Electromigration Reliability in Nanoscale Cu Interconnects C.-K. HuL. M. GignacP. L. Flaitz OriginalPaper 10 April 2008 Article: 502
Crystallization of yttrium-iron garnet (YIG) in thin films: Nucleation and growth aspects Michael V. ZaezjevManda Chandra SekharRoberto Morandotti OriginalPaper 12 March 2008 Article: 419
ALD of Lanthanum Aluminate Using Lanthanum Formamidinate Precursor Huazhi LiDeodatta Vinayak ShenaiJiyoung Kim OriginalPaper 29 July 2008 Article: 418
A Unique Method of Forming GexSi1-x Thin-Films on Insulator Khalid HossainO. W. HollandF. D. McDaniel OriginalPaper 20 May 2008 Article: 417
Low Temperature Silicon Nitride Films Deposited on 3D Topography by Hot Wire Chemical Vapor Deposition (HWCVD) Stephan WarnatMarkus HoeferPeter Lange OriginalPaper 05 April 2008 Article: 301
Effects of Nanometer-Scale Surface Roughness and Applied Load on the Bond Strength and Contact Resistance of Cu-Cu Bonded 3D ICs Hoi Liong LeongChee Lip GanHongyu Li OriginalPaper 10 April 2008 Article: 205
