Volume 1156, Issue 1

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December 2008

Symposium D – Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics–2009

Issue Editors:

M. Gall,
A. Grill,
F. Iacopi,
J. Koike,
T. Usui

25 articles in this issue

Direct Metal Nano-patterning Using Embossed Solid Electrolyte
Anil Kumar
Keng Hsu
Nicholas Fang
Articles 11 August 2009 Article: 704
Effect of Dielectric Capping Layer on TDDB Lifetime of Cu Interconnects in SiOF
Jeff Gambino
Fen Chen
Dave Mosher
Articles 13 July 2009 Article: 608
Copper Deposition Technology for Thru Silicon Via Formation Using Supercritical Carbon Dioxide Fluids Using a Flow Type Reaction System
Masahiro Matsubara
Eiichi Kondoh
Articles 13 July 2009 Article: 607
Large-Scale Electromigration Statistics for Cu Interconnects
Meike Hauschildt
Martin Gall
Richard Hernandez
Articles 01 June 2009 Article: 606
Power Delivery, Signaling and Cooling for 3D Integrated Systems
Muhannad S. Bakir
Gang Huang
Articles 13 July 2009 Article: 606
Effects of Thinned Multi-Stacked Wafer Thickness on Stress Distribution in the Wafer-on-a-Wafer (WOW) Structure
H. Kitada
N. Maeda
T. Ohba
Articles 10 June 2009 Article: 605
Failure Analysis and Process Improvement for Through Silicon Via Interconnects
Bivragh Majeed
Marc Van Cauwenberghe
Philippe Soussan
Articles 11 August 2009 Article: 604
Low Temperature Direct Cu-Cu Immersion Bonding for 3D Integration
Rahul Agarwal
Wouter Ruythooren
Articles 01 June 2009 Article: 602
Stress Gradients Observed in Cu Thin Films Induced by Capping Layers
Conal E. Murray
Paul R. Besser
Jean L. Jordan-Sweet
Articles 01 June 2009 Article: 504
Electronic Transport Properties of Cu/MnO_x/SiO₂/p-Si MOS Devices
V. K. Dixit
K. Neishi
J. Koike
Articles 13 July 2009 Article: 411
Adhesion and Cu Diffusion Barrier Properties of a MnO_x Barrier Layer Formed with Thermal MOCVD
K. Neishi
V. K. Dixit
S. Hosaka
Articles 13 July 2009 Article: 410
Rutherford Backscattering Spectrometry Analysis of Growth Rate and Activation Energy for Self-formed Ti-rich Interface Layers in Cu(Ti)/Low-k Samples
Kazuyuki Kohama
Kazuhiro Ito
Masanori Murakami
Articles 10 June 2009 Article: 409
Electroless Cu Deposition on Self-assembled Monolayer Alternative Barriers
S. Armini
A. Maestre Caro
Articles 13 July 2009 Article: 408
Coupled Finite Element–Potts Model Simulations of Grain Growth in Copper Interconnects
Bala Radhakrishnan
Gorti Sarma
Articles 13 July 2009 Article: 404
Atomic Layer Deposition of Ruthenium Films on Hydrogen terminated Silicon
S. K. Park
K. Roodenko
N. Boag
Articles 13 July 2009 Article: 402
A Study of Diffusion Barrier Characteristics of Electroless Co(W,P) Layers to Lead-free SnAgCu Solder
Hung-Chun Pan
Tsung-Eong Hsieh
Articles 13 July 2009 Article: 307
Electrical and structural properties of ultrathin polycrystalline and epitaxial TiN films grown by reactive dc magnetron sputtering
F. Magnus
A. S. Ingason
J. T. Gudmundsson
Articles 10 June 2009 Article: 305
Effects of Silica Sources on Nanoporous Organosilicate Films Templated with Tetraalkylammonium Cations
Salvador Eslava
Jone Urrutia
Johan A. Martens
Articles 13 July 2009 Article: 301
Application of UV Irradiation in Removal of Post-etch 193 nm Photoresist
Q. T. Le
E. Kesters
G. Vereecke
Articles 18 May 2009 Article: 209
Optimization of low-k UV Curing: Effect of Wavelength on Critical Properties of the Dielectrics
German Aksenov
D. De Roest
M. R. Baklanov
Articles 10 June 2009 Article: 208
Effects of Polymer Material Variations On High Frequency Dielectric Properties
Gregory T. Pawlikowski
Articles 11 August 2009 Article: 205
Characterization of Plasma Damage in Low-k Films by TVS Measurements
Ivan Ciofi
Mikhail R. Baklanov
Gerald P. Beyer
Articles 11 August 2009 Article: 108
Interaction of O and H Atoms with low-k SiOCH films pretreated in He plasma
O. V. Braginsky
A. S. Kovalev
M. R. Baklanov
Articles 13 July 2009 Article: 106
Dual Damascene Reactive Ion Etch Polymer Characterization through X-Ray Photoelectron Spectroscopy for 65 nm and 45nm Technology Nodes
Samuel S. Choi
Chet Dziobkowski
Leo Tai
Articles 13 July 2009 Article: 105
Effect Of Trapping On Dielectric Conduction Mechanisms Of ULK/Cu Interconnects
V. Verrière
C. Guedj
A. Sylvestre
Articles 13 July 2009 Article: 104

Volume 1156, Issue 1

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