An economical vision-based method to obtain whole-field deformation profiles T. ChuA. MahajanC. T. Liu Techniques 27 December 2017 Pages: 25 - 28
Influences of material source, wafer process and location on silicon die fracture strength D. S. LiuY. S. ShihM. L. Huang Techniques 27 December 2017 Pages: 29 - 35
Deformation analysis of a modular connection system by digital image correlation C. De RooverJ. VantommeL. Taerwe Techniques 27 December 2017 Pages: 37 - 40
Dynamic crush tests using a “free-flight” drop tower: practical aspects N. L. JohnsonA. L. Browne Feature 27 December 2017 Pages: 47 - 49
Stiffness measurement of the external polymeric coating on an optical fiber N. G. OlsonC. LeungX. Wang Feature 27 December 2017 Pages: 51 - 56