalPaper 01 August 2010 Article: 102

Volume 1249, Issue 1

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